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101. 发明授权

US07964420B2 LED chip package structure with an embedded ESD function and method for manufacturing the same 有权
公开(公告)号：US07964420B2
公开(公告)日：2011-06-21
申请号：US12876408
申请日：2010-09-07
申请人： Bily Wang , Ping-Chou Yang , Jia-Wen Chen
发明人： Bily Wang , Ping-Chou Yang , Jia-Wen Chen
IPC分类号： H01L33/48 , H01L21/00 , H02H9/00
CPC分类号： H01L25/167 , H01L2224/48091 , H01L2224/48247 , Y10T29/41 , H01L2924/00014
摘要： An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.

102. 发明授权

US07898663B2 Uniform light generating system for testing an image-sensing device and method of using the same 有权
标题翻译：用于测试图像感测装置的均匀光产生系统及其使用方法
公开(公告)号：US07898663B2
公开(公告)日：2011-03-01
申请号：US12285191
申请日：2008-09-30
申请人： Bily Wang , Kuei-Pao Chen , Chih-Ming Wang
发明人： Bily Wang , Kuei-Pao Chen , Chih-Ming Wang
IPC分类号： G01J3/40 , G01B9/00
CPC分类号： G01J1/10 , G01J1/0271 , G01J1/04 , G01J1/0411 , G01J1/0422 , G01J1/08 , G01J2001/083 , G01M11/0264 , G02B19/0028 , G02B19/0066 , G02B27/0977 , G02B27/0994
摘要： A uniform light generating system for testing an image-sensing device includes a light-generating unit, a light-transmitting unit, a light-diffusing unit, and a lens unit. The light-generating unit has a substrate and a plurality of light-emitting elements electrically disposed on the substrate. The light-transmitting unit has one side communicated with the light-generating unit for receiving and uniformizing light beams projected from the light-emitting elements. The light-diffusing unit has one side disposed on the other side of the light-transmitting unit for receiving and diffusing the light beams that have passed through the light-transmitting unit. The lens unit is disposed on the other side of the light-diffusing unit for transmitting the light beams that have passed through the light-diffusing unit to the image-sensing device.
摘要翻译：用于测试图像感测装置的均匀光产生系统包括发光单元，光发射单元，光漫射单元和透镜单元。光产生单元具有基板和电气设置在基板上的多个发光元件。光发射单元具有与发光单元连通的用于接收并均匀化从发光元件投射的光束的一侧。光漫射单元的一侧设置在透光单元的另一侧，用于接收并扩散已经通过光发射单元的光束。透镜单元设置在光漫射单元的另一侧，用于将已经通过光漫射单元的光束传输到图像感测装置。

103. 发明申请

US20100176502A1 Wafer level vertical diode package structure and method for making the same 有权
标题翻译：晶圆级垂直二极管封装结构及制作方法
公开(公告)号：US20100176502A1
公开(公告)日：2010-07-15
申请号：US12318876
申请日：2009-01-12
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
发明人： Bily Wang , Sung-Yi Hsiao , Jack Chen
IPC分类号： H01L23/498 , H01L21/82
CPC分类号： H01L29/0657 , H01L21/6836 , H01L23/31 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/96 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05 , H01L2224/12105 , H01L2224/13099 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01011 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01046 , H01L2924/0107 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/00015 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A wafer level vertical diode package structure includes a first semiconductor layer, a second semiconductor layer, an insulative unit, a first conductive structure, and a second conductive structure. The second semiconductor layer is connected with one surface of the first semiconductor layer. The insulative unit is disposed around a lateral side of the first semiconductor layer and a lateral side of the second semiconductor layer. The first conductive structure is formed on a top surface of the first semiconductor layer and on one lateral side of the insulative layer. The second conductive structure is formed on a top surface of the second semiconductor layer and on another opposite lateral side of the insulative layer.
摘要翻译：晶圆级垂直二极管封装结构包括第一半导体层，第二半导体层，绝缘单元，第一导电结构和第二导电结构。第二半导体层与第一半导体层的一个表面连接。绝缘单元围绕第一半导体层的侧面和第二半导体层的横向侧设置。第一导电结构形成在第一半导体层的顶表面和绝缘层的一个侧面上。第二导电结构形成在第二半导体层的顶表面上，在绝缘层的另一个相对的侧面上。

