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111. 发明授权

US09362250B2 Die bonder and bonding method 有权
标题翻译：焊接机和接合方法
公开(公告)号：US09362250B2
公开(公告)日：2016-06-07
申请号：US13784253
申请日：2013-03-04
申请人： Fasford Technology Co., Ltd.
发明人： Ryuichi Takano , Naoki Okamoto
IPC分类号： B29C65/00 , H01L23/00
CPC分类号： H01L24/74 , H01L24/75 , H01L2224/75317 , Y10T156/10
摘要： The present invention provides a bonding device and a bonding method with a high operation ratio by solving the problems of conventional techniques.In the present invention, a collet holder grasping a used collet is inserted from a first opening portion with the upper face open; the used collet is engaged with first engagement portions provided at the first opening portion of a discarding unit; the used collet is removed from the collet holder to be discarded by lifting the collet holder; the collet holder is inserted from a second opening portion with the upper face open of a supplying unit; the uppermost unused collet among plural stacked unused collets is grasped; and the uppermost unused collet ejected from the first opening portion is attached to the collet holder.
摘要翻译：本发明通过解决现有技术的问题提供了具有高操作比的接合装置和接合方法。在本发明中，夹持使用过的夹头的夹头架从上面打开的第一开口部插入，使用过的夹头与设置在废弃单元的第一开口部的第一接合部接合; 使用过的夹头从夹头夹持器中取出，通过提起夹头固定器而被丢弃; 夹头保持器从供给单元的上表面打开的第二开口部插入; 掌握多个堆叠的未使用的夹头中最上面的未使用夹头; 并且从第一开口部分排出的最上面未使用的夹头附接到夹头保持器。

112. 发明申请

US20150333031A1 SEMICONDUCTOR DEVICE WITH MECHANICAL LOCK FEATURES BETWEEN A SEMICONDUCTOR DIE AND A SUBSTRATE 有权
标题翻译：半导体器件与衬底之间的机械锁定特性的半导体器件
公开(公告)号：US20150333031A1
公开(公告)日：2015-11-19
申请号：US14808779
申请日：2015-07-24
申请人： FREESCALE SEMICONDUCTOR, INC.
发明人： LAKSHMINARAYAN VISWANATHAN , L.M. MAHALINGAM , DAVID F. ABDO , JAYNAL A. MOLLA
IPC分类号： H01L23/00 , H01L23/31
CPC分类号： H01L24/73 , B23K20/002 , B23K20/023 , B23K20/10 , B23K20/16 , B23K20/24 , B23K35/0244 , H01L23/3107 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/75 , H01L24/83 , H01L24/95 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29164 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/32225 , H01L2224/32238 , H01L2224/32245 , H01L2224/32258 , H01L2224/48091 , H01L2224/48106 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/75315 , H01L2224/75317 , H01L2224/83192 , H01L2224/83203 , H01L2224/83365 , H01L2224/83385 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8348 , H01L2224/83484 , H01L2224/8384 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01322 , H01L2924/04541 , H01L2924/04642 , H01L2924/0503 , H01L2924/1306 , H01L2924/15724 , H01L2924/15747 , H01L2924/15786 , H01L2924/15793 , H01L2924/181 , H05K3/284 , H05K2201/09872 , H05K2201/2072 , H05K2203/1322 , H01L2924/00 , H01L2224/45099 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/05599
摘要： An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die.
摘要翻译：将半导体管芯附接到衬底的方法的实施例包括使用插入的管芯附着材料将管芯的底表面放置在衬底的顶表面上。该方法还包括使半导体管芯的顶表面和衬底的顶表面与保形结构接触，该保形结构包括非固体，压力传递材料，并向保形结构施加压力。压力通过非固体的压力传递材料传递到半导体管芯的顶表面。该方法还包括在施加压力的同时，将组件暴露于足以使管芯附着材料烧结的温度。在将管芯置于衬底上之前，可以在衬底的顶表面和/或半导体管芯的底表面上形成导电的机械锁定特征。

