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91. 发明申请

US20110279047A1 AC LIGHT EMITTING DEVICE, DRIVING DEVICE THEREOF, AND DRIVING METHOD THEREBY 有权
标题翻译：交流发光装置，其驱动装置及其驱动方法
公开(公告)号：US20110279047A1
公开(公告)日：2011-11-17
申请号：US13130020
申请日：2009-11-06
申请人： Byung Hoon Choi , In Kyu Park , Do Hyung Kim
发明人： Byung Hoon Choi , In Kyu Park , Do Hyung Kim
IPC分类号： H05B37/02
CPC分类号： H05B33/0821 , H05B33/0809 , Y02B20/342
摘要： An AC light emitting device, a driving device thereof and a driving method are disclosed. The driving device includes a sub-driving part turned on corresponding to each of positive and negative voltage regions of an AC voltage source to provide current paths for operating at least two LEDs, and a free-charge part charging with a voltage to be supplied to one of the at least two LEDs which is not operated while the other LED is operated by the sub-driving part. The AC light emitting device, the driving device thereof and the driving method thereby can solve problems, such as a decrease in power factor, severe total harmonic distortion, excessive flickering, and the like, due to operating characteristics of the AC light emitting device by application of an AC voltage source thereto.
摘要翻译：公开了一种AC发光器件，其驱动装置和驱动方法。驱动装置包括对应于AC电压源的正电压区域和负电压区域中的每一个导通的辅助驱动部件，以提供用于操作至少两个LED的电流路径，以及向要供应到的电压充电的自由充电部分所述至少两个LED中的一个在另一个LED由副驱动部分操作时不被操作。由于AC发光器件的驱动装置和驱动方法可以解决由于AC发光器件的操作特性而导致的功率因数降低，严重的总谐波失真，过度闪烁等的问题向其施加AC电压源。

92. 发明授权

US08058662B2 Light emitting diode and method of fabricating the same 有权
标题翻译：发光二极管及其制造方法
公开(公告)号：US08058662B2
公开(公告)日：2011-11-15
申请号：US11994813
申请日：2005-11-09
申请人： Do Hyung Kim , Chung-Hoon Lee
发明人： Do Hyung Kim , Chung-Hoon Lee
IPC分类号： H01L33/00 , H01L21/50
CPC分类号： H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00011 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2924/01005
摘要： The present invention relates to a light emitting diode and a method of fabricating the same, wherein the distance between a fluorescent substance and a light emitting diode chip is uniformly maintained to enhance luminous efficiency. To this end, there is provided a light emitting diode comprising at least one light emitting diode chip, lead terminals for use in applying electric power to the light emitting diode chip, and a frame that is used for mounting the light emitting diode chip thereon and is formed to have a predetermined height and a shape corresponding to that of the light emitting diode chip.
摘要翻译：发光二极管及其制造方法技术领域本发明涉及一种发光二极管及其制造方法，其中均匀地维持荧光物质与发光二极管芯片之间的距离，以提高发光效率。为此，提供了一种发光二极管，其包括至少一个发光二极管芯片，用于向发光二极管芯片施加电力的引线端子，以及用于将发光二极管芯片安装在其上的框架，形成为具有与发光二极管芯片相对应的预定高度和形状。