104. 发明申请

US20090213378A1 Method for calculating out an optimum arrangement pitch between each two LED chip package units 有权
标题翻译：用于计算每两个LED芯片封装单元之间的最佳布置间距的方法
公开(公告)号：US20090213378A1
公开(公告)日：2009-08-27
申请号：US12285178
申请日：2008-09-30
申请人： Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
发明人： Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
IPC分类号： G01B11/00
CPC分类号： G01B11/14
摘要： A method for calculating out an optimum arrangement pitch between each two LED chip package units, including: providing a backlight module with a predetermined brightness value and a predetermined material information that a customer needs; determining what brightness level and amount of LED chip package units need to be used by a designer according to the brightness value and the material information of the backlight module; and dividedly arranging the LED chip package units determined by the designer on a light-entering area of the backlight module in order to define what the optimum arrangement pitch between each two LED chip package units is.
摘要翻译：一种用于计算每个两个LED芯片封装单元之间的最佳布置间距的方法，包括：提供具有预定亮度值的背光模块和客户需要的预定材料信息; 根据背光模块的亮度值和材料信息确定设计者需要使用什么亮度级别和数量的LED芯片封装单元; 并且将由设计者确定的LED芯片封装单元分开地布置在背光模块的光进入区域上，以便限定每个两个LED芯片封装单元之间的最佳布置间距。

105. 发明申请

US20090190124A1 Uniform light generating system for testing an image-sensing device and method of using the same 有权
标题翻译：用于测试图像感测装置的均匀光产生系统及其使用方法
公开(公告)号：US20090190124A1
公开(公告)日：2009-07-30
申请号：US12285191
申请日：2008-09-30
申请人： Bily Wang , Kuei-Pao Chen , Chih-Ming Wang
发明人： Bily Wang , Kuei-Pao Chen , Chih-Ming Wang
IPC分类号： G01J1/10 , G02B27/40
CPC分类号： G01J1/10 , G01J1/0271 , G01J1/04 , G01J1/0411 , G01J1/0422 , G01J1/08 , G01J2001/083 , G01M11/0264 , G02B19/0028 , G02B19/0066 , G02B27/0977 , G02B27/0994
摘要： A uniform light generating system for testing an image-sensing device includes a light-generating unit, a light-transmitting unit, a light-diffusing unit, and a lens unit. The light-generating unit has a substrate and a plurality of light-emitting elements electrically disposed on the substrate. The light-transmitting unit has one side communicated with the light-generating unit for receiving and uniformizing light beams projected from the light-emitting elements. The light-diffusing unit has one side disposed on the other side of the light-transmitting unit for receiving and diffusing the light beams that have passed through the light-transmitting unit. The lens unit is disposed on the other side of the light-diffusing unit for transmitting the light beams that have passed through the light-diffusing unit to the image-sensing device.
摘要翻译：用于测试图像感测装置的均匀光产生系统包括发光单元，光发射单元，光漫射单元和透镜单元。光产生单元具有基板和电气设置在基板上的多个发光元件。光发射单元具有与发光单元连通的用于接收并均匀化从发光元件投射的光束的一侧。光漫射单元的一侧设置在透光单元的另一侧，用于接收并扩散已经通过光发射单元的光束。透镜单元设置在光漫射单元的另一侧，用于将已经通过光漫射单元的光束传输到图像感测装置。

106. 发明申请

US20080000120A1 Color-mixture display unit and image display apparatus using the same 有权
标题翻译：混色显示单元和使用其的图像显示装置
公开(公告)号：US20080000120A1
公开(公告)日：2008-01-03
申请号：US11476165
申请日：2006-06-28
申请人： Bily Wang , Hui-Chung Lin
发明人： Bily Wang , Hui-Chung Lin
IPC分类号： G09F13/00
CPC分类号： G09F13/22
摘要： The present invention is related to a color-mixture display unit and an image display apparatus using the same, wherein the image display apparatus includes at least one color-mixture pixel which is pre-disposed at plates of a light box so that a pattern is formed. Each of the color-mixture pixels is equipped with a red filter, a green filter and a blue filter, or equipped with a black filter or equipped with a transparent filter. At least one color-mixture LED is disposed within the light box and provides a backlight for the color-mixture pixel. In this regard, the color-mixture LEDs are controlled by an image controller and provide various color light beams with the color-mixture pixels. In addition, arrangement of each color filter within the color-mixture pixel is utilized so that color-mixture effect of dynamic image is shown.
摘要翻译：本发明涉及一种彩色混合显示单元和使用该彩色混合显示单元的图像显示装置，其中该图像显示装置包括至少一个颜色混合像素，其预先设置在灯箱的板上，使得图案是形成。每个混色像素配备有红色滤光器，绿色滤光片和蓝色滤光片，或配备有黑色滤光片或配有透明滤光片。至少一个颜色混合LED设置在灯箱内，并提供用于混色像素的背光。在这方面，混色LED由图像控制器控制并且提供具有颜色混合像素的各种彩色光束。此外，利用颜色混合像素内的每个滤色器的布置，以显示动态图像的混色效果。

