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    • 92. 发明申请
    • Integrated Infrared and Color CMOS Imager Sensor
    • 集成红外和彩色CMOS成像传感器
    • US20100102366A1
    • 2010-04-29
    • US12258347
    • 2008-10-24
    • Jong-Jan LeeDouglas J. TweetJon M. Speigle
    • Jong-Jan LeeDouglas J. TweetJon M. Speigle
    • H01L31/112H01L31/18
    • H01L27/14645H01L27/14609H01L27/14621H01L27/1463
    • An integrated infrared (IR) and full color complementary metal oxide semiconductor (CMOS) imager array is provided. The array is built upon a lightly doped p doped silicon (Si) substrate. Each pixel cell includes at least one visible light detection pixel and an IR pixel. Each visible light pixel includes a moderately p doped bowl with a bottom p doped layer and p doped sidewalls. An n doped layer is enclosed by the p doped bowl, and a moderately p doped surface region overlies the n doped layer. A transfer transistor has a gate electrode overlying the p doped sidewalls, a source formed from the n doped layer, and an n+ doped drain connected to a floating diffusion region. The IR pixel is the same, except that there is no bottom p doped layer. An optical wavelength filter overlies the visible light and IR pixels.
    • 提供集成红外(IR)和全色互补金属氧化物半导体(CMOS)成像器阵列。 阵列建立在轻掺杂的p掺杂硅(Si)衬底上。 每个像素单元包括至少一个可见光检测像素和IR像素。 每个可见光像素包括具有底部p掺杂层和p掺杂侧壁的中等P掺杂的碗。 n掺杂层被p掺杂的碗封闭,并且中等P掺杂的表面区域覆盖在n掺杂层上。 传输晶体管具有覆盖p掺杂侧壁的栅电极,由n掺杂层形成的源和连接到浮置扩散区的n +掺杂漏极。 IR像素是相同的,除了没有底部p掺杂层。 光学波长滤光器覆盖可见光和IR像素。
    • 93. 发明申请
    • Floating body germanium phototransistor having a photo absorption threshold bias region
    • 具有光吸收阈值偏置区域的浮体锗光电晶体管
    • US20070290288A1
    • 2007-12-20
    • US11894938
    • 2007-08-22
    • Sheng HsuJong-Jan LeeJer-Shen MaaDouglas Tweet
    • Sheng HsuJong-Jan LeeJer-Shen MaaDouglas Tweet
    • H01L31/10
    • H01L31/1136
    • A floating body germanium (Ge) phototransistor with a photo absorption threshold bias region, and an associated fabrication process are presented. The method includes: providing a p-doped Silicon (Si) substrate; selectively forming an insulator layer overlying a first surface of the Si substrate; forming an epitaxial Ge layer overlying the insulator layer; forming a channel region in the Ge layer; forming a gate dielectric, gate electrode, and gate spacers; forming source/drain (S/D) regions in the Ge layer; and, forming a photo absorption threshold bias region in the Ge layer, adjacent the channel region. In one aspect, the second S/D region has a length, longer than the first S/D length. The photo absorption threshold bias region underlies the second S/D region. Alternately, the second S/D region is separated from the channel by an offset, and the photo absorption threshold bias region is the offset in the Ge layer, after a light p-doping.
    • 提出了具有光吸收阈值偏置区域的浮体锗(Ge)光电晶体管,以及相关的制造工艺。 该方法包括:提供p掺杂硅(Si)衬底; 选择性地形成覆盖在所述Si衬底的第一表面上的绝缘体层; 形成覆盖绝缘体层的外延Ge层; 在Ge层中形成沟道区; 形成栅极电介质,栅电极和栅极间隔物; 在Ge层中形成源极/漏极(S / D)区域; 并且在Ge层中形成邻近沟道区的光吸收阈值偏置区域。 在一个方面,第二S / D区域具有比第一S / D长度更长的长度。 光吸收阈值偏置区域位于第二S / D区域的下方。 或者,第二S / D区域与沟道分离偏移,光吸收阈值偏置区域是在光p掺杂之后的Ge层中的偏移。
    • 94. 发明申请
    • Wide output swing CMOS imager
    • 宽输出摆幅CMOS成像器
    • US20070218579A1
    • 2007-09-20
    • US11416742
    • 2006-05-03
    • Jong-Jan LeeSheng Hsu
    • Jong-Jan LeeSheng Hsu
    • H01L21/00
    • H01L27/14647H01L27/14603H01L27/14632H01L27/14645H01L27/14683H01L27/14689
    • A CMOS active pixel sensor (APS) imager cell is provided on a silicon-on-insulator (SOI) substrate. The APS imager cell is made from a SOI substrate including a silicon (Si) substrate, a silicon dioxide insulator overlying the substrate, and a Si top layer overlying the insulator. A pixel sensor cell including a photodiode is formed in the Si top layer of the SOI substrate. A pixel transistor set is formed in the SOI top Si layer and connected to the pixel sensor cell. The pixel transistor set includes at least one p-channel MOS (PMOS) transistor and at least one n-channel MOS (NMOS) transistor. In the case of a three-transistor (3T) pixel transistor set, the selected transistor is NMOS, the reset transistor is PMOS, and the source follower may be either NMOS or PMOS.
