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    • 96. 发明授权
    • Solder powder, method for making the solder powder and solder paste
using the solder powder
    • 焊剂粉末,焊料粉末的制造方法和使用焊料粉末的焊膏
    • US5885369A
    • 1999-03-23
    • US911674
    • 1997-08-15
    • Kenzo HanawaTakayuki ArakiYoshinobu OkamuraYasuhiro Asano
    • Kenzo HanawaTakayuki ArakiYoshinobu OkamuraYasuhiro Asano
    • B23K35/22B22F1/02B23K35/02B23K35/14B23K35/26B23K35/36B23K35/363B23K35/40C07C55/14H05K3/34
    • B23K35/0244B23K35/3618B23K35/262B23K35/3613H05K3/3484Y10T428/2991
    • According to the present invention, the oxidation of the surface of solder particles is inhibited and the generation of solder balls in the reflow soldering process is inhibited. More specifically, the present invention protects the surface of the solder particles from oxidation during all steps, including the storage of a solder powder, formation of a paste from the solder powder, printing, transferring to a reflow oven and reflow soldering, to minimize the oxidation of the solder particles at these steps so that the generation of solder balls is minimized. In addition, the present invention provides a method for making the solder powder and a solder paste using the solder powder. The objective of the present invention is achieved by the solder powder, the particles of which have on the surface thereof an organometallic compound composed of adipic acid and a metal of the solder alloy. This solder powder is produced by reacting particles of the solder alloy powder with vaporized adipic acid. According to the present invention, the solder powder, the particles of which have on the surface thereof an adipic acid-derived organometallic compound combined chemically with the surface of the solder particles, is blended with a flux to be made into a paste.
    • 根据本发明,焊料颗粒表面的氧化被抑制,并且在回流焊接过程中产生焊球被抑制。 更具体地说,本发明在所有步骤中保护焊料颗粒的表面免于氧化,包括焊料粉末的存储,焊料粉末的形成,印刷,转移到回流炉和回流焊接,以最小化 在这些步骤中焊料颗粒的氧化使得焊球的产生最小化。 此外,本发明提供了使用焊料粉末制造焊料粉末和焊膏的方法。 本发明的目的是通过在其表面上具有由己二酸和焊料合金的金属组成的有机金属化合物的焊料粉末来实现的。 这种焊料粉末是通过将焊料合金粉末的颗粒与汽化的己二酸反应制备的。 根据本发明,其表面上具有与焊料颗粒的表面化学结合的己二酸衍生的有机金属化合物的焊料粉末与要制成糊料的助熔剂共混。