113. 发明授权

US08999758B2 Fixing semiconductor die in dry and pressure supported assembly processes 有权
标题翻译：将干燥和压力支撑的组装工艺中的半导体模具固定
公开(公告)号：US08999758B2
公开(公告)日：2015-04-07
申请号：US13208893
申请日：2011-08-12
申请人： Reinhold Bayerer
发明人： Reinhold Bayerer
IPC分类号： H01L21/00 , H01L21/673 , H01L21/67 , H01L21/687 , H01L23/00
CPC分类号： H01L21/67333 , H01L21/67092 , H01L21/68778 , H01L21/68785 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/97 , H01L2224/32225 , H01L2224/75315 , H01L2224/75317 , H01L2224/7598 , H01L2224/75987 , H01L2224/83005 , H01L2224/83136 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83209 , H01L2224/8382 , H01L2224/8384 , H01L2224/97 , H01L2924/15747 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： Semiconductor die are assembled on a substrate by providing the semiconductor die, substrate, and an elastically deformable foil fixture preformed with one or more sunken regions having sidewalls and a bottom, and placing the semiconductor die in the one or more sunken regions so that the foil fixture is populated with a first side of the semiconductor die facing the bottom of the one or more sunken regions and a second opposing side of the semiconductor die facing away from the bottom of the one or more sunken regions. The substrate is placed adjacent the second side of the semiconductor die with a joining material interposed between the substrate and the semiconductor die. The substrate and the populated foil fixture are pressed together at an elevated temperature and pressure via first and second pressing tool members so that the substrate is attached to the second side of the semiconductor die via the joining material.
摘要翻译：半导体管芯通过提供半导体管芯，衬底以及具有一个或多个具有侧壁和底部的凹陷区域预先形成的可弹性变形的箔固定装置组装在衬底上，并且将半导体管芯放置在一个或多个凹陷区域中，使得箔固定装置具有面向一个或多个下沉区域的底部的半导体管芯的第一侧和半导体管芯的相对于一个或多个凹陷区域的底部的第二相对侧。将衬底放置在半导体管芯的第二侧附近，其中插入在衬底和半导体管芯之间的接合材料。基板和人造箔装置通过第一和第二按压工具构件在升高的温度和压力下被压在一起，使得基板通过接合材料附接到半导体管芯的第二侧。

114. 发明授权

US08915418B2 Electronic component bonding method 有权
标题翻译：电子元件接合方法
公开(公告)号：US08915418B2
公开(公告)日：2014-12-23
申请号：US14208472
申请日：2014-03-13
申请人： Alpha Design Co., Ltd. , Tadatomo Suga , Masataka Mizukoshi
发明人： Toshiyuki Shiratori , Toru Kawasaki , Tadatomo Suga , Masataka Mizukoshi
IPC分类号： B23K31/02 , H05K3/32 , H05K13/04
CPC分类号： H05K3/32 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/50 , H01L2224/29006 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29318 , H01L2224/2932 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32013 , H01L2224/75281 , H01L2224/75315 , H01L2224/75317 , H01L2224/7598 , H01L2224/83001 , H01L2224/83192 , H01L2224/83203 , H01L2224/83205 , H01L2224/83409 , H01L2224/83411 , H01L2224/83413 , H01L2224/83418 , H01L2224/8342 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8382 , H01L2224/8384 , H01L2924/12041 , H05K13/046 , H05K2203/0173 , H05K2203/0278 , H05K2203/1131 , H01L2924/00 , H01L2924/00014 , H01L2924/00015
摘要： The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste.
摘要翻译：本发明确保电子部件的电极端子与基板的电极之间的良好的接合状态，并且实现了生产率的提高和基板的小型化。本发明包括：施加步骤，在设置在基板上的多个电极中的每一个上涂敷金属细粉末糊料; 在多个电极上分别放置具有不同高度的多个电子部件的部件放置步骤; 有机膜放置步骤，将有机膜放置在所述多个电子部件上; 有机膜压缩步骤，用挤压构件向电子部件侧施加第一压力，并均衡有机膜的高度; 以及接合步骤，在加热预定时间的同时用压缩部件向电子部件侧施加第二压力并烧结金属细粉末糊料。