93. 发明授权

US08026589B1 Reduced profile stackable semiconductor package 有权
标题翻译：减少型材可堆叠的半导体封装
公开(公告)号：US08026589B1
公开(公告)日：2011-09-27
申请号：US12390999
申请日：2009-02-23
申请人： Bong Chan Kim , Do Hyung Kim , Chan Ha Hwang , Min Woo Lee , Eun Sook Sohn , Won Joon Kang
发明人： Bong Chan Kim , Do Hyung Kim , Chan Ha Hwang , Min Woo Lee , Eun Sook Sohn , Won Joon Kang
IPC分类号： H01L23/48
CPC分类号： H01L24/48 , H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/49517 , H01L24/16 , H01L24/29 , H01L24/49 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/0401 , H01L2224/056 , H01L2224/13099 , H01L2224/16 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/48471 , H01L2224/49 , H01L2224/73265 , H01L2224/83101 , H01L2224/85001 , H01L2224/8592 , H01L2224/92247 , H01L2225/1023 , H01L2225/1029 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/078 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/0665 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： In accordance with the present invention, there is provided multiple embodiments of a reduced profile stackable semiconductor package. The semiconductor package comprises a substrate having at least one semiconductor die attached thereto. The semiconductor die is also electrically connected to the substrate by a plurality of conductive wires. A package body defining opposed top and bottom surfaces and a side surface at least partially encapsulates the substrate, the conductive wires and the semiconductor die. The package body is formed such that at least portions of the conductive wires are exposed in the top surface thereof. The package body may include a groove formed in the top surface thereof, with at least portions of the conductive wires being exposed in the groove. In this instance, conductive material layers may be disposed within the groove and electrically connected to the exposed portions of respective ones of the conductive wires, with solder pads further bring electrically connected to respective ones of the conductive material layers and at least partially residing within the groove.
摘要翻译：根据本发明，提供了缩减轮廓可堆叠半导体封装的多个实施例。半导体封装包括具有至少一个连接到其上的半导体管芯的衬底。半导体管芯也通过多个导电线电连接到衬底。限定相对的顶表面和底表面的封装主体和至少部分地封装基板，导线和半导体管芯的侧表面。封装体形成为使得导线的至少一部分在其顶表面中露出。封装体可以包括形成在其顶表面中的凹槽，其中至少一部分导电线暴露在凹槽中。在这种情况下，导电材料层可以设置在凹槽内并且电连接到相应的导电线的暴露部分，焊料垫进一步电连接到相应的导电材料层，并且至少部分地位于槽。

94. 发明申请

US20110222693A1 Apparatus, method and computer-readable medium producing vertical direction virtual channel 有权
标题翻译：产生垂直方向虚拟通道的装置，方法和计算机可读介质
公开(公告)号：US20110222693A1
公开(公告)日：2011-09-15
申请号：US12926198
申请日：2010-11-01
申请人： Kang Eun Lee , Do Hyung Kim
发明人： Kang Eun Lee , Do Hyung Kim
IPC分类号： H04R5/00 , H03G3/00
CPC分类号： H03G9/005
摘要： Provided is an apparatus, method and computer-readable medium generating a vertical direction virtual channel that may apply a vertical direction spectrum shape to a source signal, and generate a vertical direction virtual speaker signal by adjusting a gain with respect to a signal in which the vertical direction spectrum shape is applied, based on virtual speaker direction information.
摘要翻译：提供了一种生成垂直方向虚拟通道的装置，方法和计算机可读介质，其可以将垂直方向谱形状应用于源信号，并且通过相对于其中的信号调整增益来生成垂直方向虚拟扬声器信号基于虚拟扬声器方向信息应用垂直方向谱形状。

95. 发明授权

US07960744B2 Multi-light emitting diode package 有权
标题翻译：多发光二极管封装
公开(公告)号：US07960744B2
公开(公告)日：2011-06-14
申请号：US12164456
申请日：2008-06-30
申请人： Jung Hoo Seo , Do Hyung Kim , Byoung Ki Pyo , You Jin Kwon , Ju Yong Shim
发明人： Jung Hoo Seo , Do Hyung Kim , Byoung Ki Pyo , You Jin Kwon , Ju Yong Shim
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/504 , H01L33/58 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.
摘要翻译：多LED封装包括散热器，其包括彼此分离的初级芯片和次级芯片，安装在初级芯片上的主要LED芯片，安装在次级芯片上的一个或多个次级LED芯片，电连接的引线框架结构到主要和次要LED芯片以及覆盖主要LED芯片的至少一部分的荧光体。另一个多LED封装包括具有上表面和从其突出的隔板的散热器，安装在隔板内的主LED芯片，安装在隔板外部的一个或多个次级LED芯片，电连接到主和次级LED的引线框架结构芯片和覆盖主LED芯片的至少一部分的荧光体。

