专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明授权

US08640010B2 Decoding apparatus and decoding method 失效
标题翻译：解码装置和解码方法
公开(公告)号：US08640010B2
公开(公告)日：2014-01-28
申请号：US12335802
申请日：2008-12-16
申请人： Toshiyuki Miyauchi , Masayuki Hattori , Takashi Yokokawa
发明人： Toshiyuki Miyauchi , Masayuki Hattori , Takashi Yokokawa
IPC分类号： G06F11/00
CPC分类号： H03M13/15 , H03M13/1515 , H03M13/45
摘要： Disclosed herein is a decoding apparatus that performs soft-decision decoding on a linear block code, the apparatus including a hard-decision decoder configured to perform hard-decision decoding on a received word using a hard-decision decoding algorithm; and a soft-decision decoder configured to perform, using a soft-decision algorithm, soft-decision decoding merely on a received word for which the hard-decision decoder has failed in the hard-decision decoding.
摘要翻译：本发明公开了一种对线性块码执行软判决解码的解码装置，该装置包括：硬判决解码器，被配置为使用硬判决解码算法对接收到的字执行硬判决解码; 以及软判决解码器，其被配置为仅在硬判决解码器在硬判决解码中已经失败的接收到的字上执行软判决算法的软判决解码。

92. 发明授权

US07550020B2 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method 有权
标题翻译：化学机械抛光水性分散体和化学机械抛光方法
公开(公告)号：US07550020B2
公开(公告)日：2009-06-23
申请号：US11180619
申请日：2005-07-14
申请人： Norihiko Ikeda , Kazuo Nishimoto , Masayuki Hattori , Nobuo Kawahashi
发明人： Norihiko Ikeda , Kazuo Nishimoto , Masayuki Hattori , Nobuo Kawahashi
IPC分类号： C09G1/02 , C09G1/04
CPC分类号： H01L21/31053 , C09G1/02
摘要： A chemical mechanical polishing aqueous dispersion comprises abrasives in a concentration of not more than 1.5% by mass, wherein the abrasives comprise ceria and have an average dispersed particle diameter of not less than 1.0 μm. A chemical mechanical polishing method comprises polishing an insulating film by the use of the chemical mechanical polishing aqueous dispersion. By the use of the chemical mechanical polishing aqueous dispersion, occurrence of polishing scratches can be suppressed without lowering a removal rate.
摘要翻译：化学机械研磨用水分散体包含浓度为1.5质量％以下的研磨剂，其中研磨剂包含二氧化铈，平均分散粒径不小于1.0μm。化学机械抛光方法包括通过使用化学机械抛光水分散体抛光绝缘膜。通过使用化学机械研磨水分散体，可以抑制抛光划痕的发生，而不降低去除率。

93. 发明申请

US20080274620A1 CHEMICAL MECHANICAL POLISHING AGENT KIT AND CHEMICAL MECHANICAL POLISHING METHOD USING THE SAME 审中-公开
标题翻译：化学机械抛光剂套件及其化学机械抛光方法
公开(公告)号：US20080274620A1
公开(公告)日：2008-11-06
申请号：US12164320
申请日：2008-06-30
申请人： Hirotaka SHIDA , Tomohisa Konno , Masayuki Hattori , Nobuo Kawahashi
发明人： Hirotaka SHIDA , Tomohisa Konno , Masayuki Hattori , Nobuo Kawahashi
IPC分类号： H01L21/302
CPC分类号： C09G1/02 , H01L21/3212
摘要： A chemical mechanical polishing method of the present invention comprises conducting polishing by the use of a chemical mechanical polishing aqueous dispersion (A) containing abrasive grains and then conducting polishing by the use of a chemical mechanical polishing aqueous composition (B) containing at least one organic compound having a heterocyclic ring in addition to the chemical mechanical polishing aqueous dispersion (A). Also A chemical mechanical polishing agent kit of the present invention comprises the chemical mechanical polishing aqueous dispersion (A) and the chemical mechanical polishing aqueous composition (B). The polishing method and the polishing agent kit can prevent an increase of dishing and corrosion of wiring portion to enhance the yield.
摘要翻译：本发明的化学机械抛光方法包括通过使用含有磨粒的化学机械抛光水分散体（A）进行抛光，然后通过使用含有至少一种有机物的化学机械抛光含水组合物（B）进行抛光除了化学机械研磨水分散体（A）之外还具有杂环的化合物。本发明的化学机械研磨剂试剂盒也包括化学机械研磨用水分散体（A）和化学机械研磨用水性组合物（B）。抛光方法和抛光剂套件可以防止布线部分的凹陷和腐蚀增加以提高产量。

