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    • 124. 发明授权
    • Observation apparatus
    • 观察装置
    • US06400455B1
    • 2002-06-04
    • US09209046
    • 1998-12-09
    • Shuji KurokawaKenji Kobayashi
    • Shuji KurokawaKenji Kobayashi
    • E01N2100
    • G01N21/8806H01L22/12H01L2924/0002H01L2924/00
    • An observation apparatus for observing an observation object is constructed from a light source portion for emitting illumination light, a converging lens for focusing illumination light from the light source portion onto the observation object and a light-receiving portion for receiving light reflected from the observation object, wherein the light source portion includes a first arrangement of at least one light-emitting body provided on the optical axis of the converging lens, a second arrangement of at least one light-emitting body provided near the optical axis so as to shine light onto the observation object at an incidence angle which allows the light source image to completely cover the light-receiving portion (bright field illumination), a third arrangement of at least one light-emitting body provided near the optical axis so as to shine light onto the observation object at an incidence angle which allows the light source image to cover a portion of the light-receiving portion, and a fourth arrangement of at least one light-emitting body provided near the optical axis so as to shine light onto the observation object at an incidence angle which prevents the light source image from covering any of the light-receiving portion (dark field illumination), in which the light-emitting bodies are adapted for selective activation.
    • 用于观察观察对象的观察装置由用于发射照明光的光源部分构成,用于将来自光源部分的照明光聚焦到观察对象上的会聚透镜和用于接收从观察对象反射的光的光接收部分 其中,所述光源部分包括设置在会聚透镜的光轴上的至少一个发光体的第一布置,设置在所述光轴附近的至少一个发光体的第二布置,以将光照射到 以允许光源图像完全覆盖光接收部分的入射角的观察对象(亮场照明),设置在光轴附近的至少一个发光体的第三布置,以将光照射到 观察对象以允许光源图像覆盖光接收部分的一部分的入射角 以及设置在光轴附近的至少一个发光体的第四布置,以便以防止光源图像覆盖任何光接收部分(暗场照明)的入射角将光照射到观察对象上 ),其中发光体适于选择性激活。
    • 125. 发明授权
    • Lighting apparatus
    • 照明设备
    • US06286969B1
    • 2001-09-11
    • US09352324
    • 1999-07-12
    • Shuji KurokawaKenji Kobayashi
    • Shuji KurokawaKenji Kobayashi
    • G03B1502
    • G01N21/8806
    • A lighting apparatus 1 has a convex lens 11 arranged so that its optical axis is at an angle &thgr; with respect to the normal of an observation portion 3a (e.g., a semiconductor substrate or the like), with a camera 5 arranged in the path of the reflected light rays. When a light-emitting portion 13 is arranged along the optical axis of the lens 11, a bright field illumination takes place. If a knob 29 is turned, the light-emitting portion 13 moves along a ball screw 25, thereby changing the illumination from a bright field illumination to a dark field illumination. When a knob 37 is turned, the light exiting the lens 11 will diverge if the light-emitting portion 13 is moved close to the lens 11, converge if the light-emitting portion 13 is moved far away from the lens 11, and be parallel if the light-emitting portion 13 is positioned at the focal point of the lens 11. By changing the position of the light-emitting portion 13 in this way, it is possible to change the illuminating angle and the illuminating angle distribution, and by adjusting the position of the light-emitting portion 13 in accordance with the optical characteristics of the object 3, it is possible to obtain a high contrast image. It is also possible for these adjustments to be carried out automatically by using an actuator, microcomputer or the like.