    • 在绝缘体上硅(SOI)衬底上提供CMOS有源像素传感器(APS)成像器单元。 APS成像器单元由包括硅(Si)衬底,覆盖衬底的二氧化硅绝缘体和覆盖绝缘体的Si顶层的SOI衬底制成。 在SOI衬底的Si顶层中形成包括光电二极管的像素传感器单元。 像素晶体管组形成在SOI顶部Si层中并连接到像素传感器单元。 像素晶体管组包括至少一个p沟道MOS(PMOS)晶体管和至少一个n沟道MOS(NMOS)晶体管。 在三晶体管(3T)像素晶体管组的情况下,所选择的晶体管是NMOS,复位晶体管是PMOS,源极跟随器可以是NMOS或PMOS。
    • 97. 发明申请
    • Ultrathin SOI transistor and method of making the same
    • 超薄SOI晶体管及其制作方法
    • US20060172475A1
    • 2006-08-03
    • US11050495
    • 2005-02-01
    • Sheng HsuJong-Jan Lee
    • Sheng HsuJong-Jan Lee
    • H01L21/336H01L21/84
    • H01L29/66772Y10S438/926
    • A method of fabricating an ultrathin SOI memory transistor includes preparing a substrate, including forming an ultrathin SOI layer of the substrate; adjusting the threshold voltage of the SOI layer; depositing a layer of silicon oxide on the SOI layer; patterning and etching the silicon oxide layer to form a sacrificial oxide gate in a gate region; depositing a layer of silicon nitride and forming the silicon nitride into a silicon nitride sidewall for the sacrificial oxide gate; depositing and smoothing a layer of amorphous silicon; selectively etching the sacrificial gate oxide; growing a layer of oxide in the gate region; depositing and smoothing a second layer of amorphous silicon; patterning and etching the second layer of amorphous silicon; implanting ion to form a source region and a drain region; annealing the structure; and depositing a layer of passivation oxide.
    • 制造超薄SOI存储晶体管的方法包括:制备衬底,包括形成衬底的超薄SOI层; 调整SOI层的阈值电压; 在SOI层上沉积一层氧化硅; 图案化和蚀刻氧化硅层以在栅极区域中形成牺牲氧化物栅极; 沉积氮化硅层并将氮化硅形成用于牺牲氧化物栅极的氮化硅侧壁; 沉积和平滑一层非晶硅; 选择性地蚀刻牺牲栅极氧化物; 在栅极区生长一层氧化物; 沉积和平滑第二层非晶硅; 图案化和蚀刻第二层非晶硅; 注入离子以形成源区和漏区; 退火结构; 并沉积一层钝化氧化物。
    • 98. 发明申请
    • Semiconductive metal oxide thin film ferroelectric memory transistor
    • 半导体金属氧化物薄膜铁电存储晶体管
    • US20060038242A1
    • 2006-02-23
    • US10922712
    • 2004-08-20
    • Sheng HsuTingkai LiJong-Jan Lee
    • Sheng HsuTingkai LiJong-Jan Lee
    • H01L29/94H01L29/76
    • H01L29/7869H01L29/516H01L29/66545H01L29/66553H01L29/78621
    • The present invention discloses a novel transistor structure employing semiconductive metal oxide as the transistor conductive channel. By replacing the silicon conductive channel with a semiconductive metal oxide channel, the transistors can achieve simpler fabrication process and could realize 3D structure to increase circuit density. The disclosed semiconductive metal oxide transistor can have great potential in ferroelectric non volatile memory device with the further advantages of good interfacial properties with the ferroelectric materials, possible lattice matching with the ferroelectric layer, reducing or eliminating the oxygen diffusion problem to improve the reliability of the ferroelectric memory transistor. The semiconductive metal oxide film is preferably a metal oxide exhibiting semiconducting properties at the transistor operating conditions, for example, In2O3 or RuO2. The present invention ferroelectric transistor can be a metal-ferroelectric-semiconductive metal oxide FET having a gate stack of a top metal electrode disposed on a ferroelectric layer disposed on a semiconductive metal oxide channel on a substrate. Using additional layer of bottom electrode and gate dielectric, the present invention ferroelectric transistor can also be a metal-ferroelectric-metal (optional)-gate dielectric (optional)-semiconductive metal oxide FET.
    • 本发明公开了一种采用半导体金属氧化物作为晶体管导电通道的新型晶体管结构。 通过用半导体金属氧化物沟道代替硅导电通道,晶体管可以实现更简单的制造工艺,并且可以实现3D结构以增加电路密度。 所公开的半导体金属氧化物晶体管可以在铁电非易失性存储器件中具有很大的潜力,具有与铁电材料良好的界面性质,与铁电层的可能的晶格匹配,减少或消除氧扩散问题以提高可靠性的另外的优点 铁电存储晶体管。 半导体金属氧化物膜优选是在晶体管工作条件下表现出半导体性质的金属氧化物,例如在二氧化铈或RuO 2 。 本发明的铁电晶体管可以是金属铁电半导体金属氧化物FET,其具有设置在设置在基板上的半导体金属氧化物沟道上的铁电层上的顶部金属电极的栅极堆叠。 使用附加的底部电极和栅极电介质层,本发明的铁电晶体管也可以是金属 - 铁电 - 金属(可选) - 门电介质(可选) - 导电金属氧化物FET。