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    • 93. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US06459612B2
    • 2002-10-01
    • US09953687
    • 2001-09-14
    • Shinji SatohFumitaka AraiRiichiro Shirota
    • Shinji SatohFumitaka AraiRiichiro Shirota
    • G11C1604
    • G11C16/0483G11C11/5621G11C11/5628G11C11/5635G11C11/5642G11C16/16G11C16/26G11C16/3404G11C16/3409
    • With a local self boost (LSB) technique, the distribution, of threshold voltages after data erase is set toward a higher side and the distribution width is narrowed sufficiently within the range in which cell erase states can be read. To this end, block write is carried out on a memory cell array. Next, setting a predetermined voltage as a start voltage, soft erase is carried out for each block. After carrying out erase verification read, the threshold voltages of the cells are compared with a determination reference value. As a result of this comparison, if the threshold voltages of the cells do not reach the determination reference value, soft erase is repeated. In that case, the predetermined voltage during the soft erase is changed from the start voltage. When the threshold voltages of all the cells have reached the determination reference value, the soft erase is ended.
    • 利用局部自升压(LSB)技术,将数据擦除后的阈值电压的分布设置为较高一侧,并且分布宽度在可读取单元擦除状态的范围内充分变窄。 为此,在存储单元阵列上执行块写入。 接下来,将预定电压设置为起始电压,对每个块执行软擦除。 在执行擦除验证读取之后,将单元的阈值电压与确定基准值进行比较。 作为该比较的结果,如果单元的阈值电压未达到确定基准值,则重复软擦除。 在这种情况下,软擦除期间的预定电压从起始电压改变。 当所有单元的阈值电压都达到确定基准值时,软擦除结束。
    • 96. 发明授权
    • Nonvolatile semiconductor memory device and method for manufacturing the same
    • 非易失性半导体存储器件及其制造方法
    • US08710573B2
    • 2014-04-29
    • US12831323
    • 2010-07-07
    • Atsuhiro KinoshitaHiroshi WatanabeFumitaka Arai
    • Atsuhiro KinoshitaHiroshi WatanabeFumitaka Arai
    • H01L29/788
    • H01L27/1203H01L21/84H01L27/115H01L27/11521H01L27/11524
    • It is made possible to provide a memory device that can be made very small in size and have a high capacity while being able to effectively suppress short-channel effects. A nonvolatile semiconductor memory device includes: a first insulating film formed on a semiconductor substrate; a semiconductor layer formed above the semiconductor substrate so that the first insulating film is interposed between the semiconductor layer and the semiconductor substrate; a NAND cell having a plurality of memory cell transistors connected in series, each of the memory cell transistors having a gate insulating film formed on the semiconductor layer, a floating gate formed on the gate insulating film, a second insulating film formed on the floating gate, and a control gate formed on the second insulating film; a source region having an impurity diffusion layer formed in one side of the NAND cell; and a drain region having a metal electrode formed in the other side of the NAND cell.
    • 可以提供一种可以制造尺寸非常小并且具有高容量的存储器件,同时能够有效地抑制短沟道效应。 非易失性半导体存储器件包括:形成在半导体衬底上的第一绝缘膜; 半导体层,其形成在所述半导体衬底上方,使得所述第一绝缘膜插入在所述半导体层和所述半导体衬底之间; 具有串联连接的多个存储单元晶体管的NAND单元,每个存储单元晶体管具有形成在所述半导体层上的栅极绝缘膜,形成在所述栅极绝缘膜上的浮置栅极,形成在所述浮动栅极上的第二绝缘膜 以及形成在所述第二绝缘膜上的控制栅极; 源区,其具有形成在NAND单元的一侧的杂质扩散层; 以及在NAND单元的另一侧形成有金属电极的漏极区域。
    • 97. 发明授权
    • Nonvolatile semiconductor storage device and method for driving the same
    • 非易失性半导体存储装置及其驱动方法
    • US08520443B2
    • 2013-08-27
    • US13238442
    • 2011-09-21
    • Fumitaka AraiWataru Sakamoto
    • Fumitaka AraiWataru Sakamoto
    • G11C11/34
    • G11C11/5642G11C16/06G11C16/3418
    • A storage device according to one embodiment includes memory cells which are connected in series in a first direction and are arranged in a matrix by the arranged series connections, and word lines which connect control gates of the memory cells in a second direction perpendicular to the first direction, in which a first interval and a second interval wider than that are alternately repeated for intervals in the second direction between the memory cells. The storage device according to the embodiment comprises a drive unit for writing data in a first cell, then writing data in a second cell which is connected to the same word line as the first cell and is spaced at the first interval in the second direction, then reading the data in the second cell, and reading the data in the first cell with correction based on the read value of the second cell.
    • 根据一个实施例的存储装置包括在第一方向上串联连接并且通过排列的串联连接被布置成矩阵的存储单元,以及在垂直于第一方向的第二方向上连接存储单元的控制栅极的字线 方向,其中对于在存储单元之间的第二方向上的间隔交替地重复比其宽的第一间隔和第二间隔。 根据实施例的存储装置包括用于在第一单元中写入数据的驱动单元,然后在连接到与第一单元相同的字线并在第二方向上以第一间隔隔开的第二单元中写入数据, 然后读取第二单元中的数据,并且基于第二单元的读取值来校正第一单元中的数据。
    • 100. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20110272755A1
    • 2011-11-10
    • US13188803
    • 2011-07-22
    • Masato ENDOFumitaka Arai
    • Masato ENDOFumitaka Arai
    • H01L27/115
    • H01L27/105H01L27/11526H01L27/11529
    • A semiconductor device comprising a first insulating film provided on a semiconductor substrate in a cell transistor region, a first conductive film provided on the first insulating film, an inter-electrode insulating film provided on the first conductive film, a second conductive film provided on the inter-electrode insulating film and having a first metallic silicide film on a top surface thereof, first source/drain regions formed on a surface of the semiconductor substrate, a second insulating film provided on the semiconductor substrate in at least one of a selection gate transistor region and a peripheral transistor region, a third conductive film provided on the second insulating film and having a second metallic silicide film having a thickness smaller than a thickness of the first metallic silicide film on a top surface thereof, and a second source/drain regions formed on the surface of the semiconductor substrate.
    • 一种半导体器件,包括设置在单元晶体管区域中的半导体衬底上的第一绝缘膜,设置在第一绝缘膜上的第一导电膜,设置在第一导电膜上的电极间绝缘膜,设置在第一绝缘膜上的第二导电膜 电极间绝缘膜,在其上表面具有第一金属硅化物膜,形成在所述半导体基板的表面上的第一源极/漏极区域,设置在所述半导体基板上的选择栅极晶体管中的至少一个中的第二绝缘膜 区域和周边晶体管区域,第三导电膜,设置在第二绝缘膜上,并且具有厚度小于其顶表面上的第一金属硅化物膜的厚度的第二金属硅化物膜,以及第二源极/漏极区域 形成在半导体基板的表面上。