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11. 发明申请

US20070287280A1 Composition for removing a photoresist and method of forming a bump electrode 审中-公开
标题翻译：用于除去光致抗蚀剂的组合物和形成凸块电极的方法
公开(公告)号：US20070287280A1
公开(公告)日：2007-12-13
申请号：US11808584
申请日：2007-06-12
申请人： Dong-Min Kang , Young-Sam Lim , Gi-Jung Kim , Young-Nam Kim , Yun-Deok Kang , Ji-Sung Lee , Ki-Hyeon Kim , Kyoung-Jin Choi
发明人： Dong-Min Kang , Young-Sam Lim , Gi-Jung Kim , Young-Nam Kim , Yun-Deok Kang , Ji-Sung Lee , Ki-Hyeon Kim , Kyoung-Jin Choi
IPC分类号： H01L21/44
CPC分类号： H01L21/31133 , G03F7/425 , H01L24/11 , H01L24/12 , H01L2224/03912 , H01L2224/0401 , H01L2224/1147 , H01L2224/11472 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01022 , H01L2924/01027 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041
摘要： A composition for removing a photoresist and a method of forming a bump electrode using the composition are provided. The composition includes an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water. The method of forming the bump electrode includes forming a conductive pattern on a substrate, forming a passivation layer on the substrate, the passivation layer having a first opening that partially exposes the conductive pattern, forming a photoresist pattern on the passivation layer, the photoresist pattern having a second opening that exposes the first opening forming a bump electrode that fills the first opening and the second opening, and removing the photoresist pattern from the substrate using a composition including an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water.
摘要翻译：提供了用于除去光致抗蚀剂的组合物和使用该组合物形成凸块电极的方法。该组合物包括具有羟基的胺化合物，具有杂原子的极性有机溶剂，烷基氢氧化铵和水。形成凸起电极的方法包括在衬底上形成导电图案，在衬底上形成钝化层，钝化层具有部分地暴露导电图案的第一开口，在钝化层上形成光致抗蚀剂图案，光致抗蚀剂图案具有露出第一开口的第二开口，其形成充满第一开口和第二开口的凸块电极，并且使用包含具有羟基的胺化合物的组合物，具有杂原子的极性有机溶剂从基板除去光致抗蚀剂图案，烷基氢氧化铵和水。

12. 发明申请

US20060216942A1 Wafer carrier for minimizing contacting area with wafers 审中-公开
标题翻译：用于最小化与晶片接触面积的晶片载体
公开(公告)号：US20060216942A1
公开(公告)日：2006-09-28
申请号：US11373425
申请日：2006-03-10
申请人： Gi-Jung Kim , Sang-Mun Chon , Young-Nam Kim , Dae-Won Kang , Young-Sam Lim
发明人： Gi-Jung Kim , Sang-Mun Chon , Young-Nam Kim , Dae-Won Kang , Young-Sam Lim
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/67313 , H01L21/67326
摘要： A wafer carrier is provided. The wafer carrier includes a storage holding member for storing a plurality of wafers and includes a plurality of open portions. The wafer carrier further includes a front fixing plate and a rear fixing plate disposed at a front and a rear end of the storage holding member, respectively. The front and rear fixing plates each face a side of at least one of the plurality of wafers. Moreover, left and right edges of the plurality of wafers stored in the storage holding member are exposed by the plurality of open portions.
摘要翻译：提供晶片载体。晶片载体包括用于存储多个晶片的存储保持构件，并且包括多个开放部分。晶片载体还包括分别设置在存储保持构件的前端和后端的前固定板和后固定板。前固定板和后固定板各自面对多个晶片中的至少一个的一侧。此外，存储在存储保持部件中的多个晶片的左右边缘被多个开口部露出。

