会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 121. 发明授权
    • Photomask having central and peripheral line patterns
    • 具有中央和外围线图案的光掩模
    • US07264907B2
    • 2007-09-04
    • US10802052
    • 2004-03-17
    • Kunio Watanabe
    • Kunio Watanabe
    • G03F1/00
    • G03F7/70591G03F1/44G03F1/70G03F7/70941
    • Each of patterns on two types of photomasks, including identical central pattern portions, each having a line pattern on the center of a substrate, and peripheral pattern portions around the central pattern portions, and having distances between the central pattern portion and the peripheral pattern portion different from each other, is transferred onto a wafer. Thereafter, each line width of the transferred patterns corresponding to the line pattern of each photomask is measured. The difference between each of line widths is obtained, from which the flare rate is calculated.
    • 两种类型的光掩模上的每个图案,包括相同的中心图案部分,每个在基板的中心具有线图案,以及围绕中央图案部分的周边图案部分,并且在中心图案部分和周边图案部分之间具有距离 彼此不同,被转移到晶片上。 此后,测量对应于每个光掩模的线图案的转印图案的每个线宽。 获得每个线宽之间的差异,从其计算耀斑率。
    • 128. 发明授权
    • Semiconductor device, memory system and electronic apparatus
    • 半导体器件,存储器系统和电子设备
    • US06720628B2
    • 2004-04-13
    • US10072855
    • 2002-02-06
    • Junichi KarasawaKunio Watanabe
    • Junichi KarasawaKunio Watanabe
    • H01L2976
    • H01L27/11G11C11/412H01L27/1104
    • A semiconductor device is provided with a memory cell. The semiconductor device includes a first gate—gate electrode layer, a second gate—gate electrode layer, a first drain—drain wiring layer, a second drain—drain wiring layer, a first drain-gate wiring layer and second drain-gate wiring layers. The first drain-gate wiring layer and an upper layer and a lower layer of the second drain-gate wiring layer are located in different layers, respectively. The width of the first gate—gate electrode layer in the first load transistor is larger than the width of the first gate—gate electrode layer in the first driver transistor.
    • 半导体器件设置有存储单元。 半导体器件包括第一栅极 - 栅极电极层,第二栅极 - 栅极电极层,第一漏极 - 漏极布线层,第二漏极 - 漏极布线层,第一漏极 - 栅极布线层和第二漏极 - 栅极布线层 。 第一漏极 - 栅极布线层和第二漏极 - 栅极布线层的上层和下层分别位于不同的层中。 第一负载晶体管中的第一栅极 - 栅极电极层的宽度大于第一驱动晶体管中的第一栅极 - 栅极电极层的宽度。
    • 129. 发明授权
    • Sacrificial anode for cathodic protection and alloy therefor
    • 用于阴极保护的牺牲阳极及其合金
    • US06673309B1
    • 2004-01-06
    • US08387158
    • 1995-02-10
    • Kunio WatanabeShozo Takeya
    • Kunio WatanabeShozo Takeya
    • C22C2110
    • C22C21/10C23F13/14
    • An alloy for a sacrificial anode according to a first preferred aspect of the present invention includes about 10% to about 50% of Zn, about 0.03% to about 0.6% of In, and about 0.0005% to about 0.05% of Zr. The balance may be Al and any unavoidable impurities. An alloy according to a second preferred aspect of the present application includes about 10% to about 50% of Zn, about 0.03% to about 0.6% of In, and about 0.05% to about 0.3% of Si. The balance may be Al and any unavoidable impurities. An alloy according to a third preferred aspect of the present invention includes about 10% to about 50% of Zn, about 0.03% to about 0.6% of In, and about 0.02% to about 0.2% of Ce. The balance may be Al and any unavoidable impurities. An alloy according to a fourth preferred aspect of the present invention includes about 10% to about 50% of Zn, about 0.03% to about 0.6% of In, about 0.005% to about 0.1% of Ti, and about 0.001% to about 0.02% of B. The balance may be Al and any unavoidable impurities. An alloy according to another preferred aspect of the present invention includes about 10% to about 50% of Zn and about 0.03% to about 0.6% of In. The balance may be Al and any unavoidable impurities. The present invention also relates to a reinforced concrete structure comprising a cementitious material, metal reinforcement, and a sacrificial anode, the sacrificial anode including an alloy containing Al, Zn and In.
    • 根据本发明第一优选方面的用于牺牲阳极的合金包括约10%至约50%的Zn,约0.03%至约0.6%的In和约0.0005%至约0.05%的Zr。 余量可以是Al和任何不可避免的杂质。 根据本申请第二优选方面的合金包括约10%至约50%的Zn,约0.03%至约0.6%的In和约0.05%至约0.3%的Si。 余量可以是Al和任何不可避免的杂质。 根据本发明第三优选方面的合金包括约10%至约50%的Zn,约0.03%至约0.6%的In和约0.02%至约0.2%的Ce。 余量可以是Al和任何不可避免的杂质。 根据本发明第四优选方面的合金包括约10%至约50%的Zn,约0.03%至约0.6%的In,约0.005%至约0.1%的Ti和约0.001%至约0.02 余量可以是Al和任何不可避免的杂质。 根据本发明另一优选方面的合金包括约10%至约50%的Zn和约0.03%至约0.6%的In。 余量可以是Al和任何不可避免的杂质。 本发明还涉及一种包括水泥质材料,金属加固件和牺牲阳极的钢筋混凝土结构,所述牺牲阳极包括含有Al,Zn和In的合金。