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    • 91. 发明申请
    • Reflection mask for EUV photolithography and method of fabricating the reflection mask
    • 用于EUV光刻的反射掩模和制造反射掩模的方法
    • US20060281017A1
    • 2006-12-14
    • US11441835
    • 2006-05-26
    • Suk-pil KimI-hun SongYoung-Soo ParkSeung-hyuk ChangHoon Kim
    • Suk-pil KimI-hun SongYoung-Soo ParkSeung-hyuk ChangHoon Kim
    • G21K5/00G03F1/00
    • G21K1/062B82Y10/00B82Y40/00G03F1/24
    • A reflection mask for extreme ultraviolet (EUV) photolithography and a method of fabricating the same, in which the reflection mask includes a substrate, a lower reflection layer formed in a multi-layer structure on the substrate and including a material reflecting EUV light, an upper reflection layer formed in a multi-layer structure on the lower reflection layer and reflecting EUV light, and a phase reversing layer formed between the lower reflection layer and the upper reflection layer in a certain pattern and causing destructive interference between reflection light from the upper reflection layer and reflection light from the lower reflection layer. An incidence of a shadow effect can be reduced and unnecessary EUV light can be eliminated, so that a pattern on the reflection mask can be projected precisely on a silicon wafer. Since the phase reversing layer includes the same material as the reflection layer and an absorption layer, mask fabrication processes can be handled easily.
    • 一种用于极紫外(EUV)光刻的反射掩模及其制造方法,其中反射掩模包括基板,在基板上形成为多层结构的下反射层,并且包括反射EUV光的材料, 在下反射层上形成多层结构并反射EUV光的上反射层和以一定图案形成在下反射层和上反射层之间的相位反转层,并且产生来自上层的反射光之间的相消干涉 反射层和来自下反射层的反射光。 可以减少阴影效应的入射,并且可以消除不必要的EUV光,使得反射掩模上的图案可以精确地投影在硅晶片上。 由于相位反转层包括与反射层和吸收层相同的材料,因此可以容易地处理掩模制造工艺。
    • 98. 发明授权
    • Magnetic random access memory and method of operating the same
    • 磁性随机存取存储器及其操作方法
    • US06781871B2
    • 2004-08-24
    • US10316844
    • 2002-12-12
    • Wan-jun ParkTae-wan KimI-hun SongSang-jin ParkRichard J. Gambino
    • Wan-jun ParkTae-wan KimI-hun SongSang-jin ParkRichard J. Gambino
    • G11C1100
    • G11C19/0808G11C11/15G11C11/16
    • A magnetic random access memory using magnetic domain drag and giant magnetoresistance (GMR) or tunnel magnetoresistance (TMR) and a method of operating the same, wherein the magnetic random access memory includes a data storage unit including a fixed layer, a non-magnetic layer, and a free layer having two ends; a data input means electrically connected to both ends of the free layer, for applying current to the free layer to input data into the data storage unit; and a data output means electrically connected to the free layer and the fixed layer to output data stored in the data storage unit. Accordingly, a magnetic random access memory according to the present invention has superior performance than one using a switching field to record data.
    • 一种使用磁畴阻力和巨磁阻(GMR)或隧道磁阻(TMR)的磁性随机存取存储器及其操作方法,其中磁性随机存取存储器包括数据存储单元,其包括固定层,非磁性层 和具有两端的自由层; 电连接到自由层的两端的数据输入装置,用于向自由层施加电流以将数据输入数据存储单元; 以及电连接到所述自由层和所述固定层的数据输出装置,以输出存储在所述数据存储单元中的数据。 因此,根据本发明的磁性随机存取存储器具有比使用切换字段来记录数据的磁性随机存取存储器更好的性能。
    • 100. 发明授权
    • Reflection mask for EUV photolithography and method of fabricating the reflection mask
    • 用于EUV光刻的反射掩模和制造反射掩模的方法
    • US07682758B2
    • 2010-03-23
    • US11441835
    • 2006-05-26
    • Suk-pil KimI-hun SongYoung-soo ParkSeung-hyuk ChangHoon Kim
    • Suk-pil KimI-hun SongYoung-soo ParkSeung-hyuk ChangHoon Kim
    • G03F1/00
    • G21K1/062B82Y10/00B82Y40/00G03F1/24
    • A reflection mask for extreme ultraviolet (EUV) photolithography and a method of fabricating the same, in which the reflection mask includes a substrate, a lower reflection layer formed in a multi-layer structure on the substrate and including a material reflecting EUV light, an upper reflection layer formed in a multi-layer structure on the lower reflection layer and reflecting EUV light, and a phase reversing layer formed between the lower reflection layer and the upper reflection layer in a certain pattern and causing destructive interference between reflection light from the upper reflection layer and reflection light from the lower reflection layer. An incidence of a shadow effect can be reduced and unnecessary EUV light can be eliminated, so that a pattern on the reflection mask can be projected precisely on a silicon wafer. Since the phase reversing layer includes the same material as the reflection layer and an absorption layer, mask fabrication processes can be handled easily.
    • 一种用于极紫外(EUV)光刻的反射掩模及其制造方法,其中反射掩模包括基板,在基板上形成为多层结构的下反射层,并且包括反射EUV光的材料, 在下反射层上形成多层结构并反射EUV光的上反射层和以一定图案形成在下反射层和上反射层之间的相位反转层,并且产生来自上层的反射光之间的相消干涉 反射层和来自下反射层的反射光。 可以减少阴影效应的入射,并且可以消除不必要的EUV光,使得反射掩模上的图案可以精确地投影在硅晶片上。 由于相位反转层包括与反射层和吸收层相同的材料,因此可以容易地处理掩模制造工艺。