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    • 121. 发明专利
    • PHOTOSENSITIVE POLYMER COMPOSITION
    • JPS5859440A
    • 1983-04-08
    • JP15751681
    • 1981-10-05
    • HITACHI LTDHITACHI CHEMICAL CO LTD
    • KATAOKA FUMIOSHIYOUJI FUSAJIOBARA ISAOTAKEMOTO KAZUNARIYOKONO ATARUISOGAI TOKIOKOJIMA MITSUMASA
    • C08L79/08G03F7/008G03G5/07
    • PURPOSE:To enhance solubility in an aprotic polar solvent and compatibility with a polyamide carboxylic acid, by using an aromatic bisazide having a polar group or an org. silicon group introduced into the molecule as a photoinitiator for preparing a polyamide carboxylic acid having photosensitivity. CONSTITUTION:A polymer contg. a polyamide carboxylic acid or its derivative having a photosensitive unsatd. bond in a side chain of each unit of one of monomer unit constituents represented by general formulaIgives a relief structure of a heat resistant polymer, and an aromatic bisazide compd. having formula II as a photoinitiator, and when needed, a sensitizer are added to said polyamide acid. Since this is a polar polymer, uses of said aromatic bisazide compd. into which a polar group or an org. silicon group is introduced raises mutual action and enhances sensitivity. A relief pattern obtained by exposure and development is precursor of a heat resistant polyimide, so it is converted into a heat resistant polymer by heat treatment. In the formulaI, R , R , R are each aromatic group; R is a group having an unsatd. bond, or H or ammonium ion; Y is a group having an unsatd. group; X is a divalent group linking R and Y; W is H or X-Y; (n) is 1 or 2; (x) is 3-100; and COOR is combined to the ortho- or para- position of the amide group. In formula II, P is N3, or -SO2N3; R is a trivalent org. group; and Z is -OH, or -OR , and R being lower alkyl.