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    • 92. 发明专利
    • DE2229293A1
    • 1972-12-21
    • DE2229293
    • 1972-06-15
    • AEROVOX CORP
    • H01G20060101H01G4/245H01G3/215
    • 1367989 Capacitors AEROVOX CORP 12 June 1972 [17 June 1971] 27293/72 Heading H1M A multi-sectioned wound capacitor comprises a strip 11 of dielectric material bearing a metallized electrode layer 12 on one surface except for margin 15, a second dielectric layer 16 and, e.g. as shown, two counter-electrodes constituted by metal foils 17, 17 1 longitudinally separated and provided with tab leads 21, 22. Connection to electrode 12 is by a metal coating on the appropriate end face of the roll and a lead may be soldered to this to extend from the opposite end face from tabs 21, 22 (Fig. 3, not shown) or brought through the centre of the roll to extend from the same end face (Fig. 4, not shown). The dielectric layers are preferably of the same material, e.g. paper, polypropylene, fibreglass. Layer 12 may be vapour deposited or chemically deposited aluminium and foils 17, 17 1 may also be aluminium.
    • 94. 发明专利
    • DE2110069A1
    • 1971-09-16
    • DE2110069
    • 1971-03-03
    • ILLINOIS TOOL WORKS
    • H01G4/245H01G4/32H01G3/17
    • Wound film capacitor and method of making wherein at least two layers of shrinkable thermoplastic dielectric are sandwiched between two layers of metallized or, preferably, foil, electrodes. A pair of lead wires are then positioned against the outer surfaces of the foils and rotated together in the manner of mandrels to wind the film and foil layers into a capacitor body. Flat, or otherwise deformed portions formed on a short portion of one end of each lead wire which is outside of the capacitor during winding are then drawn into the center of the capacitor by pulling on the other end of the wires. The capacitor body is then heated to shrink the dielectric and thereby cause the leads to be held in extremely firm engagement with the foil layers. Since the foils encircle at least 270 DEG of the periphery of the lead wires, a very firm, low resistance, pressure bond is made which renders the capacitor able to withstand substantial amounts of heat applied during a soldering operation. The elimination of mandrel holes allows the capacitor to be extremely compact and usable for many applications without the addition of additional thicknesses of sealing materials.