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91. 发明专利

GB1449209A ELECTRICAL CONNECTION BOARD 未知
公开(公告)号：GB1449209A
公开(公告)日：1976-09-15
申请号：GB5987773
申请日：1973-12-27
申请人： CII HONEYWELL BULL
IPC分类号： H01R12/50 , H05K1/02 , H05K3/42 , H05K3/46 , H05K1/00 , H01R13/02 , H05K1/08
摘要： 1449209 Printed circuits COMPAGNIE HONEYWELL BULL 27 Dec 1973 [28 Dec 1972] 59877/73 Heading H1R [Also in Division H2] A circuit assembly comprises conductors and 11 lying on opposite faces of insulating board 12 and metallized holes 17 for interconnecting selected conductors arranged in a regular array of rows R and columns C, each conductor extending in the direction of the rows and being confined to an area defined by two adjacent rows, each conductor 10 comprising portions S 1 , S 2 , S 3 , &c. adjacent ones of which are angled with respect to one another, portions S 1 , S 5 , S 9 , &c. being arranged along the median line M of said two rows of holes, as shown R 0 and R 1 , and coinciding with the parts of this line lying between alternate pairs of columns, the portions S 3 , S 7 , S 11 , &c. lying along one or other of said adjacent rows between the other alternate pairs of columns, conductors 11 being identically formed with portions I 1 , I 2 , I 3 , &c. but positioned so that portions I 1 , I 5 , I 9 , &c. lying along a line M alternate with portions S 1 , S 5 , S 9 , &c. As shown in Fig. 4, the arrangement is such that S 3 , S 7 &c. and I 3 , I 7 , &c. lie along the same row of holes R 1 . Alternatively (Fig. 5, not shown), S 3 , S 7 , &c. may be along one row R 1 and I 3 , I 7 , &c. lie along adjacent row R 0 , or (Fig. 6, not shown) S 3 , S 11 , &c. may lie along row R 1 , S 7 , S 15 , &c. along row R 0 and similarly with I 3 , I 11 , I 7 , I 15 with the proviso that none of these sets of portions overlap. As shown the metallized holes are connected to the conductors by junction conductors J lying along the columns. The assembly may comprise a plurality of insulating boards carrying the conductors. As shown in Fig. 1, the conductors are separated from conductive sheets 13, 14 on the outside of the assembly by insulating layers 15, 16 and selected ones are connected to sheets 13, 14 through the metallized holes. The arrangement is stated to minimize parasitic voltages in a data processing assembly.

92. 发明专利

NL149674B 未知
公开(公告)号：NL149674B
公开(公告)日：1976-05-17
申请号：NL6703605
申请日：1967-03-08
申请人： IBM
IPC分类号： B23K1/005 , H01L29/12 , H01R12/71 , H05K1/08 , H05K13/04
摘要： 1,162,184. Semi-conductor devices; printed circuit assemblies. INTERNATIONAL BUSINESS MACHINES CORP. 9 March, 1967, No. 11043/67. Headings H1K and H1R. Monolithic or integrated semi-conductor devices are gold-coated on their lower surfaces and hot pressure bonded to superposed gold and chromium layers at the bottom of cavities in a substrate of glass or ceramic (e.g. 96% alumina). The cavities are formed by pressing the green ceramic or by bonding an apertured alumina sheet to an alumina blank. Each device has a plurality of built-up contacts extending through a protective glass coating on its upper surface and these lie in substantially the same plane as lands on the top surface of the substrate and which consist of aluminium, copper, or one or more noble metals. (For example the lands may have superposed gold, copper, and chromium layers). A plate is provided with conductive tracks suitably placed to interconnect adjacent contacts and lands. Suitable plates are aluminium or copper foils, paper, resin-reinforced fibrous materials, tetrafluoroethylene resins, polyethylene-terephthalate resins, and polyimide resins. The conductive tracks are formed on these, preferably on an intermediate acrylate resin parting layer, by laminating and etching, or by masked evaporation and may consist of aluminium, copper, or one or more noble metals. (A track may have superposed gold, lead, tin and copper layers). Preferably the plate is transparent so that visual alignment may be used in the bonding process, and is preferably insulating so that interconnection tests may be made before bonding. The backing may be clamped to the devices and substrate on a hot stage (which may have orienting pegs engaging the backing) and the assembly bonded by a solder reflow technique using lead-tin solder. Instead, single or multi-tipped thermocompression bonding machines may be used, the tips penetrating the backing during bonding. If ultrasonic bonding heads are used these are first heated to penetrate the backing and ultrasonic energy then supplied to affect the bonding. Laser or electron beam bonding may be used instead. The bonding layer is pulled away from the bonded contact tracks and lands, any parting layer being dissolved away. Alternatively the backing plate may be multilayered and consist of polyimide sheets bearing conductive tracks formed by masked evaporation or electrochemical deposition. Through-holes in the backing are metallized to provide interconnection between tracks in the various planes. Such a backing plate remains in place after bonding to interconnect the devices on the substrate.

