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91. 发明授权

US08186795B2 Liquid droplet jetting apparatus and program for controlling jetting a liquid droplet 有权
标题翻译：用于控制喷射液滴的液滴喷射装置和程序
公开(公告)号：US08186795B2
公开(公告)日：2012-05-29
申请号：US12414463
申请日：2009-03-30
申请人： Yoshikazu Takahashi
发明人： Yoshikazu Takahashi
IPC分类号： B41J2/205 , B41J29/38
CPC分类号： B41J29/38 , B41J2/04551 , B41J2/04573 , B41J2/04581 , B41J2/04595 , B41J2002/14266
摘要： A data generating circuit incorporated in an ASIC includes a first jetting mode memory circuit which stores information related to a plurality of first jetting modes, a time-sequence information memory circuit which stores time-sequence information of a jetting mode which associates one of the plurality of first jetting modes, for each jetting timing of the nozzle, a second jetting mode memory circuit which stores information related to a plurality of second jetting modes, which are more than types of the plurality of first jetting modes, and a jetting mode selecting circuit which selects a jetting mode at an arbitrary jetting timing among the plurality of second jetting modes, based on the first jetting modes at the arbitrary jetting timing and at least one of the previous and subsequent jetting timings.
摘要翻译：集成在ASIC中的数据生成电路包括存储与多个第一喷射模式有关的信息的第一喷射模式存储电路，存储将多个第一喷射模式中的一个关联的喷射模式的时序信息的时序信息存储电路对于喷嘴的每个喷射定时，存储第二喷射模式存储器电路，其存储与多个第一喷射模式的类型相关的多个第二喷射模式的信息，以及喷射模式选择电路其基于任意喷射定时的第一喷射模式和前一喷射定时和后续喷射定时中的至少一个，在多个第二喷射模式之间的任意喷射定时选择喷射模式。

92. 发明授权

US08154124B2 Semiconductor device having a chip-size package 有权
标题翻译：具有芯片尺寸封装的半导体器件
公开(公告)号：US08154124B2
公开(公告)日：2012-04-10
申请号：US12000745
申请日：2007-12-17
申请人： Yoshikazu Takahashi , Masami Suzuki , Masaru Kimura
发明人： Yoshikazu Takahashi , Masami Suzuki , Masaru Kimura
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/04 , H01L23/053 , H01L23/12 , H01L23/29
CPC分类号： H01L23/49572 , H01L23/13 , H01L23/49816 , H01L23/4985 , H01L25/105 , H01L2224/16 , H01L2224/73204 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311
摘要： A semiconductor chip has a main surface, a back surface and a plurality of side surfaces. A plurality of electrodes is provided on the main surface of the semiconductor chip so as to be arranged in a plurality of lines. An insulating film is formed on the main surface of the semiconductor chip so as to expose at least one of the plurality of electrodes. A plurality of leads are formed on the insulating film, each of the plurality of leads having a first end and a second end, and the first end of the lead being connected to the one of the plurality of electrodes. A base resin film is formed on the insulting film and the plurality of leads, the base resin film having a plurality of electrodes holes exposing a part of the second end of each of the leads and a device hole in which the first end of the lead and the one of the plurality of electrodes are located.
摘要翻译：半导体芯片具有主表面，后表面和多个侧表面。多个电极设置在半导体芯片的主表面上，以便布置成多条线。在半导体芯片的主表面上形成绝缘膜，以露出多个电极中的至少一个。多个引线形成在绝缘膜上，多个引线中的每一个具有第一端和第二端，并且引线的第一端连接到多个电极中的一个。在绝缘膜和多根引线上形成基底树脂膜，基底树脂膜具有多个电极孔，其暴露出每个引线的第二端的一部分，以及器件孔，引线的第一端并且所述多个电极中的一个位于所述多个电极中。

93. 发明授权

US07994716B2 Impact and color resistant organic electroluminescent display panel 有权
标题翻译：耐冲击和耐彩色有机电致发光显示面板
公开(公告)号：US07994716B2
公开(公告)日：2011-08-09
申请号：US12093115
申请日：2006-11-06
申请人： Yoshikazu Takahashi
发明人： Yoshikazu Takahashi
IPC分类号： H01L35/24 , C08K5/15
CPC分类号： H01L51/5256
摘要： In the present invention, an organic EL device, which includes first and second display electrodes and at least one organic functional layer sandwiched between the respective display electrodes and composed of an organic compound, a high-molecular compound film covering the organic EL device and a surface of a substrate in the periphery of the organic EL device, an inorganic barrier film covering the high-molecular compound film, the edge of the high-molecular compound film, and a surface of the substrate in the periphery of the high-molecular compound film are formed on the substrate. In this case, a aliphatic polyurea film is used as the high-molecular compound film.
摘要翻译：在本发明中，一种有机EL器件，其包括第一和第二显示电极以及夹在各显示电极之间并由有机化合物构成的至少一个有机功能层，覆盖有机EL器件的高分子化合物膜和有机EL元件周围的基板的表面，覆盖高分子化合物膜的无机阻挡膜，高分子化合物膜的边缘和高分子化合物的周围的基板的表面在基板上形成膜。在这种情况下，使用脂肪族聚脲膜作为高分子化合物膜。

