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91. 发明申请

US20070127865A1 OPTICAL DEVICES AND METHODS TO CONSTRUCT THE SAME 审中-公开
标题翻译：光学装置及其构造方法
公开(公告)号：US20070127865A1
公开(公告)日：2007-06-07
申请号：US11671775
申请日：2007-02-06
申请人： Daoqiang Lu , Gilroy Vandentop
发明人： Daoqiang Lu , Gilroy Vandentop
IPC分类号： G02B6/12
CPC分类号： G02B6/423 , G02B6/4232
摘要： Optical devices and methods for constructing the same are disclosed. An example optical device includes an optical transmitter, a photodetector and a waveguide optically coupling the optical transmitter and the photodetector. It also includes a substrate having a first cavity to receive the optical transmitter and a second cavity to receive the second transmitter. The first and second cavities are located and dimensioned to passively align the optical transmitter, the waveguide and the photodetector when the transmitter is inserted into the first cavity and the photodetector is inserted into the second cavity.
摘要翻译：公开了用于构造它们的光学器件和方法。一种示例性光学装置包括光发射器，光电检测器和光学耦合光发射器和光电检测器的波导。其还包括具有用于接收光发射器的第一腔体和用于接收第二发射器的第二腔体的衬底。第一和第二空腔的位置和尺寸被定位成当发射器被插入到第一空腔中并且光电检测器被插入到第二腔中时被动对准光发射器，波导和光电检测器。

92. 发明申请

US20060291771A1 Methods and apparatus to mount a waveguide to a substrate 有权
标题翻译：将波导安装到基板的方法和装置
公开(公告)号：US20060291771A1
公开(公告)日：2006-12-28
申请号：US11166577
申请日：2005-06-24
申请人： Henning Braunisch , Daoqiang Lu , Nathaniel Arbizu
发明人： Henning Braunisch , Daoqiang Lu , Nathaniel Arbizu
IPC分类号： G02B6/26 , G02B6/12 , G02B6/30 , G02B6/36 , G02B6/42
CPC分类号： G02B6/4224 , G02B6/4204 , G02B6/4214 , G02B6/4239 , G02B6/4249 , H01L2224/14 , H01L2224/16225
摘要： Methods and apparatus to mount an optical waveguide to a substrate are disclosed. A disclosed method involves providing a substrate having a first layer and a second layer. The first layer includes at least one alignment fiducial and the second layer covers the at least one fiducial. At least a portion of the second layer is removed to render the fiducial visible and a waveguide is automatically aligned with the first fiducial. The waveguide is then fixed to the substrate.
摘要翻译：公开了将光波导安装到衬底的方法和装置。所公开的方法涉及提供具有第一层和第二层的衬底。第一层包括至少一个对准基准，第二层覆盖至少一个基准。去除第二层的至少一部分以使基准可见，并且波导自动与第一基准对准。然后将波导固定到基板。

93. 发明申请

US20060244148A1 Solder deposition on wafer backside for thin-die thermal interface material 有权
标题翻译：用于薄模热界面材料的晶片背面上的焊料沉积
公开(公告)号：US20060244148A1
公开(公告)日：2006-11-02
申请号：US11116554
申请日：2005-04-28
申请人： Daoqiang Lu
发明人： Daoqiang Lu
IPC分类号： H01L21/48 , H01L23/52
CPC分类号： H01L21/4871 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/31 , H01L24/75 , H01L24/83 , H01L2221/68327 , H01L2224/0401 , H01L2224/04026 , H01L2224/16 , H01L2224/274 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/73253 , H01L2224/83193 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/16152 , H01L2924/19043 , H01L2924/01047 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： A solder is deposited on the backside of a wafer. The wafer can be pre-deposited with a barrier layer such as a titanium base and other materials. Deposition is carried out by electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition. The solder-deposited die is bonded with a heat spreader that did not require a pre-deposited solder.
摘要翻译：焊料沉积在晶片的背面。晶片可以预先沉积有阻挡层，例如钛基和其它材料。通过电镀，化学镀，化学气相沉积和物理气相沉积进行沉积。焊料沉积的模具与不需要预沉积焊料的散热器结合。

