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    • 154. 发明授权
    • Pattern formation method
    • 图案形成方法
    • US08268535B2
    • 2012-09-18
    • US13085232
    • 2011-04-12
    • Masayuki EndoMasaru Sasago
    • Masayuki EndoMasaru Sasago
    • G03F7/26
    • G03F7/0035G03F7/2041
    • After forming a lower layer film, an intermediate layer film and a first resist film on a substrate, a first resist pattern is formed by performing first exposure. Then, after a first intermediate layer pattern is formed by transferring the first resist pattern onto the intermediate layer film, a second resist film is formed thereon, and a second resist pattern is formed by performing second exposure. Thereafter, a second intermediate layer pattern is formed by transferring the second resist pattern onto the intermediate layer film. After removing the second resist film, the lower layer film is etched by using the second intermediate layer pattern as a mask, so as to form a lower layer pattern.
    • 在基板上形成下层膜,中间层膜和第一抗蚀剂膜之后,通过进行第一曝光来形成第一抗蚀剂图案。 然后,在通过将第一抗蚀剂图案转印到中间层膜上形成第一中间层图案之后,在其上形成第二抗蚀剂膜,并通过进行第二曝光形成第二抗蚀剂图案。 此后,通过将第二抗蚀剂图案转印到中间层膜上来形成第二中间层图案。 在除去第二抗蚀剂膜之后,通过使用第二中间层图案作为掩模来蚀刻下层膜,以形成下层图案。
    • 155. 发明授权
    • Pattern formation method
    • 图案形成方法
    • US07943285B2
    • 2011-05-17
    • US12029944
    • 2008-02-12
    • Masayuki EndoMasaru Sasago
    • Masayuki EndoMasaru Sasago
    • G03F7/26
    • G03F7/0035G03F7/0397G03F7/11G03F7/2041
    • After formation of an underlayer film and an intermediate layer film, a resist pattern formed by the first pattern exposure with the first resist film and the second pattern exposure with the second resist film is transferred to the intermediate layer film. The underlayer film is etched using an intermediate layer pattern as a mask to form an underlayer film pattern. Herein, the first and second resist films are chemically amplified resist films. The second resist film contains a greater amount of additive which improves the sensitivity of the resist or which improves the alkaline solubility of resist exposed part.
    • 在形成下层膜和中间层膜之后,将通过第一图案曝光形成的抗蚀图案与第一抗蚀剂膜和第二图案曝光用第二抗蚀剂膜转印到中间层膜。 使用中间层图案作为掩模蚀刻下层膜,以形成下层膜图案。 这里,第一和第二抗蚀剂膜是化学放大抗蚀剂膜。 第二抗蚀剂膜含有更多量的添加剂,其提高了抗蚀剂的灵敏度或改善了抗蚀剂暴露部分的碱溶性。