13. 发明授权

US09035309B2 3D CMOS image sensors, sensor systems including the same 有权
标题翻译： 3D CMOS图像传感器，传感器系统包括相同
公开(公告)号：US09035309B2
公开(公告)日：2015-05-19
申请号：US12984972
申请日：2011-01-05
申请人： Young-soo Park , Won-joo Kim , Kyoo-chul Cho , Gi-jung Kim , Sam-jong Choi
发明人： Young-soo Park , Won-joo Kim , Kyoo-chul Cho , Gi-jung Kim , Sam-jong Choi
IPC分类号： H01L27/146
CPC分类号： H01L27/14629 , H01L27/14687
摘要： A three-dimensional (3D) CMOS image sensor (CIS) that sufficiently absorbs incident infrared-rays (IRs) and includes an infrared-ray (IR) receiving unit formed in a thin epitaxial film, thereby being easily manufactured using a conventional CIS process, a sensor system including the 3D CIS, and a method of manufacturing the 3D CIS, the 3D CIS including an IR receiving part absorbing IRs incident thereto by repetitive reflection to produce electron-hole pairs (EHPs); and an electrode part formed on the IR receiving part and collecting electrons produced by applying a predetermined voltage thereto.
摘要翻译：一种三维（3D）CMOS图像传感器（CIS），其足以吸收入射的红外线（IR）并且包括形成在薄的外延膜中的红外线（IR）接收单元，由此容易地使用传统的CIS工艺包括3D CIS的传感器系统和制造3D CIS的方法，3D CIS包括通过重复反射吸收入射到其中的IR的IR接收部分以产生电子 - 空穴对（EHP）; 以及形成在IR接收部上并且收集通过施加预定电压而产生的电子的电极部分。

14. 发明申请

US20110076838A1 Gettering structures and methods and their application 有权
标题翻译：吸收结构和方法及其应用
公开(公告)号：US20110076838A1
公开(公告)日：2011-03-31
申请号：US12926590
申请日：2010-11-29
申请人： Young-Soo Park , Young-Nam Kim , Young-Sam Lim , Gi-Jung Kim , Pil-Kyu Kang
发明人： Young-Soo Park , Young-Nam Kim , Young-Sam Lim , Gi-Jung Kim , Pil-Kyu Kang
IPC分类号： H01L21/322
CPC分类号： H01L21/3221 , H01L21/8221 , H01L27/0688 , H01L27/11 , H01L27/1104 , H01L27/115 , H01L27/11521 , H01L27/11524 , H01L27/11551 , H01L2924/00011 , H01L2224/80001
摘要： An embodiment of a semiconductor device includes a semiconductor substrate, a first insulating layer formed over the semiconductor substrate, and a first semiconductor layer formed over the first insulation layer. At least one gettering region is formed in at least one of the first insulating layer and the first semiconductor layer. The gettering region includes a plurality of gettering sites, and at least one gettering site includes one of a precipitate, a dispersoid, an interface with the dispersoid, a stacking fault and a dislocation.
摘要翻译：半导体器件的实施例包括半导体衬底，形成在半导体衬底上的第一绝缘层和形成在第一绝缘层上的第一半导体层。在第一绝缘层和第一半导体层中的至少一个中形成至少一个吸杂区域。吸气区域包括多个吸气部位，至少一个吸气部位包括沉淀物，分散质，与分散质的界面，堆垛层错和位错中的一个。

15. 发明授权

US07258931B2 Semiconductor wafers having asymmetric edge profiles that facilitate high yield processing by inhibiting particulate contamination 有权
标题翻译：具有不对称边缘轮廓的半导体晶片，其通过抑制颗粒污染而促进高产量处理
公开(公告)号：US07258931B2
公开(公告)日：2007-08-21
申请号：US10601475
申请日：2003-06-23
申请人： Gi-Jung Kim , Woo-Serk Kim , Sang-Mun Chon , Tae-Yeol Heo
发明人： Gi-Jung Kim , Woo-Serk Kim , Sang-Mun Chon , Tae-Yeol Heo
IPC分类号： B32B9/00 , H01L29/06
CPC分类号： H01L21/02021 , Y10T428/12674
摘要： Semiconductor wafers utilize asymmetric edge profiles (EP) to facilitate higher yield semiconductor device processing. These edge profiles are configured to reduce the volume of thin film residues that may form on a top surface of a semiconductor wafer at locations adjacent a peripheral edge thereof. These edges profiles are also configured to inhibit redeposition of residue particulates on the top surfaces of the wafers during semiconductor processing steps. Such steps may include surface cleaning and rinsing steps that may include passing a cleaning or rinsing solution across a wafer or batch of wafers that are held by a cartridge and submerged in the solution.
摘要翻译：半导体晶片利用不对称边缘轮廓（EP）来促进更高产量的半导体器件处理。这些边缘轮廓被配置为减小可能在与其周边边缘相邻的位置处在半导体晶片的顶表面上形成的薄膜残余物的体积。这些边缘轮廓也被配置为在半导体处理步骤期间抑制残余颗粒在晶片的顶表面上的再沉积。这样的步骤可以包括表面清洁和冲洗步骤，其可以包括将清洁或冲洗溶液通过由盒保持并浸没在溶液中的晶片或一批晶片。

