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    • 14. 发明申请
    • Method of Optimizing Design for Manufacturing (DFM)
    • 优化制造设计的方法(DFM)
    • US20140033159A1
    • 2014-01-30
    • US13559081
    • 2012-07-26
    • Keuing HuiYen-Wei ChengYen-Di TsenJong-I MouChin-Hsiang Lin
    • Keuing HuiYen-Wei ChengYen-Di TsenJong-I MouChin-Hsiang Lin
    • G06F17/50
    • G06F17/5068G06F2217/12Y02P90/265
    • The present disclosure describes a method of optimizing a design for manufacture (DFM) simulation. The method includes receiving an integrated circuit (IC) design data having a feature, receiving a process data having a parameter or a plurality of parameters, performing the DFM simulation, and optimizing the DFM simulation. The performing the DFM simulation includes generating a simulation output data using the IC design data and the process data. The optimizing the DFM simulation includes generating a performance index of the parameter or the plurality of parameters by the DFM simulation. The optimizing the DFM simulation includes adjusting the parameter or the plurality of parameters at outer loop, middle loop, and the inner loop. The optimizing the DFM simulation also includes locating a nadir of the performance index of the parameter or the plurality of parameters over a range of the parameter or the plurality of parameters.
    • 本公开描述了优化用于制造(DFM)仿真的设计的方法。 该方法包括接收具有特征的集成电路(IC)设计数据,接收具有参数或多个参数的处理数据,执行DFM仿真和优化DFM仿真。 执行DFM模拟包括使用IC设计数据和过程数据生成模拟输出数据。 优化DFM模拟包括通过DFM仿真生成参数或多个参数的性能指标。 优化DFM模拟包括调整外循环,中间循环和内循环的参数或多个参数。 优化DFM模拟还包括在参数或多个参数的范围内定位参数或多个参数的性能指标的最低点。
    • 16. 发明申请
    • LOADPORT BRIDGE FOR SEMICONDUCTOR FABRICATION TOOLS
    • 半导体制造工具的负载桥
    • US20130322990A1
    • 2013-12-05
    • US13486024
    • 2012-06-01
    • Shih-Hung CHENYing XIAOChin-Hsiang LIN
    • Shih-Hung CHENYing XIAOChin-Hsiang LIN
    • H01L21/677
    • H01L21/6773H01L21/67733H01L21/67775
    • A wafer handling system with apparatus for transporting wafers between semiconductor fabrication tools. In one embodiment, the apparatus is a loadport bridge mechanism including an enclosure having first and second mounting ends, a docking port at each end configured and dimensioned to interface with a loadport of a semiconductor tool, and at least one wafer transport robot operable to transport a wafer between the docking ports. The wafer transport robot hands off or receives a wafer to/from a tool robot at the loadports of a first and second tool. The bridge mechanism allows one or more wafers to be transferred between loadports of different tools on an individual basis without reliance on the FAB's automated material handling system (AMHS) for bulk wafer transport inside a wafer carrier such as a FOUP or others.
    • 一种具有用于在半导体制造工具之间传输晶片的装置的晶片处理系统。 在一个实施例中,该装置是装载端口机构,其包括具有第一和第二安装端的外壳,每个端部处的对接端口被构造和尺寸设计成与半导体工具的承载端口相接合,以及至少一个可运输的晶片传送机械手 在对接端口之间的晶片。 晶片传送机器人在第一和第二工具的载荷端口移动或接收来自工具机器人的晶片。 桥接机构允许一个或多个晶片在不同工具的载荷端口之间单独传输,而不依赖于FAB的自动化材料处理系统(AMHS),用于在诸如FOUP或其它晶片载体之间的体晶片传输。
    • 18. 发明申请
    • Litho Cluster and Modulization to Enhance Productivity
    • Litho集群和模块化以提高生产力
    • US20130252175A1
    • 2013-09-26
    • US13429921
    • 2012-03-26
    • I-Hsiung HuangHeng-Hsin LiuHeng-Jen LeeChin-Hsiang Lin
    • I-Hsiung HuangHeng-Hsin LiuHeng-Jen LeeChin-Hsiang Lin
    • G03F7/20H01L21/00
    • G03F7/30G03F7/16G03F7/70991H01L21/67225H01L21/67745
    • The present disclosure relates to a lithographic tool arrangement for semiconductor workpiece processing. The lithographic tool arrangement groups lithographic tools into clusters, and selectively transfers a semiconductor workpiece between a plurality of lithographic tools of a first type in a first cluster to a plurality of lithographic tools of a second type in a second cluster. The selective transfer is achieved though a transfer assembly, which is coupled to a defect scan tool that identifies defects generated in the lithographic tool of the first type. The disclosed lithographic tool arrangement also utilizes shared structural elements such as a housing assembly, and shared functional elements such as gases and chemicals. The lithographic tool arrangement may consist of baking, coating, exposure, and development units configured to provide a modularization of these various components in order to optimize throughput and efficiency for a given lithographic fabrication process.
    • 本公开涉及一种用于半导体工件加工的平版印刷工具装置。 光刻工具装置将光刻工具组合成簇,并且将半导体工件在第一簇中的第一类型的多个光刻工具之间选择性地传输到第二簇中的第二类型的光刻工具。 通过转移组件实现选择性转移,转移组件耦合到识别第一类型的光刻工具中产生的缺陷的缺陷扫描工具。 所公开的平版印刷工具装置还利用共同的结构元件,例如壳体组件和诸如气体和化学品的共享功能元件。 光刻工具装置可以包括被配置成提供这些各种部件的模块化的烘烤,涂覆,曝光和显影单元,以便为给定的光刻制造工艺优化产量和效率。
    • 20. 发明申请
    • AUTOMATED MATERIAL HANDLING SYSTEM AND METHOD FOR SEMICONDUCTOR MANUFACTURING
    • 自动化材料处理系统及半导体制造方法
    • US20130230375A1
    • 2013-09-05
    • US13409540
    • 2012-03-01
    • Chi-Feng TUNGMao-Lin KaoHsiang-Yin ShenChin-Hsiang Lin
    • Chi-Feng TUNGMao-Lin KaoHsiang-Yin ShenChin-Hsiang Lin
    • B66F11/00
    • H01L21/67706H01L21/67727H01L21/6773H01L21/67733
    • A rail transport system and method for a semiconductor fabrication facility (FAB). In one embodiment, the system includes a network of stationary rails and a wheeled vehicle movable on the rails via rolling movement. The vehicle is operable to hold a wafer carrier that stores a plurality of wafers. A cross-floor transport system is provided that may include a vehicle lifter positioned near the network of rails that extends between a first elevation and a second elevation in the FAB. The lifter is configured and operable to receive the vehicle from rails at the first elevation and vertically transport the vehicle to rails at the second elevation without removing the wafer carrier from the wheeled vehicle. In one embodiment, the lifter is configured so that the vehicle may be rolled directly onto and off of the lifter for vertical transport.
    • 一种用于半导体制造设备(FAB)的轨道运输系统和方法。 在一个实施例中,该系统包括固定轨道网络和通过滚动运动可在轨道上移动的轮式车辆。 车辆可操作地保持存储多个晶片的晶片载体。 提供了一种十字架传送系统,其可以包括定位在轨道网络附近的车辆升降机,其在FAB中在第一高度和第二高度之间延伸。 提升器被构造和操作以在第一高度处从轨道接收车辆,并且在第二高度处将车辆垂直地运输到轨道,而不从轮式车辆移除晶片载体。 在一个实施例中,升降机被构造成使得车辆可以直接滚动到升降机上并且用于垂直运输。