115. 发明授权

US08895359B2 Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus 有权
标题翻译：半导体器件，倒装芯片安装方法和倒装芯片安装装置
公开(公告)号：US08895359B2
公开(公告)日：2014-11-25
申请号：US13056462
申请日：2009-11-06
申请人： Yoshihiro Tomura , Kazumichi Shimizu , Kentaro Kumazawa
发明人： Yoshihiro Tomura , Kazumichi Shimizu , Kentaro Kumazawa
IPC分类号： H01L21/00 , H01L21/44 , H01L23/58 , H01L23/12 , H01L23/48 , H01L23/52 , H01L29/40 , H01L21/56 , H01L23/31 , H01L23/00
CPC分类号： H01L21/563 , H01L21/565 , H01L21/568 , H01L23/3121 , H01L23/3142 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/1134 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/2919 , H01L2224/32 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/75 , H01L2224/75303 , H01L2224/75313 , H01L2224/75315 , H01L2224/75317 , H01L2224/75501 , H01L2224/81001 , H01L2224/81005 , H01L2224/81191 , H01L2224/81203 , H01L2224/81801 , H01L2224/83192 , H01L2224/83203 , H01L2224/83856 , H01L2224/9221 , H01L2924/00 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/181 , H01L2924/3025 , H01L2924/3512
摘要： A semiconductor chip (1) is flip-chip mounted on a circuit board (4) with an underfill resin (6) interposed between the semiconductor chip (1) and the circuit board (4) and a container covering the semiconductor chip (1) is bonded on the circuit board (4). At this point, the semiconductor chip (1) positioned with the underfill resin (6) interposed between the circuit board (4) and the semiconductor chip (1) is pressed and heated by a pressure-bonding tool (8); meanwhile, the surface of the underfill resin (6) protruding around the semiconductor chip (1) is pressed by the pressure-bonding tool (8) through a film (13) on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness (16a) is formed. The inner surface of the container covering the semiconductor chip (1) is bonded to the surface unevenness (16a) on the surface of the underfill resin.
摘要翻译：将半导体芯片（1）倒装安装在电路板（4）上，其中底部填充树脂（6）插入在半导体芯片（1）和电路板（4）之间以及覆盖半导体芯片（1）的容器中，被接合在电路板（4）上。此时，通过压接工具（8）对设置在电路基板（4）与半导体芯片（1）之间的底部填充树脂（6）的半导体芯片（1）进行加压加压。同时，通过压接工具（8）以周期性重复的图案形成有表面凹凸的膜（13），将半导体芯片（1）周围突出的底部填充树脂（6）的表面按压形成表面凹凸（16a）。覆盖半导体芯片（1）的容器的内表面与底部填充树脂的表面上的表面凹凸（16a）接合。

116. 发明申请

US20140033518A1 VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD 有权
标题翻译：真空热连接装置和真空热连接方法
公开(公告)号：US20140033518A1
公开(公告)日：2014-02-06
申请号：US14112330
申请日：2012-08-20
申请人： Takashi Ito , Hiroki Sato
发明人： Takashi Ito , Hiroki Sato
IPC分类号： H05K3/30
CPC分类号： H05K3/305 , B30B5/02 , B30B11/027 , B30B15/34 , B32B37/1009 , B32B37/1284 , B32B2457/12 , B32B2457/14 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/75102 , H01L2224/75315 , H01L2224/75316 , H01L2224/75317 , H01L2224/83001 , H01L2224/8309 , H01L2224/83191 , H01L2224/83203 , H01L2224/83209 , H01L2924/07802 , Y02P70/613 , Y10T29/53174 , Y10T29/53191 , H01L2924/00014 , H01L2924/00
摘要： A vacuum thermally bonding apparatus is provided, in which while air is being prevented in vacuum from entering a bonding layer, an element is thermally bonded to a substrate under vacuum by forming the bonding layer. A lower end portion of an upper frame member is gas-tightly slidably sealed to a peripheral portion of the lower plate member to form a vacuum partition wall therein, and a pressurizing release film is contacted with an upper face of the element, and thermally softened in the atmospheric pressure. A vacuum chamber is evacuated to vacuum, and the lower plate member and an intermediate member are relatively moved in an approaching direction, so that an outer peripheral portion of the pressurizing release film is gas-tightly held between the upper face of the substrate-placing table of the lower plate member and a lower face of an inner frame body.
摘要翻译：提供了一种真空热粘合装置，其中当真空中防止空气进入接合层时，通过形成接合层，将元件在真空下热粘合到基板上。上框架构件的下端部气密地可滑动地密封到下板构件的周边部分，以在其中形成真空分隔壁，并且使加压隔离膜与元件的上表面接触并热软化在大气压力下。真空室抽真空，下板构件和中间构件在接近方向上相对移动，使得加压脱模膜的外周部气密地保持在基板放置的上表面之间下板构件的台面和内框体的下表面。