94. 发明授权

US07991166B2 Microphone apparatus 失效
标题翻译：麦克风设备
公开(公告)号：US07991166B2
公开(公告)日：2011-08-02
申请号：US11353088
申请日：2006-02-14
申请人： Nobuyuki Kihara , Yoshikazu Takahashi , Yasuhiko Kato
发明人： Nobuyuki Kihara , Yoshikazu Takahashi , Yasuhiko Kato
IPC分类号： H04R3/00 , H04R1/02 , G10L11/00 , G10L19/00
CPC分类号： H04R1/406 , H04R19/016 , H04R2201/401 , H04R2430/20
摘要： A microphone apparatus for processing and outputting an output signal of a microphone array including at least nine microphones includes a directivity function processing circuit that converts the output signal of the microphone array into a unidirectional signal and that outputs the unidirectional signal. The directivity function processing circuit expands a directivity function whose variable is an incident angle of an acoustic wave into a Fourier series up to at least third order. The variable in the expanded expression is produced from output signals of the microphones forming the microphone array.
摘要翻译：用于处理和输出包括至少九个麦克风的麦克风阵列的输出信号的麦克风装置包括将麦克风阵列的输出信号转换为单向信号并输出单向信号的方向性功能处理电路。指向性函数处理电路将可变为声波的入射角的方向性函数扩展为至少三阶的傅里叶级数。扩展表达式中的变量由形成麦克风阵列的麦克风的输出信号产生。

95. 发明申请

US20110037166A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 有权
标题翻译：半导体器件和半导体器件制造方法
公开(公告)号：US20110037166A1
公开(公告)日：2011-02-17
申请号：US12735926
申请日：2009-04-08
申请人： Yoshinari Ikeda , Shin Soyano , Akira Morozumi , Kenji Suzuki , Yoshikazu Takahashi
发明人： Yoshinari Ikeda , Shin Soyano , Akira Morozumi , Kenji Suzuki , Yoshikazu Takahashi
IPC分类号： H01L23/34 , H01L21/00
CPC分类号： H01L24/80 , H01L21/4882 , H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/473 , H01L23/49537 , H01L23/49562 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/072 , H01L25/117 , H01L2224/05554 , H01L2224/29 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/371 , H01L2224/40137 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73215 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/1579 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298 , H01L2224/83205
摘要： The object of the present invention is to efficiently dissipate heat from the upper and lower main surfaces of a semiconductor device carrying a semiconductor element. A semiconductor device (1) is provided with an insulating substrate (10A), an insulating substrate (10B) provided so as to face the insulating substrate (10A), and a semiconductor element (20) disposed between the insulating substrate (10A) and the insulating substrate (10B) and having a collector electrode and an emitter electrode provided on the side opposite to that of the collector electrode. The collector electrode is electrically connected to a metal foil (10ac) provided on the insulating substrate (10A), and the emitter electrode is electrically connected to the metal foil (10bc) provided on the insulating substrate (10B). As a result, heat generated by the semiconductor element (20) is efficiently dissipated from the upper and lower main surfaces of the semiconductor device (1).
摘要翻译：本发明的目的是有效地从携带半导体元件的半导体器件的上主表面和下主表面散热。半导体器件（1）设置有绝缘基板（10A），设置为与绝缘基板（10A）相对的绝缘基板（10B），以及设置在绝缘基板（10A）和绝缘基板（10B），并且具有集电极和设置在与集电极的相反侧的发射极。集电极电连接到设置在绝缘基板（10A）上的金属箔（10ac），发射电极与设在绝缘基板（10B）上的金属箔（10bc）电连接。结果，由半导体元件（20）产生的热量有效地从半导体器件（1）的上主表面和下主表面消散。