    • 照明装置1具有凸透镜11,其布置成使得其光轴相对于观察部分3a(例如,半导体衬底等)的法线成角度θ,其中照相机5布置在 反射光线。 当沿着透镜11的光轴布置发光部分13时,发生明场照明。 如果旋钮29转动,则发光部13沿着滚珠丝杠25移动,从而将照明从亮场照明改变为暗场照明。 当旋钮37转动时,如果发光部分13靠近透镜11移动,离开透镜11的光将发散,如果发光部分13远离透镜11移动则会聚,并且平行 如果发光部分13位于透镜11的焦点处。通过以这种方式改变发光部分13的位置,可以改变照明角度和照明角度分布,并且通过调节 根据物体3的光学特性的发光部分13的位置,可以获得高对比度图像。 这些调整也可以通过使用致动器,微型计算机等自动进行。
    • 126. 发明授权
    • Wafer transfer apparatus
    • 晶圆传送装置
    • US06238515B1
    • 2001-05-29
    • US09376996
    • 1999-08-18
    • Masaki TsujimotoKenji KobayashiHideo NumataKeisuke Tokubuchi
    • Masaki TsujimotoKenji KobayashiHideo NumataKeisuke Tokubuchi
    • H01L2178
    • H01L21/67132H01L21/68H01L2221/6839Y10S414/137Y10S414/141Y10T156/1705Y10T156/1983
    • A wafer transfer apparatus for sticking a wafer, which is divided into a multiplicity of chips and which has its surface stuck with a protective tape, to a ring frame by a transfer tape, includes: a positioning unit capable of disposing the protective tape stuck wafer on a positioning table and capable of performing a position adjustment of the wafer in longitudinal, lateral and rotational directions, so that the wafer is located in a reference position; a transfer tape mount unit capable of disposing the protective tape stuck wafer, which has been located in the reference position by the positioning unit, on a transfer tape mount table, and capable of sticking a transfer tape to both a ring frame disposed round periphery of the wafer and back of the wafer, so that the wafer and the ring frame are stuck to each other and integrated; and a protective tape peeling unit capable of disposing the wafer, which has its back covered with the transfer tape and which has been integrated with the ring frame by the transfer tape mount unit, on a protective tape peeling table, and capable of bonding an end of a peeling tape to an end of the protective tape stuck to the wafer surface, and capable of pulling the peeling tape so that the protective tape is peeled from the wafer surface.
    • 将通过转印带将被分割为多个芯片并且其表面粘贴有保护带的晶片的晶片传送装置包括:能够将保护带粘贴的晶片 并且能够在纵向,横向和旋转方向上执行晶片的位置调整,使得晶片位于参考位置; 一种转印带安装单元,其能够将位于参考位置的定位单元的保护带粘贴的晶片放置在转印带安装台上,并且能够将转印带粘附到设置在圆周周围的环形框架 晶片和晶片的背面,使得晶片和环形框架彼此粘合并集成; 以及保护带剥离单元,其能够将其后面被转印带覆盖并且通过转印带安装单元与环形框架一体化的晶片设置在保护带剥离台上,并且能够将端部 剥离胶带粘附到保护胶带的端部,粘贴在晶片表面上,并且能够拉动剥离带使得保护带从晶片表面剥离。
    • 127. 发明授权
    • Method of die bonding electronic component and die bonding apparatus thereof
    • 电子部件和芯片接合装置的芯片接合方法
    • US06176966B1
    • 2001-01-23
    • US09095739
    • 1998-06-11
    • Masaki TsujimotoKenji Kobayashi
    • Masaki TsujimotoKenji Kobayashi
    • B32B3500
    • H01L21/6836H01L21/67132H01L2221/68327Y10S156/941Y10T29/49819Y10T29/49821Y10T29/49822Y10T156/11Y10T156/1132Y10T156/19
    • A method of die bonding electronic components. A wafer is mounted on a dicing tape (17) comprising at least one layer of shrink film and a pressure sensitive adhesive layer so that the wafer is stuck thereto by the pressure sensitive adhesive layer. The wafer is then diced so that the wafer is cut apart into a multiplicity of chips (16). The dicing tape (17) having the multiplicity of chips stuck thereto is placed on a table equipped with heating means. This is followed by shrinking the shrink film forming part of the dicing tape by the heating means (3, 7) so that an area of adhesion and adhesive strength between the chips and the adhesive layer are decreased and so that the chips are arranged with predetermined spacings. The final step is suctioning the chips (16) arranged with predetermined spacings one at a time by a suction collet (19) disposed above the chips so that the chips are separated from each other. This method enables effective die bonding without damaging the chips. Apparatus for effecting the method is also provided.
    • 一种将电子元件贴合的方法。 将晶片安装在包括至少一层收缩膜和压敏粘合剂层的切割带(17)上,使得晶片通过压敏粘合剂层粘附到其上。 然后对晶片进行切割,使得晶片被切割成多个芯片(16)。 将具有多个芯片的切割胶带(17)放置在装有加热装置的工作台上。 然后,通过加热装置(3,7)使形成切割带的部分的收缩膜收缩,使得芯片和粘合剂层之间的粘附面积和粘合强度降低,使得芯片以预定的方式排列 间距。 最后一步是通过设置在芯片上方的吸入夹头(19)一次抽吸以预定间隔布置的芯片(16),使得芯片彼此分离。 该方法能够有效地进行裸片接合而不损坏芯片。 还提供了用于实现该方法的装置。