117. 发明申请

US20130255878A1 PRINTED CIRCUIT BOARD MANUFACTURING METHOD 审中-公开
标题翻译：印刷电路板制造方法
公开(公告)号：US20130255878A1
公开(公告)日：2013-10-03
申请号：US13796128
申请日：2013-03-12
申请人： FUJITSU LIMITED
发明人： Tetsuya TAKAHASHI , Yasuo Moriya , Kimio Nakamura
IPC分类号： H05K3/30
CPC分类号： H05K3/305 , H01L21/563 , H01L21/566 , H01L23/562 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75304 , H01L2224/75314 , H01L2224/75317 , H01L2224/7532 , H01L2224/75745 , H01L2224/75983 , H01L2224/81191 , H01L2224/83192 , H01L2224/9211 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： A printed circuit board manufacturing method includes: supporting a substrate on a support member; disposing a semiconductor chip on an opposite side of the substrate from the support member and pressing the semiconductor chip against the substrate with a pressing member; and employing as the support member a member formed with a cavity larger than an external profile of the semiconductor chip and formed with a sloping portion towards the center of a bottom face of the cavity.
摘要翻译：印刷电路板的制造方法包括：将基板支撑在支撑部件上; 将半导体芯片从所述支撑构件设置在所述基板的相对侧上，并用挤压构件将所述半导体芯片压靠在所述基板上; 并且使用形成有比所述半导体芯片的外部轮廓大的空腔的构件作为所述支撑构件，并且形成有朝向所述空腔的底面的中心的倾斜部分。

118. 发明申请

US20130040424A1 Fixing Semiconductor Die in Dry and Pressure Supported Assembly Processes 有权
标题翻译：固定半导体模具在干燥和压力支持的组装过程
公开(公告)号：US20130040424A1
公开(公告)日：2013-02-14
申请号：US13208893
申请日：2011-08-12
申请人： Reinhold Bayerer
发明人： Reinhold Bayerer
IPC分类号： H01L21/50 , B29C69/02 , B29C67/24 , B32B37/10 , B23K37/00
CPC分类号： H01L21/67333 , H01L21/67092 , H01L21/68778 , H01L21/68785 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/97 , H01L2224/32225 , H01L2224/75315 , H01L2224/75317 , H01L2224/7598 , H01L2224/75987 , H01L2224/83005 , H01L2224/83136 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83209 , H01L2224/8382 , H01L2224/8384 , H01L2224/97 , H01L2924/15747 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： Semiconductor die are assembled on a substrate by providing the semiconductor die, substrate, and an elastically deformable foil fixture preformed with one or more sunken regions having sidewalls and a bottom, and placing the semiconductor die in the one or more sunken regions so that the foil fixture is populated with a first side of the semiconductor die facing the bottom of the one or more sunken regions and a second opposing side of the semiconductor die facing away from the bottom of the one or more sunken regions. The substrate is placed adjacent the second side of the semiconductor die with a joining material interposed between the substrate and the semiconductor die. The substrate and the populated foil fixture are pressed together at an elevated temperature and pressure via first and second pressing tool members so that the substrate is attached to the second side of the semiconductor die via the joining material.
摘要翻译：半导体管芯通过提供半导体管芯，衬底以及具有一个或多个具有侧壁和底部的凹陷区域预先形成的可弹性变形的箔固定装置组装在衬底上，并且将半导体管芯放置在一个或多个凹陷区域中，使得箔固定装置具有面向一个或多个下沉区域的底部的半导体管芯的第一侧和半导体管芯的相对于一个或多个凹陷区域的底部的第二相对侧。将衬底放置在半导体管芯的第二侧附近，其中插入在衬底和半导体管芯之间的接合材料。基板和人造箔装置通过第一和第二按压工具构件在升高的温度和压力下被压在一起，使得基板通过接合材料附接到半导体管芯的第二侧。

