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    • 11. 发明授权
    • Magnetic head/silicon chip integration method
    • 磁头/硅芯片集成方法
    • US5867888A
    • 1999-02-09
    • US728289
    • 1996-10-08
    • Steven H. VoldmanAlbert J. Wallash
    • Steven H. VoldmanAlbert J. Wallash
    • B81B7/00G11B5/11G11B5/31G11B5/40G11B5/60H01L21/28H01L21/301H01L21/304H01L21/48
    • G11B5/40G11B5/11G11B5/3133G11B5/3163G11B5/3169G11B5/3173G11B5/6005Y10T29/49041
    • A method of integrating slider/head assemblies with silicon chips. The method facilitates the integration of silicon chips containing desirable circuits such as electrostatic discharge protection with slider/head designs such that the slider/head design may be selected independently of the type of silicon chip as long as compatible dimensions are used for each. First a bar of N slider/head assemblies is formed. A bar of N silicon chips is formed and then coupled to the bar of N slider/head assemblies to form an integrated bar of N slider/head/silicon chip units. Leads between the silicon chips and the slider/head assemblies are established. Finally, the integrated bar of N slider/head/silicon chip units is diced into N individual slider/head/silicon chip units. The method also includes the step of lapping the bar of N slider/head assemblies to form magnetic head air bearing surfaces and machining the bar of N slider/head assemblies to decrease the weight of the N slider/head assemblies.
    • 滑块/磁头组件与硅芯片集成的方法。 该方法有助于将包含所需电路(例如,静电放电保护)与滑块/磁头设计的硅芯片的集成,使得滑块/磁头设计可以独立于硅芯片的类型进行选择,只要使用兼容的尺寸即可。 首先形成一个N个滑块/头组件。 形成一块N个硅芯片,然后连接到N个滑动器/头部组件的杆,以形成N个滑块/头/硅芯片单元的集成棒。 硅芯片和滑块/头组件之间的引线被建立。 最后,N个滑块/头/硅芯片单元的集成棒切成N个单独的滑块/头/硅芯片单元。 该方法还包括研磨N滑块/头部组件的杆以形成磁头空气轴承表面并加工N个滑动器/头部组件的杆以减小N个滑块/头部组件的重量的步骤。
    • 12. 发明授权
    • Method and apparatus for providing electrostatic discharge protection
for an inductive coil of a magnetic transducer
    • 用于为磁换能器的感应线圈提供静电放电保护的方法和装置
    • US5777829A
    • 1998-07-07
    • US728297
    • 1996-10-08
    • Steven H. VoldmanAlbert J. Wallash
    • Steven H. VoldmanAlbert J. Wallash
    • G11B5/17G11B5/31G11B5/40G11B5/10
    • G11B5/40G11B5/3103G11B5/314G11B5/17G11B5/3143
    • Electrostatic discharge protection for an inductive coil in a magnetic head of a disk drive. Structures are provided to dissipate electrostatic charges which may arise between the leads of the inductive coil or between the inductive coil and one of the pole pieces in a magnetic head. An electrostatic discharge element is coupled to the inductive coil for dissipating electrostatic charge from the inductive coil. The electrostatic discharge element may include a spark gap, a diode circuit, a MOSFET, a silicon controlled rectifier or a bleed transistor circuit. The electrostatic discharge element may include a first electrostatic discharge element coupled between the first turn of the inductive coil and the magnetic yoke and a second electrostatic discharge element coupled between the magnetic yoke and the last turn of the inductive coil. The magnetic yoke or pole piece may include an upper and a lower magnetic pole with mirrored protection circuits provided for each pole.
