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    • 108. 发明专利
    • FORMATION OF PATTERN
    • JPH03104010A
    • 1991-05-01
    • JP23993889
    • 1989-09-18
    • HITACHI LTD
    • TAKEMOTO KAZUNARIAMATATSU ATSUSHIKITO MAKOTO
    • G11B5/31H01L21/302H01L21/3065
    • PURPOSE:To form patterns with higher accuracy by using the patterns trans ferred to a layer mainly consisting of C as a mask. CONSTITUTION:A 1st layer 3 contg. Cu is formed by a vapor deposition method, etc., on a thin film 2 to be worked on a substrate 1. The 2nd layer 4 mainly consisting of the C is similarly formed on the layer 3. The 3rd layer 5 which is sensitive to radiations and contains Si is formed on the layer 4 by the vapor deposition method, such as wet coating method, plasma polymn. method and vacuum vapor deposition method. The layer 5 is formed to the prescribed patterns by an ordinary lithography stage and with these patterns as a mask, the layer 4 is patterned by a dry etching method using O2. The etching rate of the layer 5 is required to be lower than at least the etching rate of the layer 4. The layer 5 is removed by a photoresist peeling agent. The layer 3 and the thin film 2 are patterned by ion etching and ion milling of excellent anisotropy with the patterns formed on the layer 4 as a mask. The layers 4, 3 are removed at need. The formation of the patterns with the higher accuracy is thus possible.