96. 发明授权

US07779172B2 Activator, DMA transfer system, DMA transfer method 有权
标题翻译：激活器，DMA传输系统，DMA传输方式
公开(公告)号：US07779172B2
公开(公告)日：2010-08-17
申请号：US11515396
申请日：2006-09-01
申请人： Nobuo Sasaki , Kaoru Yamanoue , Yoshikazu Takahashi , Shinichi Honda
发明人： Nobuo Sasaki , Kaoru Yamanoue , Yoshikazu Takahashi , Shinichi Honda
IPC分类号： G06F13/28 , G06F15/167
CPC分类号： G06F13/32
摘要： A DMA controller controls DMA transfer in an information processing system. Input and output devices are a transfer source or a transfer destination in DMA transfer and request DMA transfer. A DMAC activating unit is provided with an event monitoring unit and an event register. The event register registers an event subject to monitoring. The event monitoring unit detects an event generated in the input and output devices and determines whether the detected event matches an event registered in the event register. If it is determined that the events match, the event monitoring unit activates the DMA controller.
摘要翻译： DMA控制器控制信息处理系统中的DMA传输。输入和输出设备是DMA传输中的传输源或传输目的地，并请求DMA传输。 DMAC激活单元设置有事件监视单元和事件寄存器。事件寄存器注册一个需要监视的事件。事件监视单元检测在输入和输出设备中产生的事件，并确定检测到的事件是否与登记在事件寄存器中的事件相匹配。如果确定事件匹配，则事件监视单元激活DMA控制器。

97. 发明申请

US20090238968A1 Method for Producing Component for Vacuum Apparatus, Resin Coating Forming Apparatus and Vacuum Film Forming System 有权
标题翻译：真空设备组件生产方法，树脂涂层成型设备和真空成膜系统
公开(公告)号：US20090238968A1
公开(公告)日：2009-09-24
申请号：US11886600
申请日：2006-03-23
申请人： Masanobu Hatanaka , Yoshikazu Takahashi , Michio Ishikawa , Fumio Nakamura
发明人： Masanobu Hatanaka , Yoshikazu Takahashi , Michio Ishikawa , Fumio Nakamura
IPC分类号： B05D7/22 , C23C16/44 , C23C14/12
CPC分类号： C23C16/4402 , B05D1/60 , B05D7/22
摘要： The object of this invention is to provide a method for producing a component for vacuum apparatus and a resin coating forming apparatus capable of easily forming a resin coating on an internal flow path complex in shape.The resin coating forming apparatus (21) comprises a monomer vapor supplying unit (23), a vacuum pumping line (24) for transporting monomer vapor, a connection portion (24c) connectable with the internal flow path of a component (22A) provided on part of the vacuum pumping line (24), and a temperature adjusting unit (31) for depositing the monomer vapor onto the internal flow path of the component (22A) connected with the connection portion (24c) to form a resin coating. The above arrangement permits the formation of a uniform, high-coverage resin coating on the internal flow path of the component (22A) by merely exposing the internal flow path to monomer vapor.
摘要翻译：本发明的目的是提供一种用于制造真空装置的部件的方法和能够容易地在内部流路复合体上形成树脂涂层的树脂涂层形成装置。树脂涂层形成装置（21）包括单体蒸气供给单元（23），用于输送单体蒸气的真空泵送管线（24），可连接到设置在其上的部件（22A）的内部流路的连接部分（24c）真空泵送管线（24）的一部分和用于将单体蒸气沉积到与连接部分（24c）连接的部件（22A）的内部流动路径上以形成树脂涂层的温度调节单元（31）。上述布置允许通过仅将内部流动路径暴露于单体蒸气，在组件（22A）的内部流动路径上形成均匀的高覆盖率树脂涂层。

98. 发明申请

US20090093109A1 Method for producing a semiconductor device using a solder alloy 有权
标题翻译：使用焊料合金制造半导体器件的方法
公开(公告)号：US20090093109A1
公开(公告)日：2009-04-09
申请号：US12213923
申请日：2008-06-26
申请人： Akira Morozumi , Shin Soyano , Yoshikazu Takahashi
发明人： Akira Morozumi , Shin Soyano , Yoshikazu Takahashi
IPC分类号： H01L21/768
CPC分类号： C22C13/02 , B23K35/262 , H01L24/29 , H01L24/33 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29294 , H01L2224/293 , H01L2224/32225 , H01L2224/83801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01025 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/1517 , H01L2924/15787 , H01L2924/1579 , H01L2924/351 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： In producing a semiconductor device, a solder alloy is prepared to contain antimony in a range of from 3 to 5 wt %, a trace amount of germanium, and a balance of tin. An insulative substrate having conductor patterns on both surfaces thereof is prepared, and a heat sink plate is mounted on a back surface of the insulative substrate by a soldering process using the solder alloy at a temperature ranging from 310 C.° to 320 C.° in a hydrogen reducing furnace. A semiconductor chip is mounted on a front surface of the insulative substrate.
摘要翻译：在制造半导体器件时，制备焊料合金以含有3至5重量％的锑，痕量的锗和余量的锡。准备在其两面具有导体图形的绝缘基板，并且通过使用焊料合金在310℃至320℃的温度范围内的焊接工艺将散热板安装在绝缘基板的背面上。在氢还原炉中。半导体芯片安装在绝缘基板的前表面上。

