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    • 94. 发明授权
    • Method for fabricating semiconductor device
    • 制造半导体器件的方法
    • US07390678B2
    • 2008-06-24
    • US11094820
    • 2005-03-31
    • Wensheng WangTakashi AndoYukinobu Hikosaka
    • Wensheng WangTakashi AndoYukinobu Hikosaka
    • H01L21/00
    • H01L28/65H01L21/32136H01L27/11502H01L27/11507H01L28/55H01L28/75
    • A PLZT film (30) is formed as the material film of a capacitor dielectric film and a top electrode film (31) is formed on the PLZT film (30). The top electrode film (31) comprises two IrOx films having different composition. Subsequently, back face of a semiconductor substrate (11) is cleaned and an Ir adhesion film (32) is formed on the top electrode film (31). Substrate temperature is set at 400° C. or above at that time. Thereafter, a TiN film and a TEOS film are formed sequentially as a hard mask. In such a method, carbon remaining on the top electrode film (31) after cleaning the back face is discharged into the chamber while the temperature of the semiconductor substrate (11) is kept at 400° C. or above in order to form the Ir adhesion film (32). Consequently, adhesion is enhanced between a TiN film being formed subsequently and the Ir adhesion film (32) thus preventing the TiN film from being stripped.
    • 形成PLZT膜(30)作为电容器电介质膜的材料膜,并且在PLZT膜(30)上形成顶部电极膜(31)。 顶部电极膜(31)包括具有不同组成的两个IrO x膜。 随后,清洁半导体衬底(11)的背面并在顶部电极膜(31)上形成Ir粘附膜(32)。 此时基板温度设定在400℃以上。 此后,依次形成TiN膜和TEOS膜作为硬掩模。 在这种方法中,清洁背面后残留在顶部电极膜(31)上的碳被排出到室内,同时半导体衬底(11)的温度保持在400℃以上,以形成Ir 粘合膜(32)。 因此,随后形成的TiN膜与Ir粘附膜(32)之间的粘附性增强,从而防止TiN膜被剥离。
    • 95. 发明授权
    • Clock supply circuit
    • 时钟供电电路
    • US07336116B2
    • 2008-02-26
    • US11342568
    • 2006-01-31
    • Akio HirataTakahiro IchinomiyaTakashi Ando
    • Akio HirataTakahiro IchinomiyaTakashi Ando
    • G06F1/04H03K3/00
    • G06F1/10
    • The clock supply circuit of the present invention comprises a plurality of clock supply paths and a clock gate circuit. The clock supply paths branch a clock signal and supply each of the branched clock signals to a plurality of sequential circuits via a buffer. The clock gate circuit is inserted at least to one of the clock supply paths, which lets through the clock signals when a control signal is in a first logic state and, when the control signal is in a second logic state, outputs an inversion signal of a logic level that is outputted in a previous occasion where the control signal in the second logic state is applied.
    • 本发明的时钟供给电路包括多个时钟供给路径和时钟门电路。 时钟供应路径分支时钟信号,并且经由缓冲器将每个分支时钟信号提供给多个顺序电路。 时钟门电路至少插入到时钟供给路径中的一个,当控制信号处于第一逻辑状态时,时钟供给路径通过时钟信号,并且当控制信号处于第二逻辑状态时,输出反相信号 在施加第二逻辑状态的控制信号的前一时刻输出的逻辑电平。
    • 96. 发明授权
    • Fixing device and image forming apparatus including the same
    • 固定装置及包括该固定装置的图像形成装置
    • US07330688B2
    • 2008-02-12
    • US11263853
    • 2005-11-02
    • Osamu WatanabeTakashi Ando
    • Osamu WatanabeTakashi Ando
    • G03G15/20
    • G03G15/2064G03G2215/2016G03G2215/2032G03G2215/2041
    • A fixing device and an image forming apparatus are provided that shorten warming-up time, reduce power consumption and deviation of a belt, and surely fix a toner image onto a sheet. Support members and a pressurizing member contact each other with pressure at an upstream side and a downstream side in a carrying direction of a recording medium. A first interposing portion of the belt disposed between the support members is inserted between the support members and the pressurizing member and is installed in a tensed state. A second interposing portion of the belt is installed in a non-tensed state, the pressurizing member contacts the outside of the first interposing portion to form the fixing nip portion. The support members contact the pressurizing member with different pressures at the upstream side and the downstream side in the carrying direction of the recording medium.