    • 用于磁盘驱动器磁头中的感应线圈的静电放电保护。 提供结构以消散可能在感应线圈的引线之间或感应线圈与磁头中的一个极片之间产生的静电电荷。 静电放电元件耦合到感应线圈,以从感应线圈消散静电电荷。 静电放电元件可以包括火花隙,二极管电路,MOSFET,可控硅整流器或放电晶体管电路。 静电放电元件可以包括耦合在感应线圈的第一匝和磁轭之间的第一静电放电元件和耦合在磁轭和感应线圈的最后匝之间的第二静电放电元件。 磁轭或极片可以包括上磁极和下磁极,每个磁极设有镜像保护电路。
    • 13. 发明授权
    • Method for active cancellation of write-to-read crosstalk
    • 主动取消写入到串扰的方法
    • US07595949B1
    • 2009-09-29
    • US11001730
    • 2004-12-02
    • Albert J. WallashFerruh GocemenJason Wolfson
    • Albert J. WallashFerruh GocemenJason Wolfson
    • G11B5/09
    • G11B5/40G11B5/115G11B5/3967G11B20/10009G11B2220/2516
    • A method for preventing electrical overstress from interfering with a magnetic read-write device by identifying one or more characteristic functions of the device that characterize electrical overstress, generating a wave form representative of the electrical overstress by using the one or more characteristic functions and enabling the generated wave form to be combined with a read signal to counteract the electrical overstress. The method can be implemented with a crosstalk cancellation circuit that includes a coupler filter configured to receive signals from the write driver, a differentiator to differentiate the signal, a gain adjust coupled to the coupler filter configured to adjust gain on the received signal, a phase adjust configured to adjust the phase to match the crosstalk, and an inverter coupled to invert the matched signal to enable cancellation of the crosstalk. The cancellation circuit can include two components, a first component that addresses common mode crosstalk and a second component that addresses differential mode crosstalk. The combination is added and inverted to enable cancellation of crosstalk in read components of a device.
    • 一种用于通过识别表征电过应力的装置的一个或多个特征功能来防止电过应力干扰磁读写装置的方法,通过使用一个或多个特征功能产生表示电过载的波形,并使能 产生的波形与读信号相结合以抵消电应力。 该方法可以用串扰消除电路实现,该串扰消除电路包括被配置为从写入驱动器接收信号的耦合器滤波器,用于区分信号的微分器,耦合到耦合器滤波器的增益调整器,其配置成调整接收信号的增益,相位 调整配置以调整相位以匹配串扰,并且反相器耦合以反转匹配的信号以实现串扰的消除。 消除电路可以包括两个组件,即解决共模串扰的第一组件和解决差模串扰的第二组件。 该组合被添加和反转以便能够消除设备的读取组件中的串扰。
    • 17. 发明授权
    • Process for manufacturing a silicon chip with an integrated
magnetoresistive head mounted on a slider
    • 用于制造具有安装在滑块上的集成磁阻头的硅芯片的工艺
    • US5559051A
    • 1996-09-24
    • US363465
    • 1994-12-23
    • Steven H. VoldmanAlbert J. WallashReginald B. Wilcox, Jr.
    • Steven H. VoldmanAlbert J. WallashReginald B. Wilcox, Jr.
    • G11B5/39G11B5/31G11B5/40G11B5/48G11B33/12H01L21/28H01L21/301H01L21/304H01L21/48
    • G11B5/40G11B5/3106G11B33/12G11B5/3967G11B5/4806Y10T29/49034Y10T29/49041
    • A process of making an MR head having its MR stripe protected from electro-static discharge (ESD) on a slider, such as titanium carbide. The MR stripe is protected by a plurality of silicon integrated circuit devices which conduct ESD-induced current from the MR stripe to larger components in the MR head such as the first and second shield layers and the coil layer. In a preferred embodiment the integrated circuit devices and interconnects are constructed in a single crystal silicon chip. The silicon chip is fixedly mounted to a trailing edge of the slider and the MR head is mounted on a trailing edge of the silicon chip adjacent the integrated circuit devices. The invention includes a method of mass producing sliders by combining thin film technology for making MR heads with integrated circuit technology for making integrated circuit devices. These technologies are combined at the row level to ultimate completion of individual sliders. A silicon wafer, including the integrated circuit devices, is sliced into a plurality of silicon bars, each bar including a row of circuit devices. A plurality of rows and columns of MR heads are constructed on a ceramic wafer. The ceramic wafer is then also sliced into bars, each bar including a row of MR heads. Each silicon bar is then bonded to a ceramic bar, forming composite bars of MR heads electrically connected to the circuit devices. Each composite bar is then further processed and diced into individual sliders, each slider carrying an MR head which is ESD protected.
