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    • 91. 发明授权
    • Printer and recording method
    • 打印机和录音方式
    • US08013885B2
    • 2011-09-06
    • US11643412
    • 2006-12-21
    • Hiroyuki KohiraNorimitsu Sanbongi
    • Hiroyuki KohiraNorimitsu Sanbongi
    • B41J2/325
    • B41J3/4075B41J3/44B41J11/002B41J15/046
    • A printer comprises a recording portion with a thermal recording head for recording on a surface of a recording medium and a first conveying mechanism that conveys the recording medium. A thermal activation portion has a thermal activation head for heating another surface of the recording medium and a second conveying mechanism for conveying the recording medium. First and second discharge ports are disposed on a downstream side of the first and second conveying mechanisms, respectively. A pair of conveying rollers is arranged between the recording portion and the first discharge port and between the first discharge port and the thermal activation portion. The conveying rollers convey the recording medium from the recording portion to the first discharge port through normal rotation of the conveying rollers, change a conveyance course of the recording medium conveyed from the recording portion, and convey the recording medium to the thermal activation portion through reverse rotation of the conveying rollers.
    • 打印机包括具有用于记录在记录介质的表面上的热记录头的记录部分和传送记录介质的第一输送机构。 热激活部分具有用于加热记录介质的另一表面的热激活头和用于传送记录介质的第二输送机构。 第一和第二排出口分别设置在第一和第二输送机构的下游侧。 一对输送辊布置在记录部分和第一排出口之间以及第一排出口和热活化部分之间。 传送辊通过传送辊的正常转动将记录介质从记录部分传送到第一排出口,改变从记录部分输送的记录介质的传送过程,并通过反向将记录介质传送到热活化部分 输送辊的旋转。
    • 92. 发明申请
    • Manufacturing method for a thermal head
    • 热头制造方法
    • US20110031212A1
    • 2011-02-10
    • US12804954
    • 2010-08-03
    • Noriyoshi ShojiNorimitsu SanbongiToshimitsu MorookaKeitaro Koroishi
    • Noriyoshi ShojiNorimitsu SanbongiToshimitsu MorookaKeitaro Koroishi
    • B32B38/10
    • B41J2/3359Y10T29/49083
    • Provided is a manufacturing method for a thermal head, including: bonding a flat upper substrate in a stacked state onto a flat supporting substrate including a heat-insulating concave portion open to one surface thereof so that the heat-insulating concave portion is closed (bonding step (SA2)); thinning the upper substrate bonded onto the supporting substrate by the bonding step (SA2) (plate thinning step (SA3)); measuring a thickness of the upper substrate thinned by the plate thinning step (SA3) (measurement step (SA4)); deciding a target resistance value of heating resistors based on the thickness of the upper substrate, which is measured by the measurement step (SA4) (decision step (SA5)); and forming, at positions of a surface of the upper substrate thinned by the plate thinning step (SA3), the heating resistors having the target resistance value determined by the decision step (SA5), the positions being opposed to the heat-insulating concave portion (resistor forming step (SA6)). Thus, a high-efficiency thermal head capable of accurately outputting a target heating amount obtained by estimating an amount of heat wasted without being used is easily manufactured without using a special apparatus.
    • 本发明提供一种热敏头的制造方法,其特征在于,包括:将层叠状态的平坦的上部基板接合在具有向其一个表面开口的绝热凹部的平坦的支撑基板上,使得所述绝热凹部闭合(接合 步骤(SA2)); 通过接合步骤(SA2)(板薄化步骤(SA3))使结合到支撑衬底上的上衬底变薄; 测量通过板薄化步骤(SA3)变薄的上基板的厚度(测量步骤(SA4)); 基于通过测量步骤(SA4)测量的上基板的厚度(判定步骤(SA5)),确定加热电阻器的目标电阻值; 在由所述薄板稀化工序(SA3)变薄的所述上基板的表面的位置处,形成由所述判定工序(SA5)决定的所述目标电阻值的所述加热电阻体,与所述绝热凹部 (电阻形成工序(SA6))。 因此,在不使用特殊装置的情况下,容易制造能够精确地输出通过估计不使用而浪费的热量而获得的目标加热量的高效热头。
    • 93. 发明申请
    • Thermal head and printer
    • 热敏头和打印机
    • US20110025808A1
    • 2011-02-03
    • US12804723
    • 2010-07-28
    • Norimitsu Sanbongi
    • Norimitsu Sanbongi
    • B41J2/335
    • B41J2/3355B41J2/3359
    • Provided is a thermal head in which, even when an upper plate substrate and a lower plate substrate are in a bonded state, a thickness of the upper plate substrate is adjusted to an appropriate value to allow an improvement in thermal efficiency. Adopted is a thermal head including: a support substrate; an upper plate substrate having a back surface thereof bonded to a top surface of the support substrate; a heating resistor provided on the upper plate substrate; a concave portion formed in a region of at least one of the top surface of the support substrate and the back surface of the upper plate substrate, which opposes the heating resistor; and a through portion formed in the upper plate substrate, which passes through the upper plate substrate from a top surface of the upper plate substrate to the top surface of the support substrate in a plate thickness direction.
    • 提供一种热敏头,其中即使当上板基板和下板基板处于接合状态时,将上板基板的厚度调整到适当的值,以提高热效率。 采用热敏头,包括:支撑基板; 上板基板,其背面接合到所述支撑基板的上表面; 设置在上板基板上的加热电阻器; 形成在所述支撑基板的上表面和所述上板基板的与所述加热电阻体相对的背面中的至少一个的区域中的凹部; 以及形成在所述上板基板上的贯通部,所述贯通部在所述上板基板的上板基板上从所述上板基板的上表面到所述支撑基板的上表面的板厚方向贯通。
    • 96. 发明授权
    • Thermal head and printer
    • 热敏头和打印机
    • US08339431B2
    • 2012-12-25
    • US12928261
    • 2010-12-07
    • Norimitsu SanbongiToshimitsu MorookaKeitaro KoroishiNoriyoshi Shoji
    • Norimitsu SanbongiToshimitsu MorookaKeitaro KoroishiNoriyoshi Shoji
    • B41J2/335
    • B41J2/33585B41J2/3358
    • Provided is a thermal head including an intermediate layer between a support substrate and an upper substrate, which is capable of suppressing heat dissipation toward the support substrate while maintaining printing quality. Employed is a thermal head (1) including: an upper substrate (5); a support substrate (3) bonded in a stacked state on one surface side of the upper substrate (5); a heating resistor (7) provided on another surface side of the upper substrate (5); and an intermediate layer (6) including a concave portion that forms a cavity portion (4) in a region corresponding to the heating resistor (7), the intermediate layer (6) being provided between the upper substrate (5) and the support substrate (3), in which the intermediate layer (6) is formed of a plate-shaped glass material having a lower melting point than melting points of the upper substrate (5) and the support substrate (3).
    • 提供一种热敏头,其包括在支撑基板和上基板之间的中间层,其能够在保持打印质量的同时抑制向支撑基板的散热。 使用的是热头(1),包括:上基板(5); 在所述上基板(5)的一个表面侧以层叠状态接合的支撑基板(3)。 设置在上基板(5)的另一表面侧的发热电阻(7); 以及包括在对应于所述加热电阻器(7)的区域中形成空腔部分(4)的凹部的中间层(6),所述中间层(6)设置在所述上​​基板(5)和所述支撑基板 (3),其中中间层(6)由具有比上基板(5)和支撑基板(3)的熔点低的熔点的板状玻璃材料形成。