94. 发明申请

US20080120918A1 POLISHING COMPOSITION AND POLISHING PROCESS 审中-公开
标题翻译：抛光组合物和抛光工艺
公开(公告)号：US20080120918A1
公开(公告)日：2008-05-29
申请号：US11945004
申请日：2007-11-26
申请人： Masayuki Hattori , Hideyuki Satoh , Atsunori Kawamura
发明人： Masayuki Hattori , Hideyuki Satoh , Atsunori Kawamura
IPC分类号： C09K3/14
CPC分类号： H01L21/3212 , C09G1/02
摘要： To provide a polishing composition which is suitable particularly for an application to polish a wafer containing tungsten, and a polishing process employing such a polishing composition.The polishing composition of the present invention comprises a colloidal silica and hydrogen peroxide. The pH of the polishing composition is from 1 to 4, and the concentration of iron ions in the polishing composition is at most 0.02 ppm. The polishing composition preferably further contains phosphoric acid or a phosphate.
摘要翻译：提供一种特别适用于抛光含钨晶片的抛光组合物，以及使用这种抛光组合物的抛光工艺。本发明的抛光组合物包含胶体二氧化硅和过氧化氢。抛光组合物的pH为1〜4，抛光组合物中铁离子的浓度为0.02ppm以下。抛光组合物优选还含有磷酸或磷酸盐。

95. 发明授权

US07340663B2 Method and apparatus for embedding an additional layer of error correction into an error correcting code 失效
标题翻译：用于将错误校正的附加层嵌入纠错码的方法和装置
公开(公告)号：US07340663B2
公开(公告)日：2008-03-04
申请号：US10509475
申请日：2003-03-14
申请人： Marten Erik Van Dijk , Kouhei Yamamoto , Masayuki Hattori
发明人： Marten Erik Van Dijk , Kouhei Yamamoto , Masayuki Hattori
IPC分类号： H03M13/00
CPC分类号： H03M13/2906 , G11B20/1833
摘要： A method of embedding an additional layer of error correction into an error correcting code, wherein information is encoded into code words of said code over a first Galois field and wherein a number of code words are arranged in the columns of a code block comprising a user data sub-block and a parity data sub-block, provides an additional layer of error correction that can be easily implemented without losing compatibility improving the error correction capabilities. The method includes the steps of: encoding the rows of at least the user data sub-block separately or in groups using a horizontal error correcting code over a second Galois field larger than the first Galois field to obtain horizontal parities, and embedding the horizontal parities as additional layer in the error correcting code.
摘要翻译：一种将错误校正的附加层嵌入到纠错码中的方法，其中信息通过第一伽罗瓦域编码成所述码的码字，并且其中多个码字排列在包括用户的码块的列中数据子块和奇偶校验数据子块提供可以容易地实现的附加的纠错层，而不失去改进纠错能力的兼容性。该方法包括以下步骤：在大于第一伽罗瓦域的第二伽罗瓦域上，使用水平纠错码，分别地或以组分组编码至少用户数据子块的行以获得水平奇偶校验，并嵌入水平奇偶校验作为纠错码中的附加层。