94. 发明申请

US20060220223A1 Reactive nano-layer material for MEMS packaging 审中-公开
标题翻译：用于MEMS封装的反应性纳米层材料
公开(公告)号：US20060220223A1
公开(公告)日：2006-10-05
申请号：US11092054
申请日：2005-03-29
申请人： Daoqiang Lu , John Heck
发明人： Daoqiang Lu , John Heck
IPC分类号： H01L23/12
CPC分类号： B81C1/00269 , B81B2201/014 , B81C2203/0109 , B81C2203/019 , B81C2203/035
摘要： According to one embodiment an apparatus and method for MEMS packaging including a reactive nano-layer is presented. The apparatus comprises a substrate, an environmentally sensitive device on the substrate, a cap to fit over the device, and a hermetic seal between the cap and the substrate. The hermetic seal comprises a solder layer, and a reactive layer including one or more elements that react together through an initiating energy to emit exothermic heat to melt the solder layer.
摘要翻译：根据一个实施例，提出了包括反应性纳米层的用于MEMS封装的装置和方法。该设备包括基底，在基底上的环境敏感的装置，适合装置的盖子，以及盖子和基底之间的气密密封。气密密封件包括焊料层，以及包括一个或多个元件的反应层，其通过引发能量一起反应以发射放热以熔化焊料层。

95. 发明申请

US20060192281A1 Methods for sealing chambers of microelectronic packages 审中-公开
标题翻译：密封微电子封装腔室的方法
公开(公告)号：US20060192281A1
公开(公告)日：2006-08-31
申请号：US11406858
申请日：2006-04-19
申请人： Daoqiang Lu , John Heck
发明人： Daoqiang Lu , John Heck
IPC分类号： H01L23/12
CPC分类号： B81C1/00269 , H01L2224/45144 , H01L2224/48463 , Y10S257/924 , H01L2924/00
摘要： Microelectronic packages having chambers and sealing materials, and methods of making the packages, and sealing the chambers, are disclosed. An exemplary package may include a first surface, a second surface, a solid sealing material including an intermetallic compound, such as, for example, of gallium or another relatively low melting material, between the first surface and the second surface, and a chamber defined by the first surface, the second surface, and the sealing material. An exemplary method may include disposing a ring of a sealing material including a liquid metal between a first surface and a second surface to define a chamber between the first surface, the second surface, and the ring of the sealing material, and sealing the chamber by heating the sealing material to react the liquid metal with a metal that is capable of forming an intermetallic compound with the liquid metal.
摘要翻译：公开了具有室和密封材料的微电子封装，以及制造封装的方法和密封室。示例性包装可以包括在第一表面和第二表面之间的第一表面，第二表面，包括金属间化合物（例如镓或另一种较低熔点的材料）的固体密封材料，通过第一表面，第二表面和密封材料。示例性方法可以包括在第一表面和第二表面之间设置包括液体金属的密封材料的环，以在第一表面，第二表面和密封材料的环之间限定腔室，并且通过加热密封材料以使液态金属与能够与液态金属形成金属间化合物的金属反应。

96. 发明授权

US07038316B2 Bumpless die and heat spreader lid module bonded to bumped die carrier 失效
标题翻译：无铅模具和散热器盖模块接合到凸起的模具载体
公开(公告)号：US07038316B2
公开(公告)日：2006-05-02
申请号：US10811370
申请日：2004-03-25
申请人： Chuan Hu , Daoqiang Lu , Zhiyong Wang , Gilroy Vandentop
发明人： Chuan Hu , Daoqiang Lu , Zhiyong Wang , Gilroy Vandentop
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： B23K3/0623 , B23K2101/40 , H01L2224/05001 , H01L2224/05009 , H01L2224/05571 , H01L2224/05647 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/00 , H01L2224/05099
摘要： An IC package is assembled from a bumpless die, a die carrier having a plurality of solder bumps thereon, and a heat spreader lid. The bumpless die is bonded to the heat spreader lid to form a module and then the module is bonded to the bumped die carrier.
摘要翻译： IC封装由无冲击模具，其上具有多个焊料凸块的模具载体和散热器盖组装。将无凸起的模具结合到散热器盖上以形成模块，然后将模块结合到凸起的模具载体上。

