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    • 111. 发明授权
    • Vertical transistors
    • 垂直晶体管
    • US08097910B2
    • 2012-01-17
    • US12836459
    • 2010-07-14
    • Werner Juengling
    • Werner Juengling
    • H01L27/108H01L29/94
    • H01L29/7827H01L27/1052H01L27/10823H01L27/10876H01L27/11H01L27/115H01L27/11517H01L29/66621H01L29/78
    • The invention includes a semiconductor structure having U-shaped transistors formed by etching a semiconductor substrate. In an embodiment, the source/drain regions of the transistors are provided at the tops of pairs of pillars defined by crossing trenches in the substrate. One pillar is connected to the other pillar in the pair by a ridge that extends above the surrounding trenches. The ridge and lower portions of the pillars define U-shaped channels on opposite sides of the U-shaped structure, facing a gate structure in the trenches on those opposite sides, forming a two sided surround transistor. Optionally, the space between the pillars of a pair is also filled with gate electrode material to define a three-sided surround gate transistor. One of the source/drain regions of each pair extending to a digit line and the other extending to a memory storage device, such as a capacitor. The invention also includes methods of forming semiconductor structures.
    • 本发明包括具有通过蚀刻半导体衬底形成的U形晶体管的半导体结构。 在一个实施例中,晶体管的源极/漏极区域设置在由衬底中的交叉沟槽限定的柱对对的顶部。 一个支柱通过在周围的沟槽上方延伸的脊连接到一对中的另一个柱。 柱的脊和下部在U形结构的相对侧限定U形通道,面对在那些相对侧上的沟槽中的栅极结构,形成双面环绕晶体管。 可选地,一对柱之间的空间也用栅电极材料填充以限定三面环绕栅极晶体管。 每对的源极/漏极区之一延伸到数字线,而另一个延伸到诸如电容器的存储器存储器件。 本发明还包括形成半导体结构的方法。
    • 112. 发明申请
    • Concentric or Nested Container Capacitor Structure for Integrated Circuits
    • 集成电路的同心或嵌套集成电容器结构
    • US20110303957A1
    • 2011-12-15
    • US13215529
    • 2011-08-23
    • Werner Juengling
    • Werner Juengling
    • H01L27/06
    • H01L28/91H01L27/0207H01L27/10817H01L27/10852H01L27/10855
    • Disclosed are embodiments for a container capacitor structure in which at least two container capacitors, e.g., an inner and outer container capacitor, are made concentric and nested with respect to one another. The nested capacitors are formed in one embodiment by defining a hole in a dielectric layer for the nested container capacitors in the vicinity of two capacitor contact plugs. An outer capacitor plate is formed by etching back poly 1 to leave it substantially on the vertical edges of the hole and in contact with one of the plugs. At least one sacrificial sidewall is formed on the poly 1, and poly 2 is deposited over the sidewalls to form an inner capacitor plate in contact with the other plug. The structure is planarized, the sacrificial sidewalls are removed, a capacitor dielectric is formed, and is topped with poly 3. Additional structures such as a protective layer (to prevent poly 1-to-poly 2 shorting) and a conductive layer (to strap the plugs to their respective poly layers) can also be used.
    • 公开了容器电容器结构的实施例,其中至少两个容器电容器,例如内部和外部容器电容器被制成彼此相同并嵌套。 嵌套电容器在一个实施例中通过在两个电容器接触插塞附近的嵌套容器电容器的介电层中限定一个孔而形成。 通过对poly 1进行回蚀而形成外部电容器板,使其基本上留在孔的垂直边缘上并且与其中一个插塞接触。 在聚合物1上形成至少一个牺牲侧壁,并且聚合物2沉积在侧壁上以形成与另一个插塞接触的内部电容器板。 该结构被平坦化,牺牲侧壁被去除,形成电容器电介质并且被顶部覆盖3.另外的结构例如保护层(以防止聚1对聚2短路)和导电层 插塞到它们各自的多层)也可以使用。
    • 113. 发明授权
    • Vertical gated access transistor
    • 垂直门控存取晶体管
    • US08039348B2
    • 2011-10-18
    • US12785712
    • 2010-05-24
    • Werner Juengling
    • Werner Juengling
    • H01L21/336H01L21/283
    • H01L27/088H01L21/76229H01L21/76232H01L21/823431H01L21/823437H01L21/823481H01L27/10823H01L27/10826H01L27/10876H01L27/10879H01L27/10894H01L29/66545H01L29/66795H01L29/7827H01L29/7851H01L29/7853
    • According to one embodiment of the present invention, a method of forming an apparatus comprises forming a plurality of deep trenches and a plurality of shallow trenches in a first region of a substrate. At least one of the shallow trenches is positioned between two deep trenches. The plurality of shallow trenches and the plurality of deep trenches are parallel to each other. The method further comprises depositing a layer of conductive material over the first region and a second region of the substrate. The method further comprises etching the layer of conductive material to define a plurality of lines separated by a plurality of gaps over the first region of the substrate, and a plurality of active device elements over the second region of the substrate. The method further comprises masking the second region of the substrate. The method further comprises removing the plurality of lines from the first region of the substrate, thereby creating a plurality of exposed areas from which the plurality of lines were removed. The method further comprises etching a plurality of elongate trenches in the plurality of exposed areas while the second region of the substrate is masked.