96. 发明授权

US07252782B2 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method 有权
标题翻译：化学机械抛光水性分散体和化学机械抛光方法
公开(公告)号：US07252782B2
公开(公告)日：2007-08-07
申请号：US11038190
申请日：2005-01-21
申请人： Norihiko Ikeda , Kazuo Nishimoto , Masayuki Hattori , Nobuo Kawahashi
发明人： Norihiko Ikeda , Kazuo Nishimoto , Masayuki Hattori , Nobuo Kawahashi
IPC分类号： C09K13/06
CPC分类号： C09G1/02 , C09K3/1463 , H01L21/31053
摘要： A chemical mechanical polishing aqueous dispersion comprises abrasives (A) containing ceria, an anionic water-soluble polymer (B) and a cationic surfactant (C), wherein the amount of the anionic water-soluble polymer (B) is in the range of 60 to 600 parts by mass based on 100 parts by mass of the abrasives (A) containing ceria, and the amount of the cationic surfactant (C) is in the range of 0.1 to 100 ppm based on the whole amount of the chemical mechanical polishing aqueous dispersion.
摘要翻译：化学机械抛光水分散体包含含有二氧化铈的研磨剂（A），阴离子水溶性聚合物（B）和阳离子表面活性剂（C），其中阴离子水溶性聚合物（B）的量在60 相对于100质量份含有二氧化铈的研磨剂（A）为600质量份，阳离子性表面活性剂（C）的含量相对于化学机械研磨用水的总量为0.1〜100ppm 分散。

97. 发明授权

US07103819B2 Decoding device and decoding method 失效
标题翻译：解码设备和解码方法
公开(公告)号：US07103819B2
公开(公告)日：2006-09-05
申请号：US10493739
申请日：2003-08-26
申请人： Atsushi Kikuchi , Masayuki Hattori
发明人： Atsushi Kikuchi , Masayuki Hattori
IPC分类号： H03M13/00
CPC分类号： H03M13/6577 , H03M13/1111
摘要： A decoding device that allows for high precision decoding of LDPC codes by optimizing the quantization width includes a distribution determining unit that determines a distribution of noise superposed on data received by a receiving unit, a quantization width determining unit that determines the quantization width that is optimized so that the error probability after decoding becomes the minimum with respect to the noise distribution determined by the distribution determining unit or the noise distribution determined by the distribution determining unit becomes the maximum with respect to a given error probability after decoding, a quantizing unit that quantizes the probability distribution of the received value received by the receiving unit with a predetermined low bit number according to the determined quantization width, and a message determining unit that determines a message as information bits based on the probability distribution of the received value quantized by the quantizing unit.
摘要翻译：通过优化量化宽度来允许对LDPC码进行高精度解码的解码装置包括分配确定单元，其确定叠加在由接收单元接收的数据上的噪声的分布;量化宽度确定单元，确定优化的量化宽度使得解码后的误差概率相对于由分布确定单元确定的噪声分布或由分布确定单元确定的噪声分布相对于解码之后的给定误差概率为最大，成为最小值，量化单元根据所确定的量化宽度，接收单元以预定的低位数接收的接收值的概率分布，以及消息确定单元，其基于由量化器量化的接收值的概率分布来确定消息作为信息比特 g单位。

98. 发明申请

US20060186089A1 Chemical mechanical polishing method 有权
公开(公告)号：US20060186089A1
公开(公告)日：2006-08-24
申请号：US11358224
申请日：2006-02-22
申请人： Hirotaka Shida , Masayuki Hattori
发明人： Hirotaka Shida , Masayuki Hattori
IPC分类号： C03C15/00 , B44C1/22 , C23F1/00
CPC分类号： C09G1/02 , H01L21/3212
摘要： A chemical mechanical polishing method, including: chemically and mechanically polishing a polishing target surface by continuously performing a first polishing step and a second polishing step having a polishing rate lower than a polishing rate of the first polishing step, a chemical mechanical polishing aqueous dispersion used in the first polishing step and the second polishing step being a mixture of an aqueous dispersion and an aqueous solution, and the polishing rate being changed between the first polishing step and the second polishing step by changing a mixing ratio of the aqueous dispersion and the aqueous solution.