16. 发明申请

US20050016470A1 Susceptor and deposition apparatus including the same 审中-公开
标题翻译：受体和包括其的沉积装置
公开(公告)号：US20050016470A1
公开(公告)日：2005-01-27
申请号：US10898306
申请日：2004-07-26
申请人： Tae-Soo Kang , Soo-Yeol Choi , Kyoo-Chul Cho , Gi-Jung Kim , Jin-Ho Kim , Tae-Yeol Heo
发明人： Tae-Soo Kang , Soo-Yeol Choi , Kyoo-Chul Cho , Gi-Jung Kim , Jin-Ho Kim , Tae-Yeol Heo
IPC分类号： H01L21/205 , C23C16/00 , C23C16/458 , C30B25/12 , C30B31/14
CPC分类号： C23C16/4584 , C30B25/12 , C30B31/14
摘要： A susceptor for use in a deposition apparatus includes a recess in which a wafer is received, and a stress-reducing bumper disposed along the side of the recess. The stress-reducing bumper is of material having ductility at a relatively high temperature. Therefore, when the wafer contacts the stress-reducing bumper, such as may occur due to thermal expansion of the wafer during processing, the force of the impact on the wafer is minimized by an elastic deformation of the stress-reducing bumper. As a result, defects, such as slip dislocations at the outer peripheral edge of the wafer, are prevented.
摘要翻译：用于沉积设备的感受体包括其中容纳晶片的凹部和沿着凹部的侧面设置的减小应力的保险杠。减压保险杠是在较高温度下具有延性的材料。因此，当晶片接触减压保险杠时，例如由于晶片在加工过程中的热膨胀而可能发生的，通过减小应力的保险杠的弹性变形使得对晶片的冲击力最小化。结果，防止了晶片外周边缘处的滑移位错等缺陷。

17. 发明授权

US06552337B1 Methods and systems for measuring microroughness of a substrate combining particle counter and atomic force microscope measurements 失效
标题翻译：用于测量结合粒子计数器和原子力显微镜测量的基底的微粗糙度的方法和系统
公开(公告)号：US06552337B1
公开(公告)日：2003-04-22
申请号：US09688283
申请日：2000-10-13
申请人： Kyoo-chul Cho , Tae-Yeol Heo , Jeong-hoon An , Gi-jung Kim
发明人： Kyoo-chul Cho , Tae-Yeol Heo , Jeong-hoon An , Gi-jung Kim
IPC分类号： H01J3726
CPC分类号： G01Q60/24 , G01B7/34 , G01Q30/02 , H01L22/12 , Y10S977/852
摘要： Embodiments of the present invention provide methods for measuring a wafer surface. A portion of the wafer surface is measured using a particle counter to provide first measurements corresponding to a plurality of points on the wafer surface. A selected area of the wafer surface including one of the plurality of points is measured using an atomic force microscope (AFM) to provide a microroughness measurement of the selected area. The selected area is a localized area of the portion of the wafer surface measured using the particle counter. The first measurements and the microroughness measurement are provided as a measurement of the wafer surface. The portion measured using a particle counter may, for example, be substantially the entire wafer surface.
摘要翻译：本发明的实施例提供了用于测量晶片表面的方法。使用粒子计数器测量晶片表面的一部分，以提供对应于晶片表面上的多个点的第一测量。使用原子力显微镜（AFM）测量包括多个点中的一个的晶片表面的选定区域，以提供所选区域的微粗糙度测量。所选择的区域是使用粒子计数器测量的晶片表面部分的局部区域。提供第一测量和微粗糙度测量作为晶片表面的测量。使用粒子计数器测量的部分可以例如基本上是整个晶片表面。

18. 发明申请

US20130262557A1 CITY FACILITY MANAGING SERVER AND SYSTEM 审中-公开
标题翻译：城市设施管理服务器和系统
公开(公告)号：US20130262557A1
公开(公告)日：2013-10-03
申请号：US13630088
申请日：2012-09-28
申请人： Gi Jung KIM , Ji Seong SONG , Jae Young PARK
发明人： Gi Jung KIM , Ji Seong SONG , Jae Young PARK
IPC分类号： H04L29/08
CPC分类号： H04L67/10 , H04L67/1095 , H04L67/125
摘要： Disclosed herein is a city facility managing server and system. The city facility managing server is connected to a plurality of agents, each of which manages at least one city facility according to event processing scripts. The city facility managing server includes a schedule database, a schedule register, and a scheduler. The schedule database stores schedules, each including a specific event processing script for controlling at least one specific city facility. The schedule register registers the schedules in the schedule database. The scheduler continuously reads the stored schedules, registers the schedules in an event queue, reads a schedule corresponding to a current time from the schedule event queue, and sends the read schedule to at least one corresponding agent, thereby allowing the at least one corresponding agent to control a corresponding city facility according to a corresponding event processing script.
摘要翻译：这里公开的是管理服务器和系统的城市设施。城市设施管理服务器连接到多个代理，每个代理根据事件处理脚本管理至少一个城市设施。城市设施管理服务器包括调度数据库，调度寄存器和调度程序。时间表数据库存储时间表，每个时间表包括用于控制至少一个特定城市设施的特定事件处理脚本。调度寄存器将调度表注册到调度数据库中。调度程序连续读取存储的日程表，将事件队列注册到事件队列中，从调度事件队列中读取与当前时间相对应的调度，并将读取的调度发送给至少一个对应的代理，从而允许至少一个对应的代理根据相应的事件处理脚本控制相应的城市设施。

