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    • 101. 发明申请
    • OPERATING METHOD OF A NON-VOLATILE MEMORY
    • 非易失性存储器的操作方法
    • US20070263448A1
    • 2007-11-15
    • US11778657
    • 2007-07-17
    • Wei-Zhe WongChing-Sung YangChih-Chen Cho
    • Wei-Zhe WongChing-Sung YangChih-Chen Cho
    • G11C11/34G11C16/04
    • G11C16/0416H01L27/115H01L27/11521H01L29/40114H01L29/42328H01L29/66825H01L29/7887
    • A non-volatile memory is provided. A substrate has at least two isolation structures therein to define an active area. A well is located in the substrate. A shallow doped region is located in the well. At least two stacked gate structures are located on the substrate. Pocket doped regions are located in the substrate at the peripheries of the stacked gate structures; each of the pocket doped regions extends under the stacked gate structure. Drain regions are located in the pocket doped regions at the peripheries of the stacked gate structures. An auxiliary gate layer is located on the substrate between the stacked gate structures. A gate dielectric layer is located between the auxiliary gate layer and the substrate and between the auxiliary gate layer and the stacked gate structure. Plugs are located on the substrate and extended to connect with the pocket doped region and the drain regions therein.
    • 提供非易失性存储器。 衬底在其中具有至少两个隔离结构以限定有效区域。 一个井位于基板中。 浅掺杂区域位于井中。 至少两个堆叠的栅极结构位于衬底上。 袋状掺杂区域位于堆叠栅极结构的周边的衬底中; 每个口袋掺杂区域在堆叠的栅极结构之下延伸。 漏极区位于堆叠栅极结构的周边的口袋掺杂区域中。 辅助栅极层位于堆叠栅极结构之间的衬底上。 栅极电介质层位于辅助栅极层和衬底之间,并且位于辅助栅极层和堆叠栅极结构之间。 插头位于衬底上并延伸以与其中的口袋掺杂区域和漏极区域连接。
    • 102. 发明授权
    • Programmable and erasable digital switch device and fabrication method and operating method thereof
    • 可编程和可擦除数字开关装置及其制造方法及其操作方法
    • US07291882B2
    • 2007-11-06
    • US11162893
    • 2005-09-27
    • Ching-Sung YangWei-Zhe Wong
    • Ching-Sung YangWei-Zhe Wong
    • H01L21/8247
    • H01L27/115H01L27/11521
    • A programmable and erasable digital switch device is provided. An N-type memory transistor and a P-type memory transistor are formed over a substrate. The N-type memory transistor includes a first N-type doped region, a second N-type doped region, a first charge storage layer and a first control gate. The P-type memory transistor includes a first P-type doped region, a second P-type doped region, a second charge storage layer and a second control gate. A common bit line doped region is formed between the N-type memory transistor and the P type memory transistor and electrically connects the first N-type region to the second P-type doped region. A word line electrically connects the first control gate to the second control gate.
    • 提供可编程和可擦除的数字开关装置。 在衬底上形成N型存储晶体管和P型存储晶体管。 N型存储晶体管包括第一N型掺杂区,第二N型掺杂区,第一电荷存储层和第一控制栅极。 P型存储晶体管包括第一P型掺杂区,第二P型掺杂区,第二电荷存储层和第二控制栅极。 在N型存储晶体管和P型存储晶体管之间形成公共位线掺杂区域,并将第一N型区域电连接到第二P型掺杂区域。 字线将第一控制栅极电连接到第二控制栅极。
    • 103. 发明申请
    • NON-VOLATILE MEMORY CELL, FABRICATION METHOD AND OPERATING METHOD THEREOF
    • 非挥发性记忆体,制造方法及其操作方法
    • US20060039200A1
    • 2006-02-23
    • US10907031
    • 2005-03-17
    • Ching-Sung YangWei-Zhe WongChih-Chen Cho
    • Ching-Sung YangWei-Zhe WongChih-Chen Cho
    • G11C7/10
    • G11C16/0483G11C16/0466H01L27/115H01L27/11519H01L27/11568
    • A non-volatile memory including a plurality of memory units is provided. Each of the memory units includes a first memory cell and a second memory cell. The first memory cell is disposed over the substrate. The second memory cell is disposed next to the sidewall of the first memory cell and over the substrate. The first memory cell includes a first gate disposed over the substrate, a first composite dielectric layer disposed between the first gate and the substrate. The second memory cell includes a second gate disposed over the substrate and a second composite dielectric layer disposed between the second gate and the substrate and between the second gate and the first memory cell. Each of the first and second composite dielectric layers includes a bottom dielectric layer, a charge-trapping layer and a top dielectric layer.
    • 提供包括多个存储单元的非易失性存储器。 每个存储单元包括第一存储单元和第二存储单元。 第一存储单元设置在衬底上。 第二存储单元设置在第一存储单元的侧壁旁边且在衬底上。 第一存储单元包括设置在衬底上的第一栅极,设置在第一栅极和衬底之间的第一复合介电层。 第二存储单元包括设置在衬底上的第二栅极和设置在第二栅极和衬底之间以及第二栅极和第一存储单元之间的第二复合电介质层。 第一和第二复合电介质层中的每一个包括底部电介质层,电荷俘获层和顶部电介质层。
    • 105. 发明授权
    • EEPROM with source line voltage stabilization mechanism
    • EEPROM具有源极线电压稳定机制
    • US06888190B2
    • 2005-05-03
    • US10707080
    • 2003-11-20
    • Ching-Sung YangShih-Jye ShenChing-Hsiang Hsu
    • Ching-Sung YangShih-Jye ShenChing-Hsiang Hsu
    • G11C16/04H01L21/8247H01L27/115H01L29/788H01L29/76H01L29/78
    • H01L27/115G11C16/0433G11C16/0483H01L27/11521H01L27/11524H01L29/7883
    • A low-voltage nonvolatile memory array includes an N type semiconductor substrate having a memory region. A deep P well is formed in the semiconductor substrate. A cell N well is located within the memory region in the semiconductor substrate. The cell N well is situated above the deep ion well. A shallow P well serving as a buried bit line is doped within the cell ion well. The shallow P well is isolated by an STI layer, wherein the STI layer has a thickness greater than a well depth of the shallow ion well. At least one memory transistor with a stacked gate, a source, and a drain is formed on the shallow ion well. The source of the memory transistor is electrically coupled to the cell N well to induce a capacitor between the cell N well and the deep P well during a read operation, thereby avoiding read current bounce or potential power crash. A bit line overlies the memory transistor and is electrically connected to the drain of the memory transistor via a bit line contact plug short-circuiting the drain of the memory transistor and the shallow P well.
    • 低压非易失性存储器阵列包括具有存储区域的N型半导体衬底。 在半导体衬底中形成深P阱。 电池N阱位于半导体衬底的存储区内。 细胞N阱位于深离子阱的上方。 作为掩埋位线的浅P阱掺杂在细胞离子阱内。 浅P阱由STI层隔离,其中STI层的厚度大于浅离子阱的阱深度。 在浅离子阱上形成至少一个具有堆叠栅极,源极和漏极的存储晶体管。 存储晶体管的源极电耦合到电池N,以在读取操作期间在电池N阱和深P阱之间感应电容器,从而避免读取电流反弹或潜在功率崩溃。 位线覆盖存储晶体管,并通过位线接触插头将存储晶体管的漏极电连接到短路存储晶体管的漏极和浅P阱。