96. 发明授权

US07906855B1 Stacked semiconductor package and method of making same 有权
标题翻译：堆叠式半导体封装及其制作方法
公开(公告)号：US07906855B1
公开(公告)日：2011-03-15
申请号：US12758583
申请日：2010-04-12
申请人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
发明人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
IPC分类号： H01L23/48
CPC分类号： H01L24/27 , H01L23/3128 , H01L23/3135 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0652 , H01L25/0657 , H01L2224/29101 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/838 , H01L2224/85447 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an underlying substrate through the use of conductive wires, some of which may be fully or partially encapsulated by an adhesive or insulating layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate are first and second semiconductor dies. The first semiconductor die and a portion of the substrate are covered by an adhesive layer. The second semiconductor die, the adhesive layer and a portion of the substrate are in turn covered by a package body of the semiconductor package.
摘要翻译：根据本发明，提供了包括两个或更多个半导体管芯的半导体封装的多个实施例，所述半导体管芯通过使用导电线电连接到下面的衬底，其中一些可以被粘合剂完全或部分封装，绝缘层包装。在本发明的基本实施例中，半导体封装包括其上布置有导电图案的衬底。电连接到衬底的导电图案是第一和第二半导体管芯。第一半导体管芯和衬底的一部分被粘合剂层覆盖。第二半导体管芯，粘合剂层和衬底的一部分又由半导体封装的封装主体覆盖。

97. 发明申请

US20100303922A1 METHOD FOR THE PREPARATION OF BIOCOMPATIBLE POLYMERIC NANOPARTICLES FOR DRUG DELIVERY AND NANOPARTICLES PREPARED THEREBY 审中-公开
标题翻译：用于制备药物递送的生物成分聚合物纳米颗粒的方法及其制备的纳米颗粒
公开(公告)号：US20100303922A1
公开(公告)日：2010-12-02
申请号：US12597451
申请日：2008-04-22
申请人： Soon Hong Yuk , Keun Sang Oh , Won Tae Jung , Youn Woong Choi , Sang Min Cho , Dae Chul Ha , Do Hyung Kim , Seong Woo Ahn , Jeong Hyun Choi
发明人： Soon Hong Yuk , Keun Sang Oh , Won Tae Jung , Youn Woong Choi , Sang Min Cho , Dae Chul Ha , Do Hyung Kim , Seong Woo Ahn , Jeong Hyun Choi
IPC分类号： A61K9/14 , A61K31/337 , A61P35/00
CPC分类号： C08L71/02 , A61K9/1273 , A61K9/5146 , A61K9/5192 , A61K31/337 , B82Y30/00 , C08G2650/58 , C08J5/005 , C08L2203/02
摘要： Disclosed are biocompatible polymeric nanoparticles for drug delivery and a method for preparing the same. They can be prepared by mixing a tri-block copolymer, PEG, and a drug at a predetermined temperature to give a homogeneous polymeric mixture; solidifying the homogeneous polymeric mixture at room temperature; and dissolving the solidified polymeric mixture in an aqueous solution. Based on a polymer melting process, the method makes it easy to produce poloxamer nanoparticles at low cost. The nanoparticles show desired particle sizes suitable for use in drug delivery and a uniform particle size distribution. Consisting of a bilayer structure, the nanoparticles can contain sparingly soluble drugs. Also, the nanoparticles contain no organic solvents and are thus safe to the body because they are free of organic solvent residuals. Further, after being administered into the body, the nanoparticles with a high content of sparingly soluble drug entrapped therein can safely deliver the drug to target sites and stably release the drug at a controlled rate.
摘要翻译：公开了用于药物递送的生物相容性聚合物纳米颗粒及其制备方法。它们可以通过在预定温度下混合三嵌段共聚物PEG和药物来制备均匀的聚合物混合物; 在室温下固化均匀的聚合物混合物; 并将固化的聚合物混合物溶解在水溶液中。基于聚合物熔融工艺，该方法可以以低成本制备泊洛沙姆纳米粒子。纳米颗粒显示适合用于药物递送和均匀粒度分布的所需粒度。由双层结构构成，纳米粒子可以含有微溶药物。此外，纳米颗粒不含有机溶剂，因此对身体是安全的，因为它们不含有机溶剂残留物。此外，在被施用于体内之后，具有高含量的微溶药物的纳米颗粒被包埋在其中可以将药物安全地递送到靶位点并以受控的速率稳定地释放药物。

