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    • 135. 发明授权
    • Heat dissipating assembly
    • 散热组件
    • US07742301B2
    • 2010-06-22
    • US11959298
    • 2007-12-18
    • Min LiLei Cao
    • Min LiLei Cao
    • H05K7/20
    • H01L23/467H01L23/4006H01L23/4093H01L2924/0002H01L2924/00
    • A heat dissipating assembly for dissipating heat from a plurality of electronic components, including a heat sink (10) mounted on an electronic component, a fan (40), a first holder (50), and a second holder (60). The fan has a part secured on the heat sink by the first holder that is fixed at a lateral side of the heat sink, and another part located beyond a periphery of the heat sink being secured to the heat sink by the second holder that is fixed at an opposite side of the heat sink. An airflow produced by the fan has a part blowing the heat sink to remove heat from the one of the electronic component, and another part blowing another electronic component, which is located below the another part of the fan, thus dispersing heat from the another electronic component.
    • 一种用于从多个电子部件散热的散热组件,包括安装在电子部件上的散热器(10),风扇(40),第一保持器(50)和第二保持器(60)。 风扇具有固定在散热器的侧面的第一保持器固定在散热器上的部分,并且位于超过散热器周边的另一部分通过固定的第二保持器固定到散热器 在散热器的相对侧。 由风扇产生的气流具有吹送散热器的部分以从电子部件中的一个移除热量,另一部分吹送位于风扇的另一部分下方的另一电子部件,从而分散来自另一电子部件的热量 零件。
    • 137. 发明授权
    • Heat dissipation device having a clip assembly
    • 具有夹子组件的散热装置
    • US07697297B2
    • 2010-04-13
    • US11947091
    • 2007-11-29
    • Chun-Chi ChenMin LiHong-Cheng Yang
    • Chun-Chi ChenMin LiHong-Cheng Yang
    • H05K7/20
    • H01L23/4093H01L2924/0002H01L2924/00
    • A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto.
    • 一种用于从安装在印刷电路板上的电子部件移除热量的散热装置,包括将散热器和将散热器安装到印刷电路板上的夹子。 散热器具有矩形基部和从基部向上延伸的多个翅片。 散热片限定了其中的接收通道,其倾斜于散热器的两个相对侧。 夹子包括放置在接收通道中的主体和从主体的两个相对端倾斜地相对延伸的两个闩锁腿。 两个锁定腿分别位于散热器的两个相对侧的前面和后面,并且与其平行。
    • 139. 发明授权
    • Heat sink assembly for multiple electronic components
    • 用于多个电子元件的散热器组件
    • US07667970B2
    • 2010-02-23
    • US11964888
    • 2007-12-27
    • Wu-Jiang MaMin Li
    • Wu-Jiang MaMin Li
    • H05K7/20
    • H01L23/467H01L23/3672H01L23/4006H01L2924/0002H01L2924/00
    • A heat sink assembly for removing heat from two heat generating-components mounted on a printed circuit board, includes a first heat sink, a second heat sink, a plurality of poles each having a head at a top end and a double-layer spring. The first heat sink includes a base and a plurality of fins arranged on the base. The second heat sink has a first shoulder extending from a lateral side thereof. The first shoulder is disposed on the base. The double-layer spring includes an outer spring and an inner spring having a top end connected to a top end of the outer spring. One of the poles wearing the double-layer spring extends through the first shoulder and the base. The outer spring is compressed between the head of the pole and the first shoulder. The inner spring is compressed between the head of the pole and the base.
    • 一种用于从安装在印刷电路板上的两个发热元件去除热量的散热器组件,包括第一散热器,第二散热器,多个磁极,每个磁极各自具有位于顶端的磁头和双层弹簧。 第一散热器包括基部和布置在基部上的多个翅片。 第二散热器具有从其侧面延伸的第一肩部。 第一个肩膀放在基座上。 双层弹簧包括外弹簧和内弹簧,其具有连接到外弹簧顶端的顶端。 穿着双层弹簧的一个极板延伸穿过第一个肩部和底部。 外部弹簧在杆的头部和第一肩部之间被压缩。 内部弹簧在杆的头部和底座之间被压缩。
    • 140. 发明申请
    • Ta/W film as heating device for dynamic fly height adjustment
    • Ta / W薄膜作为动态飞行高度调节的加热装置
    • US20090323227A1
    • 2009-12-31
    • US12215825
    • 2008-06-30
    • Min ZhengMin LiChen-Jung ChienKowang LiuSung Chung
    • Min ZhengMin LiChen-Jung ChienKowang LiuSung Chung
    • G11B5/33
    • G11B5/314G11B5/6064
    • A dynamic fly heater (DFH) for improved lifetime and better film uniformity is disclosed for a magnetic head. The heater has a lower amorphous Ta layer and an upper W layer to promote small grain size and reduced electro-migration. The composite film is especially advantageous for heaters greater than 1000 Angstroms thick where dR/R is difficult to control in the prior art. The DFH may be a (Ta/W)n laminate in which the Ta layers are about 30 Angstroms thick and the combined thickness of the W layers is from 400 to 1200 Angstroms. A Ta film is preferably sputter deposited with an Ar pressure of 3 to 5 mTorr and the W film is sputter deposited in the same chamber with a 3 to 20 mTorr Ar pressure. In one embodiment, a merged read/write head has one DFH in the read head and a second DFH in the write head.
    • 公开了一种用于改善寿命和更好的膜均匀性的动态飞行加热器(DFH)。 加热器具有较低的非晶Ta层和上W层,以促进小晶粒尺寸和减少的电迁移。 复合膜对于现有技术中dR / R难以控制的大于1000埃的加热器是特别有利的。 DFH可以是(Ta / W)n层叠体,其中Ta层的厚度约为30埃,W层的组合厚度为400至1200埃。 优选以3至5mTorr的Ar压力溅射沉积Ta膜,并将W膜以3至20mTorr Ar压力溅射沉积在相同的室中。 在一个实施例中,合并的读/写头在读头中具有一个DFH,在写头中具有第二DFH。