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    • 93. 发明授权
    • Methods to resolve hard-to-erase condition in charge trapping non-volatile memory
    • 解决电荷捕获非易失性存储器中难擦除条件的方法
    • US07355897B2
    • 2008-04-08
    • US11773857
    • 2007-07-05
    • Tzu-Hsuan HsuYen-Hao Shih
    • Tzu-Hsuan HsuYen-Hao Shih
    • G11C16/04
    • G11C16/0475
    • A method for operating a nitride trapping memory cell is provided to resolve hard-to-erase condition by employing a reset technique to eliminate or reduce the number of electrons in the middle of a junction region. When a hard-to-erase condition is detected after a series of program and erase cycles, such as 500 or 100 program and erase cycles, a substrate transient hot hole (STHH) reset operation is applied. The substrate transient hot hole reset injects holes that are far away junction than band-to-band tunneling hot hole (BTBTHH) injection such that the STHH reset on cycle endurance is able to maintain a desirable cycle window to eliminate or reduce the hard-to erase condition in subsequent program and erase cycles.
    • 提供了一种操作氮化物捕获存储单元的方法,通过采用复位技术来消除或减少接合区中间的电子数量来解决硬擦除条件。 当在一系列编程和擦除周期(例如500或100个编程和擦除周期)之后检测到难以擦除的条件时,应用基板瞬态热孔(STHH)复位操作。 衬底瞬态热孔复位注入与带 - 带隧道热孔(BTBTHH)注入相距较远的结的孔,使得周期耐久下的STHH复位能够保持期望的循环窗口以消除或减少难以 随后的编程和擦除周期中的擦除条件。
    • 94. 发明授权
    • Methods to resolve hard-to-erase condition in charge trapping non-volatile memory
    • 解决电荷捕获非易失性存储器中难擦除条件的方法
    • US07242622B2
    • 2007-07-10
    • US11359044
    • 2006-02-22
    • Tzu-Hsuan HsuYen-Hao Shih
    • Tzu-Hsuan HsuYen-Hao Shih
    • G11C16/04
    • G11C16/0475
    • A method for operating a nitride trapping memory cell is provided to resolve hard-to-erase condition by employing a reset technique to eliminate or reduce the number of electrons in the middle of a junction region. When a hard-to-erase condition is detected after a series of program and erase cycles, such as 500 or 100 program and erase cycles, a substrate transient hot hole (STHH) reset operation is applied. The substrate transient hot hole reset injects holes that are far away junction than band-to-band tunneling hot hole (BTBTHH) injection such that the STHH reset on cycle endurance is able to maintain a desirable cycle window to eliminate or reduce the hard-to erase condition in subsequent program and erase cycles.
    • 提供了一种操作氮化物捕获存储单元的方法,通过采用复位技术来消除或减少接合区中间的电子数量来解决硬擦除条件。 当在一系列编程和擦除周期(例如500或100个编程和擦除周期)之后检测到难以擦除的条件时,应用基板瞬态热孔(STHH)复位操作。 衬底瞬态热孔复位注入与带 - 带隧道热孔(BTBTHH)注入相距较远的结的孔,使得周期耐久下的STHH复位能够保持期望的循环窗口以消除或减少难以 随后的编程和擦除周期中的擦除条件。
    • 96. 发明申请
    • NON-VOLATILE MEMORY, NON-VOLATILE MEMORY CELL AND OPERATION THEREOF
    • 非易失性存储器,非易失性存储器单元及其操作
    • US20060131634A1
    • 2006-06-22
    • US10905194
    • 2004-12-21
    • Tzu-Hsuan HsuYen-Hao Shih
    • Tzu-Hsuan HsuYen-Hao Shih
    • H01L21/8238H01L29/06
    • H01L27/11568H01L27/115H01L29/792
    • A non-volatile memory cell comprising a substrate, a charge-trapping layer, a control gate, a first conductive state of source and drain, a lightly doped region and a second conductive state of pocket-doped region. The charge-trapping layer and the control gate are disposed over the substrate. A dielectric layer is disposed between the substrate, the charge-trapping layer and the control gate. The source and drain are disposed in the substrate on each side of the charge-trapping layer. The lightly doped region is disposed on the substrate surface between the source and the charge-trapping layer. The pocket-doped region is disposed within the substrate between the drain and the charge-trapping layer. Because there are asymmetrical configuration and different doped conductive states of implant structures, the programming speed of the memory cell is increased, the neighboring cell disturb issue is prevented, and the area occupation of the bit line selection transistor is reduced.
