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    • 111. 发明授权
    • Plasma reactor control by translating desired values of M plasma parameters to values of N chamber parameters
    • 通过将M等离子体参数的期望值转换为N室参数的值来等离子体反应器控制
    • US07901952B2
    • 2011-03-08
    • US11609024
    • 2006-12-11
    • Daniel J. HoffmanEzra Robert Gold
    • Daniel J. HoffmanEzra Robert Gold
    • H01L21/302
    • H01J37/3299H01J37/32174H01J37/32935
    • The invention concerns a method of processing a wafer in a plasma reactor chamber by controlling plural chamber parameters in accordance with desired values of plural plasma parameters. The method includes concurrently translating a set of M desired values for M plasma parameters to a set of N values for respective N chamber parameters. The M plasma parameters are selected from a group including wafer voltage, ion density, etch rate, wafer current, etch selectivity, ion energy and ion mass. The N chamber parameters are selected from a group including source power, bias power, chamber pressure, inner magnet coil current, outer magnet coil current, inner zone gas flow rate, outer zone gas flow rate, inner zone gas composition, outer zone gas composition. The method further includes setting the N chamber parameters to the set of N values.
    • 本发明涉及通过根据多个等离子体参数的期望值来控制多个室参数来处理等离子体反应器室中的晶片的方法。 该方法包括将用于M个等离子体参数的一组M个期望值同时翻译成用于各N个腔室参数的一组N个值。 M等离子体参数从包括晶片电压,离子密度,蚀刻速率,晶片电流,蚀刻选择性,离子能量和离子质量的组中选择。 N室参数选自源功率,偏置功率,室内压力,内部电磁线圈电流,外部电磁线圈电流,内部区域气体流量,外部区域气体流量,内部区域气体组成,外部区域气体组成 。 该方法还包括将N个室参数设置为N个值的集合。
    • 119. 发明授权
    • Method of determining plasma ion density, wafer voltage, etch rate and wafer current from applied bias voltage and current
    • 从施加的偏置电压和电流确定等离子体离子密度,晶圆电压,蚀刻速率和晶片电流的方法
    • US07553679B2
    • 2009-06-30
    • US11508346
    • 2006-08-23
    • Daniel J. Hoffman
    • Daniel J. Hoffman
    • G01R31/26
    • H01J37/32174H01J37/32935
    • Plasma parameters such as plasma ion density, wafer voltage, etch rate and wafer current in the chamber are determined from external measurements on the applied RF bias electrical parameters such as voltage and current. The method includes sensing RF parameters corresponding to an input impedance, an input current and an input voltage at the input of the impedance match element to a transmission line coupled between the bias generator and the wafer pedestal. The method continues by computing a junction admittance of a junction between the transmission line and the electrode within the wafer pedestal from the input impedance, input current and input voltage and from parameters of the transmission line. The method further includes providing shunt electrical quantities of a shunt capacitance between the electrode and a ground plane, and providing load electrical quantities of a load capacitance between the electrode and a wafer on the pedestal. The method further includes computing at least one of the plasma parameters from the junction admittance, the shunt electrical quantities, the load electrical quantities and a frequency of RF bias power applied to the electrode.
    • 等离子体参数,例如等离子体离子密度,晶圆电压,蚀刻速率和晶片电流在室内的测量取决于施加的RF偏置电气参数(如电压和电流)的外部测量。 该方法包括将阻抗匹配元件输入端的输入阻抗,输入电流和输入电压对应的RF参数传感到耦合在偏置发生器和晶片基座之间的传输线。 该方法通过从输入阻抗,输入电流和输入电压以及传输线的参数计算晶片基座内的传输线和电极之间的结的接合导纳而继续。 该方法还包括在电极和接地平面之间提供并联电容的分流电量,并且在电极和基座上的晶片之间提供负载电量的负载电容量。 该方法还包括从接合导纳,分流电量,负载电量和施加到电极的RF偏置功率的频率来计算等离子体参数中的至少一个。