107. 发明申请

US20060252173A1 Method for manufacturing photoelectric package having control chip 审中-公开
标题翻译：具有控制芯片的光电封装制造方法
公开(公告)号：US20060252173A1
公开(公告)日：2006-11-09
申请号：US11416161
申请日：2006-05-03
申请人： Bily Wang , John Lin , Shih-Yu Wu
发明人： Bily Wang , John Lin , Shih-Yu Wu
IPC分类号： H01L21/00
CPC分类号： H01L25/167 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/01322 , H01L2924/00014 , H01L2924/00
摘要： A manufacturing method for a photoelectric package structure having a control chip is proposed. The photoelectric package structure concentrates light emitted therefrom, prevents external light interference and can be applied for advertising signs and backlight modules. Using the present invention increases the defect-free ratio and production quality. Applying the present invention for packaging light-emitting diode (LED) or optical sensor chips allows the necessary light-emitting requirements of electronic chips to be easily met. The package structure of the present invention is superior to conventional ones and the installation of the control chip doesn't reduce the light-emitting intensity. The major innovation of the present invention is disposing a photoelectric chip (or multiple photoelectric chips) on a control chip and then installing the control chip upon a substrate. Thus, installation-of the components is more convenient. Furthermore, an external frame or optical gratings can also be included to prevent external light interference.
摘要翻译：提出了一种具有控制芯片的光电封装结构的制造方法。光电封装结构集中从其发出的光，防止外部光线干扰，并可应用于广告标牌和背光模块。使用本发明增加了无缺陷比和生产质量。应用本发明用于封装发光二极管（LED）或光学传感器芯片允许容易地满足电子芯片的必要的发光要求。本发明的封装结构优于常规封装结构，并且控制芯片的安装不会降低发光强度。本发明的主要创新是在控制芯片上设置光电芯片（或多个光电芯片），然后将控制芯片安装在基板上。因此，组件的安装更方便。此外，还可以包括外部框架或光栅以防止外部光线干扰。

108. 发明申请

US20050200577A1 Circuit for driving LED display 有权
标题翻译： LED显示屏驱动电路
公开(公告)号：US20050200577A1
公开(公告)日：2005-09-15
申请号：US10795310
申请日：2004-03-09
申请人： Bily Wang , John Lin
发明人： Bily Wang , John Lin
IPC分类号： G09G3/32
CPC分类号： G09G3/32 , G09G2300/06 , G09G2310/0205 , G09G2310/0272
摘要： A circuit for driving a light-emitting diode (LED) display has multiple driving modes. The circuit has a control unit for outputting a mode-switching signal, a scan driving chip connecting with the control unit for providing a scan signal, a data driving chip connecting with the control unit and the scan driving chip for providing a data signal, a row control interface connecting with the row line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the row control interface, and a column control interface connecting with the column line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the column control interface.
摘要翻译：用于驱动发光二极管（LED）显示器的电路具有多种驱动模式。电路具有用于输出模式切换信号的控制单元，与用于提供扫描信号的控制单元连接的扫描驱动芯片，与控制单元连接的数据驱动芯片和用于提供数据信号的扫描驱动芯片，与行线连接的行控制接口，控制单元，扫描驱动芯片和数据驱动芯片，以接收用于切换行控制接口的输入端的模式切换信号，以及与列线连接的列控制接口，控制单元，扫描驱动芯片和数据驱动芯片，以接收用于切换列控制接口的输入端的模式切换信号。

109. 发明授权

US06794686B2 White light source 有权
标题翻译：白光源
公开(公告)号：US06794686B2
公开(公告)日：2004-09-21
申请号：US10464111
申请日：2003-06-19
申请人： Bill Chang , Bily Wang
发明人： Bill Chang , Bily Wang
IPC分类号： H01L2906
CPC分类号： H01L25/0753 , H01L33/504 , H01L2924/0002 , Y10S257/918 , H01L2924/00
摘要： A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue on an insulating substrate.
摘要翻译：通过在绝缘基板上使用不超过两层彩色LED覆盖一层或多层补色磷光胶而产生接近白光的无色光。

110. 发明授权

US06534799B1 Surface mount light emitting diode package 有权
标题翻译：表面贴装发光二极管封装
公开(公告)号：US06534799B1
公开(公告)日：2003-03-18
申请号：US09678373
申请日：2000-10-03
申请人： Bily Wang , Bill Chang
发明人： Bily Wang , Bill Chang
IPC分类号： H01L3300
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48091 , H05K3/3442 , H01L2924/00014
摘要： In a surface mount LED chips mounted on an insulating substrate, plated through conduits to interconnect the chips on both sides are placed at the corners of the outer terminals at two horizontal ends. The depressions caused by wire-bonding the chip to the terminals are lined up vertically with the corner conduits to reduce horizontal dimension.
摘要翻译：在安装在绝缘基板上的表面安装的LED芯片中，通过导管电镀以将两侧的芯片互连以在两个水平端部放置在外部端子的角部。将芯片接线到端子引起的凹陷与拐角导管垂直排列以减小水平尺寸。

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