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    • 11. 发明授权
    • Take-up pulley in an image processor
    • 拾取皮带轮在图像处理器中
    • US06220106B1
    • 2001-04-24
    • US09310392
    • 1999-05-12
    • Eiichi Hayashi
    • Eiichi Hayashi
    • F16H2702
    • H04N1/1026G03G15/04H04N1/1013Y10T74/18832Y10T74/18848
    • A take-up pulley for a carrier in an image processor has a drum-like section with a boss-like projection extending from one end. In one embodiment, a recess is formed at the other end of the drum-like section for receiving a bearing. A stopper flange is formed at the end of the drum-like section adjacent the boss-like projection. The take-up pulley can be formed by a suitable molding process such as extrusion using the mold adapted to be opened axially. The take-up pulley is fixedly mounted on the driving shaft in the housing of an image processor so that a gap G smaller than a diameter of a drive wire may be formed between the end surface of the drum-like section and an inner wall of the housing. In another embodiment, an annular stopper plate is affixed to the end of the drum section instead of the recess.
    • 用于图像处理器中的载体的卷带轮具有鼓状部分,其具有从一端延伸的凸起状突起。 在一个实施例中,在用于接收轴承的滚筒状部分的另一端处形成凹部。 在与凸起状突起相邻的滚筒状部分的端部形成止动凸缘。 卷取皮带轮可以通过合适的模制工艺形成,例如使用适合于轴向打开的模具进行挤出。 卷取滑轮固定地安装在图像处理器的壳体中的驱动轴上,使得可以在滚筒状部分的端面与滚筒状部分的内壁之间形成小于驱动线直径的间隙G 住房。 在另一个实施例中,环形止动板固定到滚筒部分的端部而不是凹部。
    • 12. 发明授权
    • Anchoring mechanism for a carrier driving wire in an image processor
    • 图像处理器中载体驱动线的锚定机构
    • US06091517A
    • 2000-07-18
    • US38617
    • 1998-03-11
    • Eiichi Hayashi
    • Eiichi Hayashi
    • G03B27/50H04N1/04H04N1/10H04N1/193
    • H04N1/1026H04N1/1013H04N1/1056H04N1/193
    • An anchoring mechanism is disclosed for anchoring a carrier driving wire in an image processor. The wire is clamped between the carrier head of a set screw threaded into the carrier and thereby operatively connect the wire to the carrier. Such improved arrangement not only reduces the number of parts but also facilitates operation of anchoring the wire on the carrier. Specifically, bottom plate sections of a first carrier extend outward from longitudinally opposite ends of a groove serving to hold an illuminating lamp. Each of these bottom plate sections is formed with a bed plate section, which has a threaded hole formed through it. Wire retainer means is provided in proximity to the threaded hole. Upon insertion of the wire in the retainer means, the wire is sufficiently curved to generate a restoring force biasing itself to be pressed against the set screw. Then, as the set screw is threaded into the threaded hole the wire is clamped between the head of the set screw and the bed plate section. The wire is positioned relative to the set screw so that the clamping force of the set screw may generate a reaction force tending to move the first carrier back to its initial position.
    • 公开了用于将载体驱动线锚定在图像处理器中的锚定机构。 电线被夹紧在拧入载体中的固定螺钉的承载头之间,从而将电线可操作地连接到载体上。 这种改进的布置不仅减少了部件的数量,而且还有助于将导线锚定在载体上的操作。 具体地说,第一载体的底板部从用于保持照明灯的槽的纵向相对端向外延伸。 这些底板部分中的每一个形成有床板部分,其具有穿过其形成的螺纹孔。 电线固定装置设置在螺纹孔附近。 在将线插入保持器装置中时,线足够弯曲以产生自身偏压以抵抗固定螺钉的恢复力。 然后,当固定螺丝拧入螺纹孔时,线夹在固定螺钉的头部和床板部分之间。 线相对于固定螺钉定位,使得固定螺钉的夹紧力可产生趋向于将第一载体移回其初始位置的反作用力。
    • 16. 发明申请
    • INJECTION MOLD, OPTICAL COMPONENT, OPTICAL SCANNING DEVICE, AND IMAGE FORMING APPARATUS
    • 注射模具,光学部件,光学扫描装置和图像形成装置
    • US20140253995A1
    • 2014-09-11
    • US14188788
    • 2014-02-25
    • Takamichi OHHASHIEiichi HAYASHIYusuke OHTA
    • Takamichi OHHASHIEiichi HAYASHIYusuke OHTA
    • G02B26/12B29C45/00B29C45/26G02B13/00
    • G02B26/125B29C45/0025B29C45/37B29L2011/00G02B13/0005
    • There is provided an injection mold for molding an optical component including an optical surface, a non-optical surface separated from the optical surface, and a rib provided to an edge portion of the optical surface, and longer in a direction parallel to the optical surface than in a direction perpendicular to the optical surface. The mold includes a transfer piece including a transfer surface that molds the optical surface and a movable cavity piece including a non-transfer surface that molds at least a portion of the non-optical surface. The transfer surface and the non-transfer surface define a cavity to be filled with resin. The movable cavity piece is moved away from the resin during a process of cooling the resin. At least a portion of the non-transfer surface is located closer to the rib than a boundary between the transfer surface and the rib.
    • 提供了一种用于模制光学部件的注射模具,该注射模具包括光学表面,与光学表面分离的非光学表面,以及设置在光学表面的边缘部分上的肋条,并且在平行于光学表面的方向上较长 而不是垂直于光学表面的方向。 该模具包括一个转印件,该转印件包括模制该光学表面的转印表面和一个包括非转印表面的可移动的空腔件,该非转印表面模制非光学表面的至少一部分。 转印表面和非转印表面限定了用树脂填充的空腔。 在冷却树脂的过程中,可移动的空腔件离开树脂。 非转移表面的至少一部分位于比转印表面和肋之间的边界更靠近肋的位置。
    • 20. 发明申请
    • PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
    • 生产多层印刷线路板的工艺
    • US20100206471A1
    • 2010-08-19
    • US12721891
    • 2010-03-11
    • Shigeo NakamuraSeiichiro OhashiEiichi HayashiTadahiko Yokota
    • Shigeo NakamuraSeiichiro OhashiEiichi HayashiTadahiko Yokota
    • B32B38/10
    • H05K3/4673B32B37/025B32B38/0004B32B2038/0076B32B2305/076B32B2309/02B32B2309/105B32B2309/12B32B2309/68B32B2311/00B32B2457/08H05K3/4644H05K2203/0228H05K2203/066H05K2203/085Y10T29/49155Y10T156/1052Y10T156/1054
    • A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.
    • 一种包含以下步骤(1) - (5)的多层印刷线路板的制造方法:(1)临时配合准备步骤,包括从粘合片辊输送粘合片,其中,将具有预浸渍体的粘合片形成在 将支撑膜缠绕在卷筒中并放置粘合片,使得预浸料表面接触电路板的一个或两个表面,(2)临时安装步骤,用于将粘合片临时装配到电路板,包括部分 通过从支撑膜侧加热和压制粘合片的一部分,将粘合片粘合到电路板上,并用切割机根据电路板的尺寸切割粘合片,(3)层压步骤,包括加热和 在减压下按压临时贴合的粘合片以将粘合片层合在电路板上,(4)热固化步骤,包括通过热固化该制备形成绝缘层 (5)包括在热固化步骤之后分离支撑膜的分离步骤,能够连续制备具有预浸料的多层印刷线路板的绝缘层,而不使用单个晶片。