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    • 93. 发明申请
    • TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE
    • 提供直接注入半导体存储器件的技术
    • US20100296327A1
    • 2010-11-25
    • US12785971
    • 2010-05-24
    • Srinivasa Rao BannaMichael A. Van Buskirk
    • Srinivasa Rao BannaMichael A. Van Buskirk
    • G11C5/06G11C7/00
    • G11C7/00G11C11/4026G11C11/403G11C2211/4016H01L27/082H01L27/1023H01L27/108H01L27/10802H01L29/7841
    • Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region connected to a bit line extending in a first orientation and a second region connected to a source line extending in a second orientation. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line extending in the second orientation, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region connected to a carrier injection line extending in the second orientation, wherein the first region, the second region, the body region, and the third region are disposed in sequential contiguous relationship.
    • 公开了提供直接注入半导体存储器件的技术。 在一个特定示例性实施例中,技术可以被实现为直接注入半导体存储器件,其包括连接到沿第一取向延伸的位线的第一区域和连接到沿第二取向延伸的源极线的第二区域。 直接注入半导体存储器件还可以包括与在第二取向上延伸的字线间隔开并且电容耦合到字线的主体区域,其中主体区域电浮置并且设置在第一区域和第二区域之间。 直接注入半导体存储器件还可以包括连接到沿着第二取向延伸的载流子注入管线的第三区域,其中第一区域,第二区域,体区域和第三区域以顺序连续的关系设置。