    • 提供一种定影装置和图像形成装置,其缩短预热时间,降低功率消耗和带的偏离,并且可靠地将调色剂图像固定在片材上。 支撑构件和加压构件在记录介质的传送方向上的上游侧和下游侧的压力彼此接触。 设置在支撑构件之间的带的第一插入部分插入在支撑构件和加压构件之间并且被安装成张紧状态。 带的第二插入部分以非张紧状态安装,加压构件接触第一插入部分的外部以形成定影夹持部。 支撑构件在记录介质的传送方向的上游侧和下游侧以不同的压力接触加压构件。
    • 99. 发明申请
    • Clock supply circuit
    • 时钟供电电路
    • US20060170479A1
    • 2006-08-03
    • US11342568
    • 2006-01-31
    • Akio HirataTakahiro IchinomiyaTakashi Ando
    • Akio HirataTakahiro IchinomiyaTakashi Ando
    • G06F1/04
    • G06F1/10
    • The clock supply circuit of the present invention comprises a plurality of clock supply paths and a clock gate circuit. The clock supply paths branch a clock signal and supply each of the branched clock signals to a plurality of sequential circuits via a buffer. The clock gate circuit is inserted at least to one of the clock supply paths, which lets through the clock signals when a control signal is in a first logic state and, when the control signal is in a second logic state, outputs an inversion signal of a logic level that is outputted in a previous occasion where the control signal in the second logic state is applied.
    • 本发明的时钟供给电路包括多个时钟供给路径和时钟门电路。 时钟供应路径分支时钟信号,并且经由缓冲器将每个分支时钟信号提供给多个顺序电路。 时钟门电路至少插入到时钟供给路径中的一个,当控制信号处于第一逻辑状态时,时钟供给路径通过时钟信号,并且当控制信号处于第二逻辑状态时,输出反相信号 在施加第二逻辑状态的控制信号的前一时刻输出的逻辑电平。
    • 100. 发明申请
    • Method for fabricating semiconductor device
    • 制造半导体器件的方法
    • US20050244988A1
    • 2005-11-03
    • US11094820
    • 2005-03-31
    • Wensheng WangTakashi AndoYukinobu Hikosaka
    • Wensheng WangTakashi AndoYukinobu Hikosaka
    • H01L21/02H01L21/3213H01L21/8246H01L27/105H01L27/115H01L21/00
    • H01L28/65H01L21/32136H01L27/11502H01L27/11507H01L28/55H01L28/75
    • A PLZT film (30) is formed as the material film of a capacitor dielectric film and a top electrode film (31) is formed on the PLZT film (30). The top electrode film (31) comprises two IrOx films having different composition. Subsequently, back face of a semiconductor substrate (11) is cleaned and an Ir adhesion film (32) is formed on the top electrode film (31). Substrate temperature is set at 400° C. or above at that time. Thereafter, a TiN film and a TEOS film are formed sequentially as a hard mask. In such a method, carbon remaining on the top electrode film (31) after cleaning the back face is discharged into the chamber while the temperature of the semiconductor substrate (11) is kept at 400° C. or above in order to form the Ir adhesion film (32). Consequently, adhesion is enhanced between a TiN film being formed subsequently and the Ir adhesion film (32) thus preventing the TiN film from being stripped.
    • 形成PLZT膜(30)作为电容器电介质膜的材料膜,并且在PLZT膜(30)上形成顶部电极膜(31)。 顶部电极膜(31)包括具有不同组成的两个IrO x膜。 随后,清洁半导体衬底(11)的背面并在顶部电极膜(31)上形成Ir粘附膜(32)。 此时基板温度设定在400℃以上。 此后,依次形成TiN膜和TEOS膜作为硬掩模。 在这种方法中,清洁背面后残留在顶部电极膜(31)上的碳被排出到室内,同时半导体衬底(11)的温度保持在400℃以上,以形成Ir 粘合膜(32)。 因此,随后形成的TiN膜与Ir粘附膜(32)之间的粘附性增强,从而防止TiN膜被剥离。