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    • 133. 发明申请
    • Dynamic selection of motion estimation search ranges and extended motion vector ranges
    • 运动估计搜索范围和扩展运动矢量范围的动态选择
    • US20070237232A1
    • 2007-10-11
    • US11400051
    • 2006-04-07
    • Cheng ChangChih-Lung LinThomas Holcomb
    • Cheng ChangChih-Lung LinThomas Holcomb
    • H04N11/02H04N7/12
    • H04N19/192H04N19/51
    • Techniques and tools for selecting search ranges and/or motion vector ranges during motion estimation are described. For example, a video encoder performs motion estimation constrained by a first search range, which results in multiple motion vectors. The encoder computes motion vector distribution information for the motion vectors. To compute the distribution information, the encoder can track the motion vectors in a histogram and count how many of the motion vectors fall within each of multiple intervals for the distribution information. The encoder then selects a second search range and performs motion estimation constrained by the second search range. Selecting the second search range can include selecting a motion vector range, which in some cases in effect determines the second search range.
    • 描述了在运动估计期间选择搜索范围和/或运动矢量范围的技术和工具。 例如,视频编码器执行由第一搜索范围约束的运动估计,其导致多个运动矢量。 编码器计算运动矢量的运动矢量分布信息。 为了计算分布信息,编码器可以跟踪直方图中的运动矢量,并计算多少个运动矢量落在分布信息的多个间隔的每一个中。 然后,编码器选择第二搜索范围并执行受第二搜索范围约束的运动估计。 选择第二搜索范围可以包括选择运动矢量范围,其在某些情况下有效地确定第二搜索范围。
    • 140. 发明授权
    • In-line chemical mechanical polish (CMP) planarizing method employing interpolation and extrapolation
    • 采用插值和外插法的在线化学机械抛光(CMP)平面化方法
    • US06338668B1
    • 2002-01-15
    • US09639864
    • 2000-08-16
    • Chih-Lung LinWen-Cheng Chien
    • Chih-Lung LinWen-Cheng Chien
    • B24B4900
    • B24B37/013B24B37/042B24B49/03
    • Within a chemical mechanical polish (CMP) method there is first provided a first control substrate, a first series of product substrates and a second control substrate. There is then sequentially chemical mechanical polish (CMP) planarized, while employing a chemical mechanical polish (CMP) planarizing method, the first control substrate to provide a planarized first control substrate, the first series of product substrates to provide a planarized first series of product substrates and the second control substrate to provide a planarized second control substrate. There is then determined, for the planarized first control substrate and the planarized second control substrate, a corresponding first value of a parameter within the chemical mechanical polish (CMP) planarizing method and a corresponding second value of the parameter within the chemical mechanical polish (CMP) planarizing method. There may then be interpolated or extrapolated from the first value of the parameter and the second value of the parameter to provide an interpolated value of the parameter for a planarized first product substrate within the planarized first series of product substrates or an extrapolated value of the parameter which may be employed for planarizing with enhanced uniformity a second product substrate within a second series of product substrates.
    • 在化学机械抛光(CMP)方法中,首先提供第一控制基板,第一系列产品基板和第二控制基板。 然后依次进行化学机械抛光(CMP)平面化,同时采用化学机械抛光(CMP)平面化方法,第一控制基板提供平面化的第一控制基板,第一系列产品基板提供平面化的第一系列产品 基板和第二控制基板,以提供平坦化的第二控制基板。 然后,对于平坦化的第一控制基板和平坦化的第二控制基板,确定在化学机械抛光(CMP)平面化方法内的参数的对应的第一值和化学机械抛光(CMP)内的参数的对应的第二值 )平面化方法。 然后可以从参数的第一值和参数的第二值进行内插或外插,以提供平面化的第一系列产品基板内的平面化第一产品基板的参数的内插值,或参数的外推值 其可以用于在第二系列产品基底内以均匀化的平面化第二产品基底。