专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明授权

US06716673B2 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof 有权
标题翻译：用于半导体元件的两极SMT微型外壳及其制造方法
公开(公告)号：US06716673B2
公开(公告)日：2004-04-06
申请号：US10147672
申请日：2002-05-15
申请人： Guenther Waitl , Franz Schellhorn , Herbert Brunner
发明人： Guenther Waitl , Franz Schellhorn , Herbert Brunner
IPC分类号： H01L2348
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H05K3/3426 , H05K2201/10454 , H05K2201/10651 , H05K2201/10818 , Y02P70/613 , H01L2924/00014
摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.
摘要翻译：在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。芯片安装表面和部件的安装表面彼此成直角。

92. 再颁专利

USRE37554E1 Method for producing an optoelectronic semiconductor component 有权
标题翻译：光电半导体元件的制造方法
公开(公告)号：USRE37554E1
公开(公告)日：2002-02-19
申请号：US09776462
申请日：2000-10-25
申请人： Herbert Brunner , Heinz Haas , Günter Waitl
发明人： Herbert Brunner , Heinz Haas , Günter Waitl
IPC分类号： H01L2144
CPC分类号： H01L33/483 , H01L31/0203 , H01L33/58 , H01L2224/48247 , H01L2224/48091 , H01L2924/00014
摘要： The optoelectronic semiconductor component has an optoelectronic semiconductor chip disposed on a chip carrier with an approximately planar chip carrier surface. The semiconductor chip is fastened with predetermined alignment of its optical axis. A plastic base part supports the chip carrier. The semiconductor chip is electrically conductively connected to at least two electrode terminals routed through the base part, and a lens is disposed above the semiconductor chip on top of the base part. The lens is formed with an independently configured cap produced from plastic material. The cap is mechanically form-locked to a support of the base part. When the cap is placed onto the base part, a holder of the cap and the support engage with one another. The holder and the support are configured such that when the cap is placed onto the base part, the two parts are automatically positioned with respect to one another in such a way that the optical axes of the lens and of the semiconductor chip coincide.
摘要翻译：光电子半导体部件具有设置在具有大致平坦的芯片载体表面的芯片载体上的光电子半导体芯片。半导体芯片以其光轴的预定对准被紧固。塑料底座部分支撑芯片载体。半导体芯片导电地连接到穿过基底部分的至少两个电极端子，并且在半导体芯片的上方设置透镜，在基部的顶部。透镜形成有由塑料材料制成的独立构造的盖。盖被机械地锁定到基部的支撑件上。当盖子放置在基座部分上时，帽子和支架的支架彼此接合。保持器和支撑件被构造成使得当帽被放置在基部上时，两个部分相对于彼此自动定位，使得透镜和半导体芯片的光轴重合。

93. 发明授权

US4472298A Process for embedding radioactive, especially tritium containing waste 失效
标题翻译：包埋放射性废物，特别是含氚废物的方法
公开(公告)号：US4472298A
公开(公告)日：1984-09-18
申请号：US263704
申请日：1981-05-14
申请人： Herbert Brunner , Horst Vietzke
发明人： Herbert Brunner , Horst Vietzke
IPC分类号： G21F9/34 , G21F9/16
CPC分类号： G21F9/34
摘要： Radioactive, particularly tritium containing, waste must be stored in such manner that the environment is not endangered. This is done by conditioning the waste and embedding it in concrete whereby a central temperature of the product of 90.degree.-95.degree. C. must not be exceeded and therewith a dilution is necessary. These difficulties are overcome by inserting the waste in a metal matrix so that the waste is pressed with a metal powder at room temperature to molded bodies.
摘要翻译：必须以不会危及环境的方式储存放射性物质，特别是含氚的废物。这是通过调节废物并将其包埋在混凝土中，由此不得超过90°-95℃的产品的中心温度，因此需要稀释。通过将废物插入金属基体中以使废物在室温下用金属粉末压制成成型体来克服这些困难。

