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    • 13. 发明专利
    • A method of manufacturing a semiconductor device
    • JP5325759B2
    • 2013-10-23
    • JP2009288687
    • 2009-12-21
    • ラムバス・インコーポレーテッド
    • 拓夫 大橋大志 久保田
    • H01L21/336H01L21/205H01L21/316H01L21/318H01L29/78
    • PROBLEM TO BE SOLVED: To form a gate insulating film on a semiconductor substrate in which the concentration of nitrogen is raised in the vicinity of an interface with a gate electrode at the opposite side of the substrate is raised while an increase in the concentration of nitrogen is suppressed in the vicinity of the interface with the substrate. SOLUTION: A method of forming a nitrogen containing gate insulating film 12 successively includes a step of depositing a silicon monatomic layer, and a step of oxidizing a silicon monatomic layer. It also successively includes an oxide film formation step of forming an silicon oxide film 21 on a silicon substrate 11, a nitriding step of nitriding the front surface part 21a of the silicon oxide film by plasma nitriding treatment at a substrate temperature less than 500°C, a step of depositing a silicon monatomic layer, and a step of nitriding the silicon monatomic layer by plasma nitriding treatment at a substrate temperature less than 500°C, and further includes a step of forming a silicon nitride film 22 on the nitrified surface of a silicon oxide film. Wherein the concentration of nitrogen at an interface between a nitrogen containing gate insulating film and a gate electrode 13 is higher than that at an interface between a nitrogen containing gate insulating film and a semiconductor substrate. COPYRIGHT: (C)2010,JPO&INPIT