99. 发明授权

US07448613B2 Sheet feeding apparatus and image forming apparatus 失效
标题翻译：送纸装置和成像装置
公开(公告)号：US07448613B2
公开(公告)日：2008-11-11
申请号：US11677418
申请日：2007-02-21
申请人： Yoshikazu Takahashi
发明人： Yoshikazu Takahashi
IPC分类号： B65H1/26
CPC分类号： B65H1/12 , B65H1/266 , B65H2402/5155 , B65H2405/31 , B65H2601/322
摘要： A lifting plate provided in a sheet accommodating member is locked at a position, to which the lifting plate is downwardly turned against a pushing force of a spring, by a locking mechanism having a locking member configured to lock the lifting plate, and also having a lock releasing lever configured to release locking of the lifting plate by the locking member. When the sheet accommodating unit is mounted, the lock releasing lever is made to abut against a lock release member. Thus, the lock releasing lever is moved integrally with the locking member in a lock release direction. When the sheet accommodating unit is drawn out, the lock releasing lever is made to abut against the lock release member. Thus, the lock releasing lever is singly moved in a direction opposite to the lock release direction to maintain the locking of the lifting plate by the locking member.
摘要翻译：设置在片材容纳构件中的提升板通过具有锁定构件来锁定提升板的锁定机构的锁定机构锁定在抵抗弹簧的推动力的情况下提升板向下转动的升降板，并且还具有锁定释放杆，其构造成通过锁定构件释放提升板的锁定。当安装片材容纳单元时，使锁定释放杆抵靠锁定解除构件。因此，锁定释放杆与锁定构件沿锁定解除方向一体地移动。当片材容纳单元被拉出时，锁定释放杆被制成抵靠锁定解除构件。因此，锁定释放杆在与锁定解除方向相反的方向上单独移动，以通过锁定构件保持提升板的锁定。

100. 发明授权

US07438403B2 Inkjet printhead with compensating member 有权
标题翻译：具有补偿构件的喷墨打印头
公开(公告)号：US07438403B2
公开(公告)日：2008-10-21
申请号：US11185277
申请日：2005-07-19
申请人： Yoshikazu Takahashi
发明人： Yoshikazu Takahashi
IPC分类号： B41J2/17 , B41J2/45 , B41J2/175
CPC分类号： B41J2/055 , B41J2/14233 , B41J2002/14258 , B41J2002/14419
摘要： An inkjet printhead includes: a cavity unit having aligned nozzles, pressure chambers correspondingly aligned, and a common-chamber member having a common chamber connected, at an introduction place, to an ink source to receive and distribute ink to the pressure chambers, and extending along the pressure chambers row to overlap each pressure chamber when seen in the superposition direction, and a cross-sectional area of the common chamber perpendicular to its longitudinal direction gradually decreases in a direction away from the introduction place, at a portion remote from the introduction place; an actuator on the cavity unit to pressurize the distributed ink to eject ink droplets from the nozzles; and a compensating member having a rigidity lower than that of the common-chamber member, and being disposed in contact with the ink, at the remote portion so that a supporting rigidity of the common-chamber member is substantially uniform along the pressure chambers row.
摘要翻译：喷墨打印头包括：空腔单元，其具有对准的喷嘴，相应对准的压力室，以及具有在引入位置处连接到墨源以将墨水分配到压力室的公共室的公共室构件，沿着压力室排，当从叠加方向观察时与每个压力室重叠，并且垂直于其纵向方向的公共室的横截面积在远离引入位置的方向上在远离导入件的部分逐渐减小地点; 空腔单元上的致动器，用于对分布的墨进行加压以从喷嘴喷出墨滴; 以及补偿构件，其刚性低于公共室构件的刚性，并且在远端部分与墨水接触地设置，使得公共腔构件的支撑刚度沿着压力室排基本上均匀。

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