98. 发明授权

US07801080B2 Root mobile router and the operating method thereof in dynamically composed moving network 失效
标题翻译：根移动路由器及其在动态组合移动网络中的操作方法
公开(公告)号：US07801080B2
公开(公告)日：2010-09-21
申请号：US11834838
申请日：2007-08-07
申请人： Won Tae Kim , Heung Nam Kim , Sun Ja Kim , Do Hyung Kim , Jae Pyeong Kim , Hwan Gu Lee
发明人： Won Tae Kim , Heung Nam Kim , Sun Ja Kim , Do Hyung Kim , Jae Pyeong Kim , Hwan Gu Lee
IPC分类号： H04W4/00
CPC分类号： H04W40/24 , H04W84/005
摘要： Provided is a root mobile router and the operating method thereof in a dynamically composed moving network, capable of forming a self-configuring ad-hoc network between wireless personal area networks (WPANs) of each user in a moving network and supporting a stable connection between the network and the Internet. The method includes the steps of: receiving state information of multiple access networks and selecting an optimal access network in order to connect to the Internet; receiving a result of the selection and activating an interface of the selected access network; changing the selected access network to the activated access network interface; and updating routing path information automatically and stably transmitting an IP packet to the Internet through the selected access network interface. Therefore, a personal mobile terminal can be utilized as a mobile router.
摘要翻译：提供了一种根据移动路由器及其在动态组合的移动网络中的操作方法，其能够在移动网络中的每个用户的无线个域网（WPAN）之间形成自配置的自组织网络，并且支持在网络和互联网。该方法包括以下步骤：接收多个接入网络的状态信息并选择最佳接入网络以便连接到因特网; 接收所选择的接入网络的接口的选择和激活结果; 将所选择的接入网络改变为激活的接入网络接口; 以及通过所选择的接入网络接口，将路由路径信息自动且稳定地发送到因特网。因此，个人移动终端可以用作移动路由器。

99. 发明申请

US20100195300A1 Electronics device module 有权
标题翻译：电子设备模块
公开(公告)号：US20100195300A1
公开(公告)日：2010-08-05
申请号：US12656451
申请日：2010-01-29
申请人： Do Hyung Kim , Jung-Mo Yang , Hyun Jung Yoo , Dong-Yoon Seo , In-Young Park
发明人： Do Hyung Kim , Jung-Mo Yang , Hyun Jung Yoo , Dong-Yoon Seo , In-Young Park
IPC分类号： H05K7/00
CPC分类号： H05K1/181 , H05K2201/09227 , H05K2201/09254 , H05K2201/10159 , Y02P70/611
摘要： Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.
摘要翻译：公开了一种电子设备模块，包括具有第一和第二电子设备对部分的模块基板。第一电子器件对部分可以包括第一和第二接触焊盘区域和第一和第二接触焊盘区域之间的第一通孔区域。第一电子设备对部分还可以包括第一层和第二层。第一层可以包括将模块衬底的一侧上的第一接触焊盘区域中的多个接触焊盘连接到多个通孔的多条第一线。第二层可以包括将第二接触焊盘区域中的多个接触焊盘连接到通孔区域中的多个通孔的多条第二线路。第二层还可以包括连接第一和第二电子设备对部分的多条第三线。

100. 发明申请

US20100072506A1 ULTRAVIOLET LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：超紫外线发光二极管封装
公开(公告)号：US20100072506A1
公开(公告)日：2010-03-25
申请号：US12443380
申请日：2007-09-18
申请人： Jeong Suk Bae , Jae Jo Kim , Do Hyung Kim , Dae Sung Kal
发明人： Jeong Suk Bae , Jae Jo Kim , Do Hyung Kim , Dae Sung Kal
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/56 , H01L33/642 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An ultraviolet light emitting diode package for emitting ultraviolet light is disclosed. The ultraviolet light emitting diode package comprises an LED chip emitting light with a peak wavelength of 350 nm or less, and a protective member provided so that surroundings of the LED chip is covered to protect the LED chip, the protective member having a non-yellowing property to energy from the LED chip.
摘要翻译：公开了一种用于发射紫外光的紫外线发光二极管封装。紫外线发光二极管封装包括发射峰值波长为350nm以下的光的LED芯片，以及设置为使得LED芯片的周围被覆盖以保护LED芯片的保护构件，保护构件具有不变黄性能来自LED芯片的能量。

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