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11. 发明授权

US6084310A Semiconductor device, lead frame, and lead bonding 失效
标题翻译：半导体器件，引线框架和引线接合
公开(公告)号：US6084310A
公开(公告)日：2000-07-04
申请号：US63055
申请日：1998-04-21
申请人： Hideki Mizuno , Mitsunori Kanemoto
发明人： Hideki Mizuno , Mitsunori Kanemoto
IPC分类号： H01L21/60 , H01L21/56 , H01L23/495 , H01L23/50 , H01L23/48
CPC分类号： H01L23/49562 , H01L21/565 , H01L2224/16245 , H01L2224/45144 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079
摘要： In a semiconductor device, each of a plurality of leads has a chip mounting portion electrically connected to the semiconductor chip through a bump and a lead main body supporting the chip mounting portion. A lead path from the distal end of the lead main body to the bump is bent in X, Y, and Z directions so that the distal end portion of the lead main body and the chip mounting portion are arranged on different levels when viewed from a side surface. The lead main body and the chip mounting portion substantially make a right angle to form an L shape when viewed from an upper side. The semiconductor chip is connected, through bumps, to upper surfaces of distal end portions of the chip mounting portions of the leads on a plane. A molded body seals constituent elements except a part separated from a connection portion between the lead main body and the chip mounting portion, and incorporates a bent portion of the lead main body. Each lead is arranged such that the chip mounting portions are arranged on both sides of a centerline of the semiconductor device in a longitudinal direction to be parallel to the centerline. The L-shaped leads are arranged on one side such that the chip mounting portions oppose each other on a plane. A lead frame and lead bonding are also disclosed.
摘要翻译：在半导体器件中，多个引线中的每一个具有通过凸块电连接到半导体芯片的芯片安装部分和支撑芯片安装部分的引线主体。从引线主体的远端到凸块的引导路径在X，Y和Z方向上弯曲，使得当从主体的主体和芯片安装部分的前端部分侧面。当从上侧观察时，引线主体和芯片安装部分基本上成直角形成L形。半导体芯片通过凸块连接到平面上引线的芯片安装部分的远端部分的上表面。成型体密封构成元件，除了与引线主体和芯片安装部分之间的连接部分分离的部分，并且包括引线主体的弯曲部分。每个引线被布置成使得芯片安装部分在纵向方向上布置在半导体器件的中心线的两侧以平行于中心线。 L形引线布置在一侧，使得芯片安装部分在平面上彼此相对。还公开了引线框架和引线接合。

12. 发明授权

US6077757A Method of forming chip semiconductor devices 失效
标题翻译：形成芯片半导体器件的方法
公开(公告)号：US6077757A
公开(公告)日：2000-06-20
申请号：US20789
申请日：1998-02-09
申请人： Hideki Mizuno , Kazunao Tokunaga
发明人： Hideki Mizuno , Kazunao Tokunaga
IPC分类号： H01L21/56 , H01L21/60 , H01L23/31 , H01L21/46
CPC分类号： H01L21/56 , H01L23/3107 , H01L24/11 , H01L24/97 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10329 , H01L2924/19043
摘要： A method of fabricating a chip semiconductor device includes steps in which electrically conductive bumps are provided on electrodes of semiconductor elements on a wafer, an insulating substrate having an electrode pattern is combined onto the wafer so that the electrode pattern is made into contact with the bumps, only the wafer on which the semiconductor elements are provided is divided by grooves into a plurality of chips each of which has a semiconductor element, a liquid resin is flowed into the grooves and onto the chips for subsequent curing the resin, and the cured resin and the insulating substrate are concurrently cut along the grooves so that a plurality of semiconductor devices are formed.
摘要翻译：制造芯片半导体器件的方法包括以下步骤：在晶片上的半导体元件的电极上设置导电凸块，将具有电极图案的绝缘衬底组合到晶片上，使得电极图案与凸块接触只有其上设置有半导体元件的晶片被槽划分成多个芯片，每个芯片具有半导体元件，液体树脂流入沟槽和芯片上以便随后固化树脂，并且固化树脂并且沿着沟槽同时切割绝缘基板，从而形成多个半导体器件。

13. 发明授权

US07905516B2 Airbag module with integrated gas generation 有权
标题翻译：安全气囊模块，集气体发生
公开(公告)号：US07905516B2
公开(公告)日：2011-03-15
申请号：US11802101
申请日：2007-05-18
申请人： William E. Bostick , James P. Karlow , Dave McCormick , Barney Bauer , Henk B. Helleman , Simin Zeng , Daqing Zhang , Hideki Mizuno
发明人： William E. Bostick , James P. Karlow , Dave McCormick , Barney Bauer , Henk B. Helleman , Simin Zeng , Daqing Zhang , Hideki Mizuno
IPC分类号： B60R21/26
CPC分类号： B60R21/26 , B60R21/217
摘要： An airbag module integrates the components required for gas generation, thereby eliminating the need for a separate inflation component. The airbag module can comprise a cover with a pocket, a gas generant container, an inflatable cushion an upper and lower retainer housing, and an inflation gas generation system in fluid communication with the cushion. The airbag module does not comprise a discrete inflator that is functional outside the assembled airbag module. The gas generant container houses a package of solid gas generating compound. The energetic materials of the propellant do not become functional as a gas generation source until the cover is secured to the lower retainer housing.
摘要翻译：安全气囊模块集成了气体产生所需的组件，从而不需要单独的充气部件。气囊模块可以包括具有口袋的盖，气体发生器容器，可膨胀衬垫，上部和下部保持器壳体，以及与衬垫流体连通的充气气体产生系统。气囊模块不包括在组装的气囊模块外部起作用的离散式充气机。气体发生器容器容纳一整套固体气体发生剂。推进剂的高能材料在将盖固定到下保持器壳体之前，不会作为气体发生源起作用。