    • 根据本发明的一个实施例,一种形成装置的方法包括在衬底的第一区域中形成多个深沟槽和多个浅沟槽。 至少一个浅沟槽位于两个深沟槽之间。 多个浅沟槽和多个深沟槽彼此平行。 该方法还包括在衬底的第一区域和第二区域上沉积导电材料层。 该方法还包括蚀刻导电材料层以限定在衬底的第一区域上的多个间隙分开的多条线,以及在衬底的第二区域上方的多个有源器件元件。 该方法还包括掩蔽衬底的第二区域。 该方法还包括从衬底的第一区域去除多条线,从而形成多条暴露区域,多条线从该区域被去除。 该方法还包括在衬底的第二区域被掩蔽的同时蚀刻多个暴露区域中的多个细长沟槽。
    • 116. 发明授权
    • Concentric or nested container capacitor structure for integrated circuits
    • 用于集成电路的同心或嵌套容器电容器结构
    • US07807541B2
    • 2010-10-05
    • US11449539
    • 2006-06-07
    • Werner Juengling
    • Werner Juengling
    • H01L21/20
    • H01L28/91H01L27/0207H01L27/10817H01L27/10852H01L27/10855
    • Disclosed are embodiments for a container capacitor structure in which at least two container capacitors, e.g., an inner and outer container capacitor, are made concentric and nested with respect to one another. The nested capacitors are formed in one embodiment by defining a hole in a dielectric layer for the nested container capacitors in the vicinity of two capacitor contact plugs. An outer capacitor plate is formed by etching back poly 1 to leave it substantially on the vertical edges of the hole and in contact with one of the plugs. At least one sacrificial sidewall is formed on the poly 1, and poly 2 is deposited over the sidewalls to form an inner capacitor plate in contact with the other plug. The structure is planarized, the sacrificial sidewalls are removed, a capacitor dielectric is formed, and is topped with poly 3. Additional structures such as a protective layer (to prevent poly 1-to-poly 2 shorting) and a conductive layer (to strap the plugs to their respective poly layers) can also be used.
    • 公开了容器电容器结构的实施例,其中至少两个容器电容器,例如内部和外部容器电容器被制成彼此相同并嵌套。 嵌套电容器在一个实施例中通过在两个电容器接触插塞附近的嵌套容器电容器的介电层中限定一个孔而形成。 通过对poly 1进行回蚀而形成外部电容器板,使其基本上留在孔的垂直边缘上并且与其中一个插塞接触。 在聚合物1上形成至少一个牺牲侧壁,并且聚合物2沉积在侧壁上以形成与另一个插塞接触的内部电容器板。 该结构被平坦化,牺牲侧壁被去除,形成电容器电介质并且被顶部覆盖3.另外的结构例如保护层(以防止聚1对聚2短路)和导电层 插塞到它们各自的多层)也可以使用。
    • 120. 发明申请
    • DRAM CELLS WITH VERTICAL TRANSISTORS
    • 具有垂直晶体管的DRAM电池
    • US20090096000A1
    • 2009-04-16
    • US12339610
    • 2008-12-19
    • Werner Juengling
    • Werner Juengling
    • H01L27/108H01L29/76
    • H01L29/7827H01L27/1052H01L27/10823H01L27/10876H01L27/11H01L27/115H01L27/11517H01L29/66621H01L29/78
    • The invention includes a semiconductor structure having U-shaped transistors formed by etching a semiconductor substrate. In an embodiment, the source/drain regions of the transistors are provided at the tops of pairs of pillars defined by crossing trenches in the substrate. One pillar is connected to the other pillar in the pair by a ridge that extends above the surrounding trenches. The ridge and lower portions of the pillars define U-shaped channels on opposite sides of the U-shaped structure, facing a gate structure in the trenches on those opposite sides, forming a two sided surround transistor. Optionally, the space between the pillars of a pair is also filled with gate electrode material to define a three-sided surround gate transistor. One of the source/drain regions of each pair extending to a digit line and the other extending to a memory storage device, such as a capacitor. The invention also includes methods of forming semiconductor structures.
    • 本发明包括具有通过蚀刻半导体衬底形成的U形晶体管的半导体结构。 在一个实施例中,晶体管的源极/漏极区域设置在由衬底中的交叉沟槽限定的柱对对的顶部。 一个支柱通过在周围的沟槽上方延伸的脊连接到一对中的另一个柱。 柱的脊和下部在U形结构的相对侧限定U形通道,面对在那些相对侧上的沟槽中的栅极结构,形成双面环绕晶体管。 可选地,一对柱之间的空间也用栅电极材料填充以限定三面环绕栅极晶体管。 每对的源极/漏极区之一延伸到数字线,而另一个延伸到诸如电容器的存储器存储器件。 本发明还包括形成半导体结构的方法。