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    • 91. 发明授权
    • Light irradiation apparatus and light irradiation method
    • 光照射装置和光照射法
    • US08222620B2
    • 2012-07-17
    • US12993682
    • 2009-05-22
    • Kenji Kobayashi
    • Kenji Kobayashi
    • A61N5/00
    • H01L21/68707H01L21/67115H01L21/67132
    • A light irradiation apparatus 10 is configured to comprise: a supporting means 11 for supporting a semiconductor wafer W as an irradiated object, the semiconductor wafer W being stuck with an adhesive sheet S having an ultraviolet curable adhesive on a circuit formation surface; and a light irradiating means 13 having a focus axis P at a location spaced by a predetermined distance, and being provided so as to enable head-swinging motion thereof. The supporting means 11 is supported by a multi-joint robot 12, and relatively displaces the wafer W so as to prevent an adhesive layer surface SA of the adhesive sheet S from deviating from a position of the focus axis P, when the ultraviolet ray irradiating means 13 performs the head-swinging motion.
    • 光照射装置10被构造为包括:用于支撑半导体晶片W作为被照射物体的支撑装置11,半导体晶片W在电路形成表面上粘附有具有紫外线固化粘合剂的粘合片S; 以及具有聚焦轴P位于间隔预定距离的位置处的光照射装置13,并且被设置成能够进行头摆动作。 支撑装置11由多关节机器人12支撑,并且当紫外线照射时,相对移动晶片W以防止粘合片S的粘合剂层表面SA偏离聚焦轴P的位置 装置13执行头摆动作。
    • 93. 发明授权
    • Label printer
    • 标签打印机
    • US07963710B2
    • 2011-06-21
    • US11909230
    • 2006-03-14
    • Kenji KobayashiAkira Dangami
    • Kenji KobayashiAkira Dangami
    • B41J15/00
    • B41J15/22B41J3/4075B65C9/0015B65C9/1803B65C9/1884
    • The printer includes a printing unit 12 that performs printing on each of a label L1 and a second raw sheet M2 on the way of feeding out a first raw sheet M1, which is temporarily stuck with labels L1 on a release liner S, and a second raw sheet M2 having no adhesive layer; a peeling unit 13 that peels off the label L1 from the release liner S; first and second holding units 15, 16 that hold a label sheet L2 formed via a cutting unit 14; and a laminating unit 17 that laminates the label L1 and the label sheet L2 with each other so that the reverse surface of the printed surface of the label sheet L2 faces the adhesive layer side of the label L1 are provided. The label L1 laminated with the label sheet L2 is stuck onto an adherend W in a state that the adhesive layer is exposed in a closed loop state in an entire area of the periphery of the label sheet L2.
    • 该打印机包括一个打印单元12,该打印单元12在将标签L1临时粘贴在释放衬垫S上的第一原纸M1的供给路径上进行标签L1和第二原纸M2各自的打印, 没有粘合剂层的原料薄片M2; 从剥离衬垫S剥离标签L1的剥离单元13; 保持经由切割单元14形成的标签纸L2的第一保持单元15和第二保持单元16; 以及层叠单元17,其将标签L1和标签片L2彼此层叠,使得标签片材L2的印刷表面的背面面向标签L1的粘合剂层侧。 在标签片L2的周围的整个区域中,粘合剂层以闭环状态露出的状态下,贴合标签片L2的标签L1被粘贴在被粘物W上。
    • 96. 发明申请
    • LIGHT IRRADIATION APPARATUS AND LIGHT IRRADIATION METHOD
    • 光照射装置和光照射方法
    • US20110089337A1
    • 2011-04-21
    • US12993682
    • 2009-05-22
    • Kenji Kobayashi
    • Kenji Kobayashi
    • G21K5/08G21K5/10
    • H01L21/68707H01L21/67115H01L21/67132
    • A light irradiation apparatus 10 is configured to comprise: a supporting means 11 for supporting a semiconductor wafer W as an irradiated object, the semiconductor wafer W being stuck with an adhesive sheet S having an ultraviolet curable adhesive on a circuit formation surface; and a light irradiating means 13 having a focus axis P at a location spaced by a predetermined distance, and being provided so as to enable head-swinging motion thereof. The supporting means 11 is supported by a multi-joint robot 12, and relatively displaces the wafer W so as to prevent an adhesive layer surface SA of the adhesive sheet S from deviating from a position of the focus axis P, when the ultraviolet ray irradiating means 13 performs the head-swinging motion.
    • 光照射装置10被构造为包括:用于支撑半导体晶片W作为被照射物体的支撑装置11,半导体晶片W在电路形成表面上粘附有具有紫外线固化粘合剂的粘合片S; 以及具有聚焦轴P位于间隔预定距离的位置处的光照射装置13,并且被设置成能够进行头摆动作。 支撑装置11由多关节机器人12支撑,并且当紫外线照射时,相对移动晶片W以防止粘合片S的粘合剂层表面SA偏离聚焦轴P的位置 装置13执行头摆动作。