14. 发明申请

US20050101137A1 Plasma etching method 有权
标题翻译：等离子蚀刻法
公开(公告)号：US20050101137A1
公开(公告)日：2005-05-12
申请号：US10935103
申请日：2004-09-08
申请人： Kazuya Kato , Katsuhiko Ono , Hideki Mizuno , Masahiro Ogasawara , Akinori Kitamura , Noriyuki Kobayashi , Yasushi Inata , Shin Okamoto
发明人： Kazuya Kato , Katsuhiko Ono , Hideki Mizuno , Masahiro Ogasawara , Akinori Kitamura , Noriyuki Kobayashi , Yasushi Inata , Shin Okamoto
IPC分类号： H01L21/28 , H01L21/3065 , H01L21/311 , H01L21/768 , H01L21/302 , H01L21/461
CPC分类号： H01J37/32082 , H01L21/31116 , H01L21/31138
摘要： A plasma etching is performed on a substrate having a pattern wherein an interval between neighboring openings formed on a resist mask is equal to or less than 200 nm, wherein the etching is performed by converting a processing gas comprising an active species generating gas which includes a compound having carbon and fluorine, and a nonreactive gas which includes xenon gas into a plasma. The nonreactive gas further includes argon gas.
摘要翻译：在具有图案的基板上进行等离子体蚀刻，其中形成在抗蚀剂掩模上的相邻开口之间的间隔等于或小于200nm，其中通过将包括活性物质产生气体的处理气体转化为包括具有碳和氟的化合物，以及包含氙气进入等离子体的非反应性气体。非反应性气体还包括氩气。

15. 发明授权

US06834885B2 Inflator 失效
标题翻译：气筒
公开(公告)号：US06834885B2
公开(公告)日：2004-12-28
申请号：US10041763
申请日：2002-01-10
申请人： Hideki Mizuno , Kanji Yano
发明人： Hideki Mizuno , Kanji Yano
IPC分类号： B60R2126
CPC分类号： B60R21/268 , B60R21/26
摘要： An inflator includes a bottle for storing a high pressure gas having an opening, a sealing plate attached to the bottle for sealing the opening, a housing having a curved air passage therein and being arranged such that an end faces the sealing plate, an initiator for generating an air blast disposed to communicate with the air passage, and a piston provided inside the housing to communicate with the curved air passage. Upon actuation of the initiator, the piston is urged toward the sealing plate by the air blast to rupture the same to allow the high pressure gas to linearly eject from the bottle.
摘要翻译：一种充气机包括一个用于存储具有开口的高压气体的瓶子，一个连接在瓶子上用于密封开口的密封板，一个在其中具有弯曲空气通道的壳体，其端面面向密封板，产生设置成与所述空气通道连通的鼓风，以及设置在所述壳体内部以与所述弯曲空气通道连通的活塞。在启动器的启动时，活塞被鼓风吹向密封板，以使其破裂，从而允许高压气体从瓶子线性地弹出。

16. 发明授权

US06805376B2 Inflator with shock wave generator 有权
标题翻译：充气机与冲击波发生器
公开(公告)号：US06805376B2
公开(公告)日：2004-10-19
申请号：US10305026
申请日：2002-11-27
申请人： Hideki Mizuno
发明人： Hideki Mizuno
IPC分类号： B60R2126
CPC分类号： B60R21/268
摘要： A pressure container stores gas therein, and includes a tube facing a gas exit at one end thereof. An initiator is fitted into a rear end of the tube. A burst disk closes the gas exit and is arranged to break upon receipt of a shock wave. A closure disk closes a distal end of the tube. The tube is filled with a gas with a pressure lower than that in the container. The initiator ejects a high-pressure gas into the tube to generate a shock wave. The shock wave breaks the closure disk and propagates in the container, and then bursts the burst disk when it reaches the gas exit.
摘要翻译：压力容器在其中存储气体，并且包括在其一端面向气体出口的管。启动器安装在管的后端。爆破盘关闭气体出口并被布置成在接收到冲击波时断裂。封闭盘封闭管的远端。管中装有压力低于容器内压力的气体。引发器将高压气体喷射到管中以产生冲击波。冲击波打破封闭盘并在容器中传播，然后在爆破盘到达出口处时爆裂。

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