94. 发明授权

US08816375B2 Radiation-emitting semiconductor body, method for producing a radiation-emitting semiconductor body and radiation-emitting semiconductor component 有权
标题翻译：辐射发射半导体体，辐射发射半导体体和辐射发射半导体部件的制造方法
公开(公告)号：US08816375B2
公开(公告)日：2014-08-26
申请号：US13698302
申请日：2011-06-08
申请人： Herbert Brunner , Patrick Ninz
发明人： Herbert Brunner , Patrick Ninz
IPC分类号： H01L33/00
CPC分类号： H01L33/40 , H01L24/73 , H01L33/0079 , H01L33/387 , H01L33/62 , H01L2224/48091 , H01L2924/01013 , H01L2924/01029 , H01L2924/01042 , H01L2924/01068 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H05K2201/10106 , H05K2201/10969 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting semiconductor body is provided which, besides an epitaxial semiconductor layer sequence having an active zone that is suitable for generating electromagnetic radiation, has a carrier layer that is intended to mechanically stabilize the epitaxial semiconductor layer sequence. The semiconductor body furthermore has contact structures for electrical contacting of the semiconductor body, which respectively have a volume region and a surface bonding region. The surface bonding region is formed from a material which is different from the material of the volume region.
摘要翻译：提供一种辐射发射半导体本体，除了具有适于产生电磁辐射的有源区的外延半导体层序列之外，还具有旨在使外延半导体层序列机械稳定的载体层。半导体本体还具有用于半导体主体的电接触的接触结构，该接触结构分别具有体积区域和表面结合区域。表面结合区域由与体积区域的材料不同的材料形成。

95. 发明授权

US08735930B2 Optoelectronic component with multi-part housing body 有权
标题翻译：具有多部分外壳的光电元件
公开(公告)号：US08735930B2
公开(公告)日：2014-05-27
申请号：US10593794
申请日：2005-03-09
申请人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Höfer
发明人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Höfer
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L31/0203 , H01L31/02325 , H01L33/486 , H01L33/54 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02292 , H01L2924/00
摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.
摘要翻译：提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13）导体材料（6,7）被布置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器体被预成型彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。

96. 发明授权

US08723198B2 Wavelength-converting converter material, light-emitting optical component, and method for the production thereof 有权
标题翻译：波长转换转换器材料，发光光学部件及其制造方法
公开(公告)号：US08723198B2
公开(公告)日：2014-05-13
申请号：US11917789
申请日：2006-06-07
申请人： Herbert Brunner , Klaus Höhn
发明人： Herbert Brunner , Klaus Höhn
IPC分类号： H01L33/00
CPC分类号： C09K11/7701 , C09K11/7706 , C09K11/7721 , H01L33/502 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/12044 , H01L2924/181 , Y10T428/2982 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a wavelength-converting converter material comprising at least one wavelength-converting phosphor comprising phosphor particles, wherein a portion of said phosphor or all of said phosphor is present in the form of nanoparticles. Also disclosed is a light-emitting optical component comprising such a converter material and a method for producing such components.
摘要翻译：公开了一种波长转换转换器材料，其包括至少一种包含磷光体颗粒的波长转换磷光体，其中所述磷光体的一部分或所有所述磷光体以纳米颗粒的形式存在。还公开了包括这种转换器材料的发光光学部件和用于制造这种部件的方法。

97. 发明授权

US08690629B2 Luminescence conversion LED 有权
标题翻译：发光转换LED
公开(公告)号：US08690629B2
公开(公告)日：2014-04-08
申请号：US13033370
申请日：2011-02-23
申请人： Daniel Becker , Herbert Brunner , Tim Fiedler , Jörg Strauβ , Martin Zachau
发明人： Daniel Becker , Herbert Brunner , Tim Fiedler , Jörg Strauβ , Martin Zachau
IPC分类号： H01J9/22
CPC分类号： H01L33/505 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A luminescence conversion LED having a radiation emitting chip that is connected to electrical connections and is surrounded by a housing that comprises at least a basic body and a cap, the chip being seated on the basic body, in particular in a cutout of the basic body, and the primary radiation of the chip being converted at least partially into longer wave radiation by a conversion element, wherein the cap is formed by a vitreous body, the conversion means being contained in the vitreous body, the refractive index of the vitreous body being higher than 1.6, preferably at least n=1.7.
摘要翻译：一种发光转换LED，其具有连接到电连接的辐射发射芯片，并且被包括至少包括基体和盖的壳体包围，所述芯片位于基体上，特别是在基体的切口中并且所述芯片的主要辐射通过转换元件至少部分地转换成更长的波长辐射，其中所述盖由玻璃体形成，所述转换装置包含在所述玻璃体中，所述玻璃体的折射率为高于1.6，优选至少n = 1.7。