19. 发明申请

US20130029143A1 MULTILAYER SHEET FOR MOLDING WHICH IS HIGHLY GLOSSY EVEN AFTER A MOLDING PROCESS, AND METHOD FOR PREPARING SAME 审中-公开
标题翻译：即使在模制工艺之后也是高度成型的多层薄片及其制备方法
公开(公告)号：US20130029143A1
公开(公告)日：2013-01-31
申请号：US13639159
申请日：2011-04-08
申请人： Hyung-Gon Kim , Dong-Gon Kim , Min-Ho Lee , Gi-Jung Kim
发明人： Hyung-Gon Kim , Dong-Gon Kim , Min-Ho Lee , Gi-Jung Kim
IPC分类号： B32B27/08 , B32B38/10 , B32B27/36 , B05D1/36 , B32B27/40 , B32B27/30
CPC分类号： B32B27/08 , B32B2250/24 , B32B2307/406 , B32B2307/412 , B32B2307/536 , B32B2307/584 , Y10T428/269 , Y10T428/31573 , Y10T428/31797 , Y10T428/31909
摘要： The present invention relates to a multilayer sheet for insert molding, in which a first thermosetting transparent resin layer protects the surface of the sheet, and a second thermoplastic transparent resin layer maintains moldability. The multilayer sheet may reduce gloss variation on the surface layer caused by change in surface microstructure of a base sheet in the multilayer sheet, which can occur during molding, and exhibits excellent scratch and abrasion resistance.
摘要翻译：本发明涉及用于嵌件成型的多层片材，其中第一热固性透明树脂层保护片材的表面，第二热塑性透明树脂层保持成型性。多层片材可以减少由于在成型时可能发生的多层片材中的基片的表面微观结构的变化引起的表面层的光泽变化，并且显示出优异的耐擦伤性。

20. 发明授权

US07815496B2 Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same 有权
标题翻译：化学机械抛光装置的抛光垫及其制造方法
公开(公告)号：US07815496B2
公开(公告)日：2010-10-19
申请号：US11706241
申请日：2007-02-15
申请人： Young-Sam Lim , Young-Nam Kim , Gi-Jung Kim
发明人： Young-Sam Lim , Young-Nam Kim , Gi-Jung Kim
IPC分类号： B24D11/00
CPC分类号： B24B37/24 , B24D18/0063
摘要： The surface(s) of a polishing pad for polishing an object has a first portion including hydrophilic material and a second portion including hydrophobic material. The first portion of the polishing surface is located in a first region of the polishing pad and the second portion of the polishing surface is located in a second region of the polishing pad juxtaposed with the first region in the radial direction of the pad. The hydrophilic material may be a polymer resin that contains hydrophilic functional groups having OH and/or ═O at bonding sites of the polymer. The hydrophobic material may be a polymer resin that contains hydrophobic functional groups having H and/or F at bonding sites of the polymer. The polishing pad is manufactured by extruding respective lines of the hydrophilic and hydrophobic materials. The extruders and a backing are moved relative to each other such that the lines form concentric rings of the hydrophilic and hydrophobic materials.
摘要翻译：用于抛光物体的抛光垫的表面具有包括亲水材料的第一部分和包括疏水材料的第二部分。抛光表面的第一部分位于抛光垫的第一区域中，并且抛光表面的第二部分位于抛光垫的与垫的径向方向上与第一区域并置的第二区域中。亲水材料可以是在聚合物的键合位置处含有OH和/或= O的亲水性官能团的聚合物树脂。疏水性材料可以是在聚合物的结合位置含有H和/或F的疏水官能团的聚合物树脂。抛光垫通过挤出亲水和疏水材料的相应线来制造。挤出机和背衬相对于彼此移动，使得线形成亲水和疏水材料的同心环。

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