    • 一种非易失性存储单元,包括衬底,电荷俘获层,控制栅极,源极和漏极的第一导电状态,轻掺杂区域和第二导电状态的袋掺杂区域。 电荷捕获层和控制栅极设置在衬底上。 电介质层设置在基板,电荷俘获层和控制栅极之间。 源极和漏极设置在电荷俘获层的每一侧上的衬底中。 轻掺杂区域设置在源极和电荷捕获层之间的衬底表面上。 掺杂阱区域设置在漏极和电荷捕获层之间的衬底内。 由于存在不对称配置和掺杂导体状态的不同,存储单元的编程速度增加,从而防止了相邻单元的干扰问题,并减少了位线选择晶体管的占用面积。
    • 98. 发明授权
    • NAND flash with non-trapping switch transistors
    • NAND闪存与非陷阱开关晶体管
    • US09082656B2
    • 2015-07-14
    • US13294852
    • 2011-11-11
    • Shih-Hung ChenHang-Ting LueYen-Hao Shih
    • Shih-Hung ChenHang-Ting LueYen-Hao Shih
    • H01L27/115
    • H01L27/1157H01L27/11578
    • A manufacturing method for a memory array includes first forming a multilayer stack of dielectric material on a plurality of semiconductor strips, and then exposing the multilayer stack in switch transistor regions. The multilayer stacks exposed in the switch transistor regions are processed to form gate dielectric structures that are different than the dielectric charge trapping structures. Word lines and select lines are then formed. A 3D array of dielectric charge trapping memory cells includes stacks of NAND strings of memory cells. A plurality of switch transistors are coupled to the NAND strings, the switch transistors including gate dielectric structures wherein the gate dielectric structures are different than the dielectric charge trapping structures.
    • 一种用于存储器阵列的制造方法包括首先在多个半导体条上形成多层电介质材料,然后在开关晶体管区域中暴露多层叠层。 在开关晶体管区域中暴露的多层堆叠被处理以形成不同于介电电荷俘获结构的栅介质结构。 然后形成字线和选择线。 介质电荷俘获存储器单元的3D阵列包括存储器单元的NAND串的堆叠。 多个开关晶体管耦合到NAND串,开关晶体管包括栅极电介质结构,其中栅极电介质结构不同于介电电荷俘获结构。
    • 100. 发明授权
    • Phase change memory coding
    • 相变存储器编码
    • US08634235B2
    • 2014-01-21
    • US12823508
    • 2010-06-25
    • Hsiang-Lan LungMing Hsiu LeeYen-Hao ShihTien-Yen WangChao-I Wu
    • Hsiang-Lan LungMing Hsiu LeeYen-Hao ShihTien-Yen WangChao-I Wu
    • G11C11/00
    • G11C13/0004G11C11/5678G11C13/004G11C13/0069G11C2013/0092
    • An integrated circuit phase change memory can be pre-coded by inducing a first resistance state in some cells and the memory, and a second resistance state and some other cells in the memory to represent a data set. The integrated circuit phase change memory is mounted on a substrate after coding the data set. After mounting the integrated circuit phase change memory, the data set is read by sensing the first and second resistance states, and changing cells in the first resistance state to a third resistance state and changing cells in the second resistance state to a fourth resistance state. The first and second resistance states maintain a sensing margin after solder bonding or other thermal cycling process. The third and fourth resistance states are characterized by the ability to cause a transition using higher speed and lower power, suitable for a mission function of a circuit.
    • 集成电路相变存储器可以通过在一些单元和存储器中引起第一电阻状态以及存储器中的第二电阻状态以及存储器中的一些其他单元来表示数据集而被预编码。 在对数据集进行编码之后,将集成电路相变存储器安装在基板上。 在安装集成电路相变存储器之后,通过感测第一和第二电阻状态以及将第一电阻状态下的单元改变为第三电阻状态并将第二电阻状态的单元改变为第四电阻状态来读取数据组。 第一和第二电阻状态在焊接或其他热循环过程之后保持感测裕度。 第三和第四电阻状态的特征在于能够使用更高速度和更低功率的转换,适用于电路的任务功能。