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    • 123. 发明申请
    • Programmable Via Devices with Air Gap Isolation
    • 具有空气间隙隔离的可编程通孔器件
    • US20090305460A1
    • 2009-12-10
    • US12544964
    • 2009-08-20
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • H01L21/06
    • H01L45/06H01L28/20H01L45/1206H01L45/122H01L45/1286H01L45/1293H01L45/144H01L45/148H01L45/1683
    • Programmable via devices and methods for the fabrication thereof are provided. In one aspect, a programmable via device is provided. The programmable via device comprises a first dielectric layer; a heater over the first dielectric layer; an air gap separating at least a portion of the heater from the first dielectric layer; an isolation layer over the first dielectric layer covering at least a portion of the heater; a capping layer over a side of the isolation layer opposite the first dielectric layer; at least one programmable via extending through the capping layer and at least a portion of the isolation layer and in contact with the heater, the programmable via comprising at least one phase change material; a conductive cap over the programmable via; a second dielectric layer over a side of the capping layer opposite the isolation layer; a first conductive via and a second conductive via, each extending through the second dielectric layer, the capping layer and at least a portion of the isolation layer and in contact with the heater; and a third conductive via extending through the second dielectric layer and in contact with the conductive cap.
    • 提供可编程的器件及其制造方法。 在一个方面,提供了可编程通路装置。 可编程通孔装置包括第一介电层; 第一介电层上的加热器; 将所述加热器的至少一部分与所述第一介电层分开的气隙; 覆盖所述加热器的至少一部分的所述第一介电层上的隔离层; 在所述隔离层的与所述第一介电层相对的一侧上的覆盖层; 至少一个可编程通道,其延伸穿过所述封盖层和所述隔离层的至少一部分并与所述加热器接触,所述可编程通孔包括至少一个相变材料; 可编程通孔上的导电盖; 在覆盖层的与隔离层相对的一侧上的第二电介质层; 第一导电通孔和第二导电通孔,每个延伸穿过第二介电层,封盖层和至少一部分隔离层并与加热器接触; 以及延伸穿过所述第二介电层并与所述导电盖接触的第三导电通孔。
    • 125. 发明授权
    • Method of producing self-aligned mask in conjunction with blocking mask, articles produced by same and composition for same
    • 生产自对准面罩的方法与阻隔面罩相同,制成的物品及其成分相同
    • US07517637B2
    • 2009-04-14
    • US10804552
    • 2004-03-19
    • Matthew E ColburnSatyanarayana V NittaSampath Purushothaman
    • Matthew E ColburnSatyanarayana V NittaSampath Purushothaman
    • G03F7/00
    • G03F7/2022
    • A method of forming a self aligned pattern on an existing pattern on a substrate including applying a coating of a solution containing a masking material in a carrier, the masking material being either photo or thermally sensitive; performing a blanket exposure of the substrate; and allowing at least a portion of the masking material to preferentially develop in a fashion that replicates the existing pattern of the substrate. The existing pattern includes a first set of regions of the substrate having a first reflectivity and a second set of regions of the substrate having a second reflectivity different from the first composition. The first set of regions can include one or more metal elements and the second set of regions can include one or more dielectrics. Structures made in accordance with the method. A low resolution mask is used to block out regions over the substrate. Additionally, the resist can be applied over another masking layer that contains a separate pattern.