93. 发明专利

SU514459A1 未知
公开(公告)号：SU514459A1
公开(公告)日：1976-05-15
申请号：SU1977446
申请日：1973-12-19
IPC分类号： H05K13/08 , G01R1/06 , H05K13/00 , H05K1/08

94. 发明专利

DE7540879U 未知
公开(公告)号：DE7540879U
公开(公告)日：1976-05-06
申请号：DE7540879
申请日：1975-12-22
申请人： CHOMERICS, INC., WOBURN, MASS. (V.ST.A.)
IPC分类号： H01R12/04 , H05K20060101 , H05K1/08

95. 发明专利

AU7451274A ELECTRICAL ASSEMBLY APPARATUS 未知
公开(公告)号：AU7451274A
公开(公告)日：1976-04-29
申请号：AU7451274
申请日：1974-10-21
申请人： AMP INC
发明人： BRUMMANS WILHELMUS JOHANNES , STERKEN CORNELUS ADRIANUS HENR
IPC分类号： B23P21/00 , H01R43/20 , H05K13/04 , H01R43/00 , H05K1/08

96. 发明专利

DE2234961C3 未知
公开(公告)号：DE2234961C3
公开(公告)日：1975-04-24
申请号：DE2234961
申请日：1972-07-15
申请人： TELEDYNE, INC., LOS ANGELES, CALIF. (V.ST.A.)
发明人： PRICE, EVERETT R., ESCONDIDO, CALIF. (V.ST.A.)
IPC分类号： H01R4/48 , H01R20060101 , H01R11/01 , H01R12/71 , H01R33/76 , H05K1/00 , H05K1/08

97. 发明专利

GB1373963A SWITCHING CIRCUITS 未知
公开(公告)号：GB1373963A
公开(公告)日：1974-11-13
申请号：GB5690671
申请日：1972-11-27
申请人： CONVEYANCER LTD
IPC分类号： H01H1/40 , H03K17/72 , H05K1/08

98. 发明专利

NL143404B 未知
公开(公告)号：NL143404B
公开(公告)日：1974-09-16
申请号：NL6918633
申请日：1969-12-11
申请人： AMP INC
IPC分类号： H01R20060101 , H01R9/16 , H01R12/71 , H01R13/00 , H01R13/02 , H01R13/10 , H05K3/32 , H05K1/08
摘要： A connector suitable for making surface contact with a surface conductor of a ribbon-cable or printed circuit board has an open-sided boxlike configuration with a side of the box extended to give a contact edge. The contact edge is bowed and has a free end bent back into the box to reduce entanglement in harnesses. The connector is able to be fitted into a housing and secured to a surface of a panel.

99. 发明专利

DE2407738A1 Connector for liq. crystal leads to circuit board - uses intermediate connector block of conductive PVC or silicon rubber 未知
公开(公告)号：DE2407738A1
公开(公告)日：1974-08-22
申请号：DE2407738
申请日：1974-02-18
申请人： ELECTROVAC
发明人： LIEBERTH KARL ING
IPC分类号： G02F1/13 , G04G17/06 , H01R13/24 , H05K3/32 , H05K3/36 , H05K3/40 , H05K1/08
摘要： The arrangement is esp. suitable for making connections between delicate components and circuit boards, e.g. for connecting liq. crystal cells. The connectors may be any desired shape and are made from an elastomer, for e.g. silicone rubber, rendered conducting by the addition of conducting particles, or by covering with a conducting layer. For greater precision in locating the connectors, each may be provided with a stem which fits into a hole in the circuit board, or alternatively, a cage with openings corresp. to the connector positions may be placed between the conductors to be joined. The circuit elements may be held together by using the connectors also as an adhesive or external clamping arrangements may be used.

100. 发明专利

SE366194B 未知
公开(公告)号：SE366194B
公开(公告)日：1974-04-08
申请号：SE434469
申请日：1969-03-27
申请人： USM CORP
发明人： ALLEN M , GUNST O , LAMBERT A
IPC分类号： H05K13/04 , H05K1/08
摘要： 1,249,739. Discharging articles from shoots. USM. CORP. 27 March, 1969 [28 March, 1968], No. 15989/69. Heading B8S. [Also in Division B3] A machine for mounting components C on workpieces B includes automatic feed means 8. The components C are supplied from a'dispensable magazine 230, which contains several vertical stacks of components and is provided with lugs, which slide within a notch 234. The magazine is moved stepwise by gears (180), (182), (200), (202), Fig. 5 (not shown), and operation of a switch LS10 indicates to the feed mechanism that a stack is empty, thereby withdrawing a plunger (222) and allowing rotation of the gears so that a new stack of components is aligned with a shoot 20, whereupon the plunger is returned. The bottom component C of the stack is held by a spring-loaded rod 28 towards the top of the shoot 20. An air motor 32 is actuated to withdraw a rod 30, which abuts the other end of the spring 36, loading the rod 28, and a spring 26 pivots a member 24 so that a lower limb thereof enters the shoot. As the rod 30 withdraws, the spring pressure is reduced and the component stack moves down on to the lower limb of the member 24. The rod 30 is then advanced, thereby loading the rod 28 to hold the stack and pivot the member 24, whereupon the bottom component falls on to a gate 40. A cylinder 42 moves the component laterally so that a lead straightening operation may be performed. Should no component be present, the switch LS10 is closed, thereby resetting the apparatus for a new cycle. An air motor 70 opens the gate 40 when a component is present and it moves down the portion 21 of the shoot, coming to rest on a bar 84.

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