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    • 111. 发明申请
    • FLASH MEMORY DEVICES HAVING MULTILAYERED INTER-GATE DIELECTRIC LAYERS INCLUDING METAL OXIDE LAYERS AND METHODS OF MANUFACTURING THE SAME
    • 具有包括金属氧化物层的多层间隙介电层的闪存存储器件及其制造方法
    • US20070026608A1
    • 2007-02-01
    • US11383102
    • 2006-05-12
    • Han-Mei ChoiYoung-Geun ParkSeung-Hwan LeeYoung-Sun Kim
    • Han-Mei ChoiYoung-Geun ParkSeung-Hwan LeeYoung-Sun Kim
    • H01L21/336
    • H01L27/115H01L27/11519H01L27/11521
    • Embodiments of the present invention provide methods of manufacturing memory devices including forming floating gate patterns on a semiconductor substrate having active regions thereon, wherein the floating gate patterns cover the active regions and are spaced apart from the active regions; forming an inter-gate dielectric layer on the semiconductor substrate having the floating gate patterns by alternately stacking a zirconium oxide layer and an aluminum oxide layer at least once, wherein the inter-gate dielectric layer is formed by a deposition process using O3 gas as a reactive gas; forming a control gate layer on the inter-gate dielectric layer; and forming a control gate, an inter-gate dielectric layer pattern and a floating gate by sequentially patterning the control gate layer, the inter-gate dielectric layer and the floating gate pattern, wherein the inter-gate dielectric layer pattern and the control gate are sequentially stacked across the active regions, and the floating gate is formed between the active regions and the inter-gate dielectric layer pattern Memory devices, such as flash memory devices are also provided.
    • 本发明的实施例提供了制造存储器件的方法,包括在其上具有有源区的半导体衬底上形成浮置栅极图案,其中浮置栅极图案覆盖有源区并与有源区间隔开; 通过将氧化锆层和氧化铝层交替层叠至少一次来形成具有浮置栅极图案的半导体衬底上的栅极间电介质层,其中栅极间电介质层通过使用O 2的沉积工艺形成, 3气体作为反应气体; 在所述栅极间电介质层上形成控制栅极层; 以及通过对控制栅极层,栅极间电介质层和浮置栅极图案顺序构图来形成控制栅极,栅极间电介质层图案和浮置栅极,其中栅极间电介质层图案和控制栅极是 顺序堆叠在有源区上,并且在有源区之间形成浮栅,并且还提供诸如闪存器件的栅极间电介质层图案存储器件。
    • 114. 发明授权
    • Apparatus and method for compensating for analog quadrature modulation error
    • 用于补偿模拟正交调制误差的装置和方法
    • US07039124B2
    • 2006-05-02
    • US10977498
    • 2004-11-01
    • Seung-Hwan Lee
    • Seung-Hwan Lee
    • H04L25/03
    • H03F1/3241
    • An apparatus and method for compensating for an analog quadrature modulation (AQM) error in a linearization apparatus for AQM-modulating a digital predistorted signal and outputting the AQM-modulated signal through a high-power amplifier. In the apparatus and method, a gain/phase error estimator predicts a gain/phase imbalance error caused by AQM on the predistorted signal. A Direct Current (DC) offset estimator predicts a DC offset for a feedback signal from the high-power amplifier. An error compensator compensates for the digital predistorted signal for a DC offset signal output from the DC offset estimator, and then compensates for a gain/phase error output from the gain/phase error estimator.
    • 一种用于补偿用于AQM调制数字预失真信号并通过高功率放大器输出AQM调制信号的线性化装置中的模拟正交调制(AQM)误差的装置和方法。 在装置和方法中,增益/相位误差估计器预测由AQM对预失真信号引起的增益/相位不平衡误差。 直流(DC)偏移估计器预测来自高功率放大器的反馈信号的直流偏移。 误差补偿器补偿从DC偏移估计器输出的DC偏移信号的数字预失真信号,然后补偿来自增益/相位误差估计器的增益/相位误差输出。
    • 117. 发明授权
    • Method of forming an aluminum film for use in manufacturing a semiconductor device
    • 形成用于制造半导体器件的铝膜的方法
    • US06531388B2
    • 2003-03-11
    • US10201784
    • 2002-07-25
    • Jong-Yong BaeSeung-Hwan Lee
    • Jong-Yong BaeSeung-Hwan Lee
    • H01L214763
    • H01L21/76838
    • A method of manufacturing a semiconductor device is capable of preventing a local delamination at the interface between an aluminum film and an anti-reflective layer formed thereon. After aluminum is deposited on a substrate, the aluminum film is slowly cooled. Then, the substrate is left as is for more than 3 minutes before a venting process takes place in which thermal energy is generated. Then, an anti-reflective layer is formed on the aluminum film. Thermal stress in the aluminum film is relieved by the slow cooling of the aluminum film and the delay before the venting process. Accordingly, when a thermal process is carried out after the anti-reflective layer is formed on the aluminum film, little shear stress is generated at the interface between the aluminum film and the anti-reflective layer.
    • 制造半导体器件的方法能够防止铝膜与其上形成的抗反射层之间的界面处的局部分层。 铝沉积在基板上之后,铝膜被缓慢冷却。 然后,在发生热能的排气过程之前,将衬底留下3分钟以上。 然后,在铝膜上形成抗反射层。 通过铝膜的缓慢冷却和排气过程之间的延迟,铝膜中的热应力得以缓解。 因此,当在铝膜上形成抗反射层之后进行热处理时,在铝膜和抗反射层之间的界面处产生很小的剪切应力。