    • 一种在衬底上的现有图案上形成自对准图案的方法,包括在载体中涂覆含有掩模材料的溶液的涂层,所述掩模材料为光敏或热敏感的; 进行基板的覆盖曝光; 并且允许至少一部分掩模材料以复制衬底的现有图案的方式优先显影。 现有图案包括具有第一反射率的衬底的第一组区域和具有不同于第一组成的第二反射率的衬底的第二组区域。 第一组区域可以包括一个或多个金属元素,第二组区域可以包括一个或多个电介质。 按照该方法制造的结构。 低分辨率掩模用于阻挡衬底上的区域。 另外,抗蚀剂可以施加在包含单独图案的另一掩蔽层上。
    • 126. 发明申请
    • PROGRAMMABLE VIA DEVICES WITH AIR GAP ISOLATION
    • 可通过具有空气隔离的装置进行编程
    • US20090033360A1
    • 2009-02-05
    • US11833354
    • 2007-08-03
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • H03K19/177H01L45/00
    • H01L45/06H01L28/20H01L45/1206H01L45/122H01L45/1286H01L45/1293H01L45/144H01L45/148H01L45/1683
    • Programmable via devices and methods for the fabrication thereof are provided. In one aspect, a programmable via device is provided. The programmable via device comprises a first dielectric layer; a heater over the first dielectric layer; an air gap separating at least a portion of the heater from the first dielectric layer; an isolation layer over the first dielectric layer covering at least a portion of the heater; a capping layer over a side of the isolation layer opposite the first dielectric layer; at least one programmable via extending through the capping layer and at least a portion of the isolation layer and in contact with the heater, the programmable via comprising at least one phase change material; a conductive cap over the programmable via; a second dielectric layer over a side of the capping layer opposite the isolation layer; a first conductive via and a second conductive via, each extending through the second dielectric layer, the capping layer and at least a portion of the isolation layer and in contact with the heater; and a third conductive via extending through the second dielectric layer and in contact with the conductive cap.
    • 提供可编程的器件及其制造方法。 在一个方面,提供了可编程通路装置。 可编程通孔装置包括第一介电层; 第一介电层上的加热器; 将所述加热器的至少一部分与所述第一介电层分开的气隙; 覆盖所述加热器的至少一部分的所述第一介电层上的隔离层; 在所述隔离层的与所述第一介电层相对的一侧上的覆盖层; 至少一个可编程通道,其延伸穿过所述封盖层和所述隔离层的至少一部分并与所述加热器接触,所述可编程通孔包括至少一个相变材料; 可编程通孔上的导电盖; 在覆盖层的与隔离层相对的一侧上的第二电介质层; 第一导电通孔和第二导电通孔,每个延伸穿过第二介电层,封盖层和至少一部分隔离层并与加热器接触; 以及延伸穿过所述第二介电层并与所述导电盖接触的第三导电通孔。
    • 127. 发明申请
    • PROGRAMMABLE VIA DEVICES IN BACK END OF LINE LEVEL
    • 通过线路后端的设备可编程
    • US20090033358A1
    • 2009-02-05
    • US11833321
    • 2007-08-03
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • H01L45/00H03K19/177
    • H01L28/65H01L28/20H01L45/06H01L45/1206H01L45/122H01L45/1286H01L45/144H01L45/148H01L45/1683Y10S977/754
    • Programmable via devices and methods for the fabrication thereof are provided. In one aspect, a programmable via device is provided. The programmable via device comprises a first dielectric layer; at least one isolation layer over the first dielectric layer; a heater within the isolation layer; a capping layer over a side of the isolation layer opposite the first dielectric layer; at least one programmable via extending through the capping layer and at least a portion of the isolation layer and in contact with the heater, the programmable via comprising at least one phase change material; a conductive cap over the programmable via; a second dielectric layer over a side of the capping layer opposite the isolation layer; a first conductive via and a second conductive via, each extending through the second dielectric layer, the capping layer and at least a portion of the isolation layer and in contact with the heater; and a third conductive via extending through the second dielectric layer and in contact with the conductive cap.
    • 提供可编程的器件及其制造方法。 在一个方面,提供了可编程通路装置。 可编程通孔装置包括第一介电层; 在所述第一介电层上方的至少一个隔离层; 隔离层内的加热器; 在所述隔离层的与所述第一介电层相对的一侧上的覆盖层; 至少一个可编程通道,其延伸穿过所述封盖层和所述隔离层的至少一部分并与所述加热器接触,所述可编程通孔包括至少一个相变材料; 可编程通孔上的导电盖; 在覆盖层的与隔离层相对的一侧上的第二电介质层; 第一导电通孔和第二导电通孔,每个延伸穿过第二介电层,封盖层和至少一部分隔离层并与加热器接触; 以及延伸穿过所述第二介电层并与所述导电盖接触的第三导电通孔。