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    • 128. 发明授权
    • In-line chemical mechanical polish (CMP) planarizing method employing interpolation and extrapolation
    • 采用插值和外插法的在线化学机械抛光(CMP)平面化方法
    • US06338668B1
    • 2002-01-15
    • US09639864
    • 2000-08-16
    • Chih-Lung LinWen-Cheng Chien
    • Chih-Lung LinWen-Cheng Chien
    • B24B4900
    • B24B37/013B24B37/042B24B49/03
    • Within a chemical mechanical polish (CMP) method there is first provided a first control substrate, a first series of product substrates and a second control substrate. There is then sequentially chemical mechanical polish (CMP) planarized, while employing a chemical mechanical polish (CMP) planarizing method, the first control substrate to provide a planarized first control substrate, the first series of product substrates to provide a planarized first series of product substrates and the second control substrate to provide a planarized second control substrate. There is then determined, for the planarized first control substrate and the planarized second control substrate, a corresponding first value of a parameter within the chemical mechanical polish (CMP) planarizing method and a corresponding second value of the parameter within the chemical mechanical polish (CMP) planarizing method. There may then be interpolated or extrapolated from the first value of the parameter and the second value of the parameter to provide an interpolated value of the parameter for a planarized first product substrate within the planarized first series of product substrates or an extrapolated value of the parameter which may be employed for planarizing with enhanced uniformity a second product substrate within a second series of product substrates.
    • 在化学机械抛光(CMP)方法中,首先提供第一控制基板,第一系列产品基板和第二控制基板。 然后依次进行化学机械抛光(CMP)平面化,同时采用化学机械抛光(CMP)平面化方法,第一控制基板提供平面化的第一控制基板,第一系列产品基板提供平面化的第一系列产品 基板和第二控制基板,以提供平坦化的第二控制基板。 然后,对于平坦化的第一控制基板和平坦化的第二控制基板,确定在化学机械抛光(CMP)平面化方法内的参数的对应的第一值和化学机械抛光(CMP)内的参数的对应的第二值 )平面化方法。 然后可以从参数的第一值和参数的第二值进行内插或外插,以提供平面化的第一系列产品基板内的平面化第一产品基板的参数的内插值,或参数的外推值 其可以用于在第二系列产品基底内以均匀化的平面化第二产品基底。
    • 129. 发明授权
    • Method and apparatus for slurry temperature control in a polishing process
    • 抛光过程中浆料温度控制的方法和装置
    • US06315635B1
    • 2001-11-13
    • US09283382
    • 1999-03-31
    • Chih-Lung Lin
    • Chih-Lung Lin
    • B24B4902
    • B24B37/015B24B57/02
    • A method and an apparatus for controlling slurry temperature in a polishing machine, such as in a chemical mechanical polishing machine, are disclosed. In the method, an ambient temperature slurry is first provided to the surface of a polishing pad, the polishing process is then started with the polishing pad being rotated and intimately engaging a substrate mounted in a polishing head. By using at least two temperature sensors, the temperature of the slurry dispensed and the temperature of the polishing head are determined and sent to a temperature controller which in turn sends a signal to a heater for heating a slurry supply such that the temperature of the slurry being fed is the same as the temperature of the polishing pad. A heated slurry solution at substantially the same temperature of the polishing pad is then fed to the polishing pad for continuing the polishing process. The present invention novel apparatus includes at least two temperature sensors, a temperature controller and a heater or heat exchanger means for increasing the temperature of a slurry solution before it is fed to a polishing process.
    • 公开了一种用于控制抛光机中的浆料温度的方法和装置,例如在化学机械抛光机中。 在该方法中,首先将环境温度浆料提供到抛光垫的表面,然后在抛光垫旋转并与安装在抛光头中的基板紧密接合的情况下开始抛光过程。 通过使用至少两个温度传感器,分配的浆料的温度和抛光头的温度被确定并发送到温度控制器,温度控制器又将信号发送到用于加热浆料供应的加热器,使得浆料的温度 被馈送与抛光垫的温度相同。 然后在抛光垫的基本相同的温度下将加热的浆料溶液供给到抛光垫中,以继续抛光过程。 本发明的新型装置包括至少两个温度传感器,温度控制器和加热器或热交换器装置,用于在将浆液提供给抛光过程之前提高浆液的温度。