99. 发明授权

US07055090B2 Coding apparatus, coding method, decoding apparatus, and decoding method 失效
标题翻译：编码装置，编码方法，解码装置和解码方法
公开(公告)号：US07055090B2
公开(公告)日：2006-05-30
申请号：US10648093
申请日：2003-08-26
申请人： Atsushi Kikuchi , Masayuki Hattori
发明人： Atsushi Kikuchi , Masayuki Hattori
IPC分类号： G06F11/00
CPC分类号： H03M13/6577 , H03M13/1111
摘要： In a coding apparatus and a decoding apparatus, the performance of codes is improved by optimizing a degree sequence and a quantization step size. The coding apparatus includes a degree sequence calculator for calculating a degree sequence indicating the distribution of the number of 1s in the parity check matrix, a parity check matrix generator for producing a parity check matrix on the basis of the degree sequence calculated by the degree sequence calculator, and an encoder for coding the input data using the parity check matrix generated by the parity check matrix generator. The degree sequence calculator optimizes the degree sequence such that when, in the decoding apparatus for decoding coded data, a received value and a message are represented by a small number of bits, the error probability after decoding is minimized for a given variance of noise or the allowable variance of noise is maximized for a given error probability after decoding.
摘要翻译：在编码装置和解码装置中，通过优化度数序列和量化步长来提高码的性能。编码装置包括：度数序列计算器，用于计算表示奇偶校验矩阵中1个数的分布的度数序列;奇偶校验矩阵生成器，用于基于由度数序列计算的度序列来产生奇偶校验矩阵计算器和使用由奇偶校验矩阵发生器产生的奇偶校验矩阵对输入数据进行编码的编码器。度数序列计算器优化程度序列，使得当在用于解码编码数据的解码装置中接收到的值和消息由少量位表示时，对于给定的噪声方差，解码之后的误差概率最小化解码后的给定误差概率可以使噪声容许方差最大化。

100. 发明申请

US20050227451A1 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method 有权
标题翻译：化学机械抛光水性分散体和化学机械抛光方法
公开(公告)号：US20050227451A1
公开(公告)日：2005-10-13
申请号：US11102639
申请日：2005-04-11
申请人： Tomohisa Konno , Hirotaka Shida , Kiyonobu Kubota , Masayuki Hattori , Nobuo Kawahashi
发明人： Tomohisa Konno , Hirotaka Shida , Kiyonobu Kubota , Masayuki Hattori , Nobuo Kawahashi
IPC分类号： C09G1/02 , H01L21/76
CPC分类号： C09G1/02 , C09K3/1463 , H01L21/31053 , H01L21/3212 , H01L21/76819
摘要： Disclosed is a chemical mechanical polishing aqueous dispersion comprising (A1) first fumed silica having a specific surface area of not less than 10 m2/g and less than 160 m2/g and an average secondary particle diameter of not less than 170 nm and not more than 250 nm and (A2) second fumed silica having a specific surface area of not less than 160 m2/g and an average secondary particle diameter of not less than 50 nm and less than 170 nm. Also disclosed is a chemical mechanical polishing method using the chemical mechanical polishing aqueous dispersion. According to the chemical mechanical polishing aqueous dispersion and the chemical mechanical polishing method, a chemical mechanical polishing process wherein a barrier metal layer and a cap layer can be efficiently removed by polishing and damage to an insulating film material of a low dielectric constant present in the underlying layer is reduced can be carried out.
摘要翻译：公开了一种化学机械抛光水分散体，其包含（A1）比表面积不小于10m 2 / g且小于160m 2 / g的第一热解法二氧化硅， g，平均二次粒径为170nm以上250nm以下，（A2）比表面积为160m 2 / g以上的第二热解法二氧化硅，平均二次粒径不小于50nm且小于170nm。还公开了使用化学机械研磨水分散体的化学机械研磨方法。根据化学机械抛光水分散体和化学机械抛光方法，化学机械抛光方法可以通过抛光和损坏存在于介质中的低介电常数的绝缘薄膜材料来有效地去除阻挡金属层和盖层底层减少可以进行。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式