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    • 183. 发明授权
    • Semiconductor device with core and periphery regions
    • 具有核心和外围区域的半导体器件
    • US06995437B1
    • 2006-02-07
    • US10869774
    • 2004-06-16
    • Hiroyuki KinoshitaYu SunBasab BanerjeeChristopher M. FosterJohn R. BehnkeCyrus Tabery
    • Hiroyuki KinoshitaYu SunBasab BanerjeeChristopher M. FosterJohn R. BehnkeCyrus Tabery
    • H01L31/119
    • H01L27/105H01L27/11568H01L27/11573
    • A method for forming a semiconductor device that includes a line and space pattern with variable pitch and critical dimensions in a layer on a substrate. The substrate includes a first region (e.g., a core region) and a second region (e.g., a periphery region). A first sub-line and space pattern in the first region comprises a space of a dimension (A) less than achievable by lithographic processes alone. Further, a second sub-line and space pattern in the second region comprises at least one line including a second critical dimension (B) achievable by lithography. The method uses two critical masking steps to form a hard mask that includes in the core region a critical dimension (A) less than achievable at a resolution limit of lithography. Further, the method uses a single etch step to transfer the pattern of the hard mask to the layer.
    • 一种用于形成半导体器件的方法,其包括在衬底上的层中具有可变节距和临界尺寸的线和间隔图案。 衬底包括第一区域(例如芯区域)和第二区域(例如,周边区域)。 第一区域中的第一子线和空间图案包括尺寸(A)的空间小于单独通过光刻工艺可实现的尺寸。 此外,第二区域中的第二子线和空间图案包括至少一条线,其包括通过光刻可实现的第二临界尺寸(B)。 该方法使用两个关键的掩模步骤来形成硬掩模,其在芯部区域中包括小于在光刻的分辨率极限下可实现的临界尺寸(A)。 此外,该方法使用单个蚀刻步骤将硬掩模的图案转移到该层。
    • 190. 发明授权
    • Innovative narrow gate formation for floating gate flash technology
    • 用于浮栅闪存技术的创新窄门形成
    • US06583009B1
    • 2003-06-24
    • US10178106
    • 2002-06-24
    • Angela T. HuiKelwin KoHiroyuki KinoshitaSameer HaddadYu Sun
    • Angela T. HuiKelwin KoHiroyuki KinoshitaSameer HaddadYu Sun
    • H01L218247
    • H01L27/11521H01L27/115Y10S438/952
    • The present invention relates to a method of forming a stacked gate flash memory cell and comprises forming a tunnel oxide layer, a first conductive layer, an interpoly dielectric layer, and a second conductive layer in succession over a semiconductor substrate. The method further comprises forming a sacrificial layer over the second conductive layer, and patterning the sacrificial layer to form a sacrificial layer feature having at least one lateral sidewall edge associated therewith. A sidewall spacer is then formed against the lateral sidewall edge of the sacrificial layer, wherein the spacer has a width associated therewith, and the patterned sacrificial layer feature is removed. Finally, the second conductive layer, the interpoly dielectric and the first conductive layer are patterned using the spacer as a hard mask, and defining the stacked gate, wherein a width of the stacked gate is a function of the spacer width.
    • 本发明涉及一种形成层叠栅极闪存单元的方法,包括在半导体衬底上连续形成隧道氧化物层,第一导电层,多晶硅间介质层和第二导电层。 该方法还包括在第二导电层上形成牺牲层,以及图案化牺牲层以形成具有与其相关联的至少一个侧向侧壁边缘的牺牲层特征。 然后在牺牲层的横向侧壁边缘上形成侧壁间隔物,其中间隔件具有与其相关联的宽度,并且去除图案化的牺牲层特征。 最后,使用间隔物作为硬掩模来图案化第二导电层,多晶硅间电介质和第一导电层,并且限定堆叠栅极,其中堆叠栅极的宽度是间隔物宽度的函数。