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    • 18. 发明申请
    • Method for fabricating thin film transistor
    • 制造薄膜晶体管的方法
    • US20060046357A1
    • 2006-03-02
    • US11011585
    • 2004-12-15
    • Sang-Woong LeeJae-Young OhTae-Hoon YangJin-Wook SeoKi-Yong LeeCheol-Ho Yu
    • Sang-Woong LeeJae-Young OhTae-Hoon YangJin-Wook SeoKi-Yong LeeCheol-Ho Yu
    • H01L21/84H01L21/00
    • H01L21/02672H01L21/02532H01L21/02595H01L21/2022H01L27/1277H01L29/04H01L29/66757H01L29/78675
    • The present invention relates to a method for fabricating thin film transistor, more particularly, to a method for fabricating thin film transistor which not only manufactures a polycrystalline silicon layer having large grain size and containing a trace of residual metal catalyst by heat treating thereby crystallizing the metal catalyst layer after forming an amorphous silicon layer on a substrate, forming a capping layer formed of nitride film having 1.78 to 1.90 of the refraction index when crystallizing the amorphous silicon layer and forming a metal catalyst layer on the capping layer, but also controls characteristics of the polycrystalline silicon layer by controlling the refraction index of the capping layer. The present invention provides a method for fabricating thin film transistor comprising the steps of preparing an insulation substrate; forming an amorphous silicon layer on the substrate; forming a capping layer having 1.78 to 1.90 of the refraction index on the amorphous silicon layer; forming a metal catalyst layer on the capping layer; and crystallizing the amorphous silicon layer into a polycrystalline silicon layer by heat treating the substrate. Therefore, a method for fabricating thin film transistor fabricates a thin film transistor which has superior characteristics and is capable of controlling the characteristics by controlling the refraction index of capping layer formed of nitride film to 1.78 to 1.90 when performing crystallization by super grain silicon crystallization method, thereby obtaining a semiconductor layer having a large grain size so that electron mobility is increased, and an amount of metal catalyst remained is decreased to lower leakage current, and controlling grain size of polycrystalline silicon layer by the refraction index of the capping layer so that a polycrystalline silicon layer having desired size and uniformity is obtained.
    • 本发明涉及一种制造薄膜晶体管的方法,更具体地说,涉及制造薄膜晶体管的方法,该方法不仅通过热处理制造具有大晶粒尺寸并且含有微量残余金属催化剂的多晶硅层,从而使 在基板上形成非晶硅层之后,形成由氮化物膜形成的覆盖层,所述覆盖层在结晶非晶硅层时具有1.78〜1.90的折射率,并且在封盖层上形成金属催化剂层,而且还控制特性 的多晶硅层,通过控制覆盖层的折射率。 本发明提供一种制造薄膜晶体管的方法,包括以下步骤:制备绝缘衬底; 在所述基板上形成非晶硅层; 形成在非晶硅层上具有1.78至1.90折射率的覆盖层; 在覆盖层上形成金属催化剂层; 以及通过对所述衬底进行热处理将所述非晶硅层结晶成多晶硅层。 因此,制造薄膜晶体管的方法制造薄膜晶体管,其具有优异的特性,并且能够通过将由氮化物膜形成的覆盖层的折射率控制在通过超晶硅结晶法进行结晶时为1.78〜1.90的特性 从而获得具有大晶粒尺寸的电子迁移率增加的半导体层,并且减少金属催化剂的剩余量以降低泄漏电流,并且通过覆盖层的折射率控制多晶硅层的晶粒尺寸,使得 得到所需尺寸和均匀性的多晶硅层。