97. 发明申请

US20060060637A1 Apparatus and method for attaching a semiconductor die to a heat spreader 有权
标题翻译：用于将半导体管芯附接到散热器的装置和方法
公开(公告)号：US20060060637A1
公开(公告)日：2006-03-23
申请号：US10948595
申请日：2004-09-22
申请人： Jadhav Susheel , Daoqiang Lu
发明人： Jadhav Susheel , Daoqiang Lu
IPC分类号： B23K31/02
CPC分类号： B23K1/203 , B23K1/0016 , B23K2101/40
摘要： Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to receive a number of die, and the die may be held in place on the surface by a flux, the flux being subsequently removed prior to bonding. The apparatus may further include a number of registration elements to hold a heat spreader in a relative position over each die. Other embodiments are described and claimed.
摘要翻译：公开了将半导体管芯附着到散热器（或其他热部件）上的装置和方法的实施例。该装置包括基本上平坦的表面以接收多个管芯，并且管芯可以通过焊剂保持在表面上的适当位置，焊剂随后在接合之前被去除。该装置还可以包括多个对准元件，以将散热器保持在每个管芯上的相对位置。描述和要求保护其他实施例。

98. 发明申请

US20060051021A1 Waveguide coupling mechanism 有权
公开(公告)号：US20060051021A1
公开(公告)日：2006-03-09
申请号：US10934858
申请日：2004-09-03
申请人： Henning Braunisch , Steven Towle , Daoqiang Lu , Gilroy Vandentop , Anna George
发明人： Henning Braunisch , Steven Towle , Daoqiang Lu , Gilroy Vandentop , Anna George
IPC分类号： G02B6/32
CPC分类号： G02B6/30 , G02B6/32
摘要： A system is disclosed. The system includes an external waveguide and an IC coupled to the external waveguide. The IC includes at least two lenses and a second waveguide. The lenses couple radiant energy from the external waveguide to the second waveguide.

99. 发明授权

US06933171B2 Large bumps for optical flip chips 有权
公开(公告)号：US06933171B2
公开(公告)日：2005-08-23
申请号：US10691136
申请日：2003-10-21
申请人： Ming Fang , Valery Dubin , Daoqiang Lu
发明人： Ming Fang , Valery Dubin , Daoqiang Lu
IPC分类号： G02B6/42 , H01L21/00 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/60 , H01L23/48 , H01L23/485 , H01L23/52 , H01L27/15 , H01L29/267 , H01L31/12 , H01L33/00
CPC分类号： H01L24/16 , G02B6/4204 , G02B6/4232 , H01L24/11 , H01L24/81 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00015 , H01L2224/29099
摘要： The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer.

100. 发明申请

US20050013557A1 Optical packages and methods for controlling a standoff height in optical packages 审中-公开
标题翻译：用于控制光学封装中的间隔高度的光学封装和方法
公开(公告)号：US20050013557A1
公开(公告)日：2005-01-20
申请号：US10619348
申请日：2003-07-14
申请人： Daoqiang Lu
发明人： Daoqiang Lu
IPC分类号： G02B6/42
CPC分类号： G02B6/4214
摘要： Optical packages and methods for controlling a standoff height in optical packages are disclosed. A disclosed package includes a chip die, a substrate, and a spacer to separate the die and the substrate at a predetermined standoff height. The size of the spacer may be chosen to maximize an optical coupling between the chip and an optical waveguide mounted to the substrate. The spacer is bonded to a conductive pad on the substrate and a conductive pad on the die to create an electrical connection between the substrate and the optical flip chip die.
摘要翻译：公开了用于控制光学封装中的间隔高度的光学封装和方法。公开的封装包括芯片芯片，基板和间隔件，以在预定的间隔高度处分离模具和基板。可以选择间隔件的尺寸以使芯片和安装到基板的光波导之间的光耦合最大化。间隔物结合到衬底上的导电焊盘和芯片上的导电焊盘，以在衬底和光学倒装芯片裸片之间形成电连接。

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