    • 制造具有其MR条纹的MR头的过程,其保护不受诸如碳化钛的滑块上的静电放电(ESD)的影响。 MR条纹由多个硅集成电路器件保护,这些硅集成电路器件将MR感应电流从MR条纹传导到MR头中的较大部件,例如第一和第二屏蔽层和线圈层。 在优选实施例中,集成电路器件和互连构造在单晶硅芯片中。 硅芯片固定地安装在滑块的后缘,并且MR磁头安装在硅芯片的与集成电路器件相邻的后缘。 本发明包括通过将用于制造MR磁头的薄膜技术与用于制造集成电路器件的集成电路技术结合在一起来批量生产滑块的方法。 这些技术在行级结合到最终完成各个滑块。 包括集成电路器件的硅晶片被切成多个硅棒,每个棒包括一排电路器件。 在陶瓷晶片上构造多个行和列的MR磁头。 然后将陶瓷晶片切成棒,每个棒包括一排MR头。 然后将每个硅棒结合到陶瓷棒,形成电连接到电路装置的MR头的复合棒。 然后将每个复合棒进一步处理并切割成各个滑块,每个滑块承载ESD保护的MR头。
    • 20. 发明授权
    • Silicon chip with an integrated magnetoresistive head mounted on a slider
    • 具有安装在滑块上的集成磁阻头的硅芯片
    • US5587857A
    • 1996-12-24
    • US324841
    • 1994-10-18
    • Steven H. VoldmanAlbert J. WallashReginald B. Wilcox, Jr.
    • Steven H. VoldmanAlbert J. WallashReginald B. Wilcox, Jr.
    • G11B5/39G11B5/31G11B5/40G11B5/48G11B33/12G11B21/21
    • G11B5/40G11B5/3106G11B33/12G11B5/3967G11B5/4806Y10T29/49034Y10T29/49041
    • An MR head has its MR stripe protected from electro-static discharge (ESD) on a slider, such as titanium carbide. The MR stripe is protected by a plurality of silicon integrated circuit devices which conduct ESD-induced current from the MR stripe to a silicon chip substrate ground potential or to larger components in the MR head such as the first and second shield layers and the coil layer. In a preferred embodiment the integrated circuit devices and interconnects are constructed in a single crystal silicon chip. The silicon chip is fixedly mounted to a trailing edge of the slider and the MR head is mounted on a trailing edge of the silicon chip adjacent the integrated circuit devices. The invention includes a method of mass producing sliders by combining thin film technology for making MR heads with integrated circuit technology for making integrated circuit devices. These technologies are combined at the wafer level to ultimate completion of individual sliders. At the wafer level a silicon wafer, which contains the integrated circuit devices, is fixedly mounted to a wafer of slider material, such as titanium carbide. A plurality of rows and columns of MR heads are constructed on the silicon wafer adjacent the integrated circuit devices. The composite wafer is then diced into quadrants wherein each quadrant contains rows and columns of sliders with MR heads. Each quadrant is then diced into rows. Each row is then diced into individual sliders, each slider carrying an MR head which is ESD protected.
    • MR磁头具有防止静电放电(ESD)的MR条纹,例如碳化钛。 MR条纹由多个硅集成电路器件保护,这些硅集成电路器件将从MR条纹到ESD芯片衬底接地电位的ESD感应电流或MR头中的较大部件(例如第一和第二屏蔽层)以及线圈层 。 在优选实施例中,集成电路器件和互连构造在单晶硅芯片中。 硅芯片固定地安装在滑块的后缘,并且MR磁头安装在硅芯片的与集成电路器件相邻的后缘。 本发明包括通过将用于制造MR磁头的薄膜技术与用于制造集成电路器件的集成电路技术结合在一起来批量生产滑块的方法。 这些技术在晶圆级别结合到最终完成各个滑块。 在晶片级,包含集成电路器件的硅晶片固定地安装在诸如碳化钛的滑块材料的晶片上。 在与集成电路器件相邻的硅晶片上构造多个行和列MR磁头。 然后将复合晶片切割成象限,其中每个象限包含具有MR磁头的行和列的滑块。 然后将每个象限切成行。 然后将每一行切成单独的滑块,每个滑块承载ESD保护的MR头。