119. 发明申请

US20120247664A1 BONDING APPARATUS AND BONDING METHOD 有权
标题翻译：粘接装置和粘接方法
公开(公告)号：US20120247664A1
公开(公告)日：2012-10-04
申请号：US13184084
申请日：2011-07-15
申请人： Kazuhiko KOBAYASHI
发明人： Kazuhiko KOBAYASHI
IPC分类号： B29C65/18 , B32B37/02
CPC分类号： H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75102 , H01L2224/75252 , H01L2224/753 , H01L2224/75313 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/755 , H01L2224/75502 , H01L2224/75704 , H01L2224/75755 , H01L2224/75756 , H01L2224/75804 , H01L2224/7598 , H01L2224/75984 , H01L2224/81048 , H01L2224/8109 , H01L2224/81093 , H01L2224/83048 , H01L2224/8309 , H01L2224/83093 , H01L2224/83855 , H01L2224/9211 , H01L2224/95093 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/15787 , H01L2924/00
摘要： The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.
摘要翻译：接合装置能够有效地增加衬底的温度并减少在将半导体器件倒装芯片接合到衬底的工艺中位置间隙的发生和连接不良。接合装置包括：用于支撑基板的支撑单元，半导体器件已经通过非导电粘附在该基板上; 以及用于加热和加压基板的加热/加压单元，加热/加压单元具有内置的热源和夹紧面，由支撑单元支撑的基板被压在该加热/加压单元上。由支撑单元支撑的基板朝向加热/加压单元的夹紧面移动，以便通过辐射热预热基板和半导体器件。然后，将半导体器件按压到加热/加压单元的夹紧面上，以固化不导电粘合剂并将半导体器件的凸起接合到衬底的端子部分。

120. 发明申请

US20110049702A1 SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20110049702A1
公开(公告)日：2011-03-03
申请号：US12861008
申请日：2010-08-23
申请人： Syuji NEGORO
发明人： Syuji NEGORO
IPC分类号： H01L23/36 , H01L21/60 , H01L23/488
CPC分类号： H01L21/50 , H01L23/04 , H01L23/367 , H01L23/4334 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/29109 , H01L2224/2919 , H01L2224/292 , H01L2224/2929 , H01L2224/29393 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/75317 , H01L2224/75318 , H01L2224/757 , H01L2224/75754 , H01L2224/7598 , H01L2224/83002 , H01L2224/83136 , H01L2224/83191 , H01L2224/83855 , H01L2224/96 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/014 , H01L2924/14 , H01L2924/15159 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , H01L2924/16195 , H01L2924/00014 , H01L2224/83 , H01L2924/00
摘要： A method of producing a semiconductor package includes setting a radiator member on a semiconductor device that is mounted on a wiring board, said radiator member having a convex surface part on at least a part of a first surface thereof opposite to a second surface thereof to be bonded to the semiconductor device, and pressing the convex surface part of the radiator member towards the semiconductor device in order to align the radiator member and the semiconductor device automatically and to become substantially parallel to each other.
摘要翻译：一种半导体封装的制造方法，其特征在于，在安装在布线基板上的半导体装置上设置散热构件，所述散热构件在与其第二面相反的第一面的至少一部分上具有凸面部，接合到半导体器件，并且将半导体器件的凸形表面部分压向半导体器件，以便自动对准散热器部件和半导体器件并且基本上彼此平行。

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