98. 发明申请

US20130334558A1 METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT 有权
标题翻译：生产光电元件的方法和光电元件
公开(公告)号：US20130334558A1
公开(公告)日：2013-12-19
申请号：US13995847
申请日：2011-12-07
申请人： Markus Pindl , Harald Jäger , Stephan Preuss , Herbert Brunner
发明人： Markus Pindl , Harald Jäger , Stephan Preuss , Herbert Brunner
IPC分类号： H01L33/50
CPC分类号： H01L33/50 , H01L33/508 , H01L33/54 , H01L2224/48091 , H01L2224/8592 , H01L2933/0041 , H01L2924/00014
摘要： A method of producing an optoelectronic component includes providing a cavity; introducing a liquid matrix material with phosphor particles distributed therein into the cavity; introducing a semiconductor chip into the matrix material; sedimenting the phosphor particles in the matrix material; and curing the matrix material, wherein a conversion layer including phosphor particles is produced, said conversion layer being arranged on the semiconductor chip.
摘要翻译：制造光电子部件的方法包括提供空腔; 将其中分布有荧光体颗粒的液体基质材料引入所述空腔中; 将半导体芯片引入基体材料中; 沉淀基体材料中的荧光体颗粒; 并固化所述基体材料，其中产生包含荧光体颗粒的转换层，所述转换层布置在所述半导体芯片上。

99. 发明授权

US08331746B2 Illumination unit comprising luminescence diode chip and optical waveguide, method for producing an illumination unit and LCD display 有权
标题翻译：包括发光二极管芯片和光波导的照明单元，用于制造照明单元和LCD显示器的方法
公开(公告)号：US08331746B2
公开(公告)日：2012-12-11
申请号：US11992975
申请日：2006-09-22
申请人： Georg Bogner , Herbert Brunner , Stefan Gruber
发明人： Georg Bogner , Herbert Brunner , Stefan Gruber
IPC分类号： G02B6/26
CPC分类号： G02B6/0018 , G02B6/002 , G02B6/0028 , G02B6/0065 , G02B6/0073 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An illumination unit comprising a luminescence diode chip mounted on a chip carrier and comprising an optical waveguide is specified. The optical waveguide is joined together from at least two separate parts, wherein the luminescence diode chip is encapsulated by one of the parts of the optical waveguide. A method for producing a luminescence diode chip of this type and also an LCD display comprising an illumination unit of this type are furthermore specified.
摘要翻译：规定了包括安装在芯片载体上并包括光波导的发光二极管芯片的照明单元。光波导从至少两个分离的部分连接在一起，其中发光二极管芯片由光波导的一个部分封装。此外，还规定了这种类型的发光二极管芯片的制造方法以及包括这种照明单元的LCD显示器。

100. 发明授权

US08247263B2 Method for producing an optical, radiation-emitting component and optical, radiation-emitting component 有权
标题翻译：用于制造光学，辐射发射部件和光学辐射发射部件的方法
公开(公告)号：US08247263B2
公开(公告)日：2012-08-21
申请号：US11885374
申请日：2006-02-28
申请人： Bert Braune , Herbert Brunner , Harald Jäger , Jörg Sorg
发明人： Bert Braune , Herbert Brunner , Harald Jäger , Jörg Sorg
IPC分类号： H01L51/40
CPC分类号： C08G59/4215 , B29C45/0001 , B29C45/02 , B29K2083/00 , B29K2105/0005 , B29L2011/00 , C08G59/3245 , C08G77/06 , C08G77/42 , C08G77/455 , C08L63/00 , C08L83/00 , C08L83/04 , H01L33/54 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/12044 , C08L2666/14 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a method for producing an optical and a radiation-emitting component by a molding process, and to an optical and a radiation-emitting component having well-defined viscosity.
摘要翻译：本发明涉及一种通过模制方法制造光学和辐射发射部件的方法，以及具有明确界定的粘度的光学和辐射发射部件的方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式