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91. 发明授权

US5661345A Semiconductor device having a single-crystal metal wiring 失效
标题翻译：具有单晶金属布线的半导体器件
公开(公告)号：US5661345A
公开(公告)日：1997-08-26
申请号：US353214
申请日：1994-12-01
申请人： Junichi Wada , Hisashi Kaneko , Kyoichi Suguro , Nobuo Hayasaka , Haruo Okano
发明人： Junichi Wada , Hisashi Kaneko , Kyoichi Suguro , Nobuo Hayasaka , Haruo Okano
IPC分类号： H01L21/3205 , H01L21/285 , H01L21/768 , H01L23/52 , H01L23/522 , H01L23/528 , H01L23/532 , H01L23/48
CPC分类号： H01L23/53223 , H01L21/28512 , H01L21/76882 , H01L23/5222 , H01L23/528 , H01L23/53214 , H01L23/53233 , H01L23/53238 , H01L2924/0002
摘要： The method of producing a semiconductor device includes the steps of forming a groove having a predetermined pattern shape on the surface of a substrate; forming a metal film on the substrate while reaction with the surface of the substrate is suppressed; and agglomerating the metal film by in-situ annealing, wherein agglomeration of the metal film is started before the metal film reacts with the surface of the substrate due to annealing, while formation of a native oxide on the metal film is suppressed, and whereby the metal film is filled into the groove by annealing at a predetermined temperature for a predetermined period of time. The structure of the semiconductor device includes an insulator in which there is formed a groove portion having a predetermined pattern shape and an electrode interconnection made of a single-crystal metal which is filled in the groove portion.
摘要翻译：制造半导体器件的方法包括以下步骤：在衬底的表面上形成具有预定图案形状的沟槽; 在与基板的表面反应的同时，在基板上形成金属膜; 并且通过原位退火使金属膜凝聚，其中金属膜在金属膜由于退火而与基板的表面反应之前开始凝聚，同时在金属膜上形成天然氧化物被抑制，通过在预定温度下退火预定时间将金属膜填充到槽中。半导体器件的结构包括绝缘体，其中形成有预定图案形状的沟槽部分和由填充在沟槽部分中的单晶金属制成的电极互连。

92. 发明授权

US5629236A Method of manufacture of semiconductor device 失效
标题翻译：半导体器件的制造方法
公开(公告)号：US5629236A
公开(公告)日：1997-05-13
申请号：US506483
申请日：1995-07-25
申请人： Jun-ichi Wada , Hisashi Kaneko , Nobuo Hayasaka
发明人： Jun-ichi Wada , Hisashi Kaneko , Nobuo Hayasaka
IPC分类号： H01L21/28 , H01L21/3205 , H01L21/768 , H01L23/52 , H01L23/522 , H01L23/532 , H01L21/205
CPC分类号： H01L21/76838 , H01L21/76877 , H01L23/53223 , H01L2924/0002
摘要： The method of manufacturing a semiconductor device, according to the present invention, includes the steps of forming a polycrystal lower-level Al wiring layer on a silicon substrate, forming an interlayer insulation film for covering the lower-level Al wiring layer on the entire surface, forming a connection hole which reaches the lower-level Al wiring layer in the interlayer insulation film, forming a polycrystal upper-level Al wiring layer on a surface of the interlayer insulation film, forming an interlayer insulation film for covering the upper-level Al wiring layer on the entire surface, and forming a single-crystal lower-level Al wiring layer and upper-layer Al wiring layer which are connected to each other in the connection hole by heating the silicon substrate so that the lower-level Al wiring layer and the upper-level Al wiring layer are converted from a polycrystal phase to an amorphous phase, and then cooling the silicon substrate so that the upper-level Al wiring layer is set in a supercooling state.
摘要翻译：根据本发明的制造半导体器件的方法包括在硅衬底上形成多晶低级Al布线层的步骤，形成用于覆盖整个表面上的下层Al布线层的层间绝缘膜在层间绝缘膜中形成到达下层Al布线层的连接孔，在层间绝缘膜的表面上形成多晶上层Al布线层，形成覆盖上层Al的层间绝缘膜布线层，并且通过加热硅基板形成在连接孔中彼此连接的单晶下层Al布线层和上层Al布线层，使得下层Al布线层并且将上层的Al布线层从多晶相转变为非晶相，然后冷却硅基板，使得上层的Al布线层为处于过冷状态。

93. 发明授权

US5409862A Method for making aluminum single crystal interconnections on insulators 失效
标题翻译：在绝缘子上制作铝单晶互连的方法
公开(公告)号：US5409862A
公开(公告)日：1995-04-25
申请号：US035208
申请日：1993-03-22
申请人： Junichi Wada , Hisashi Kaneko , Kyoichi Suguro , Nobuo Hayasaka , Haruo Okano
发明人： Junichi Wada , Hisashi Kaneko , Kyoichi Suguro , Nobuo Hayasaka , Haruo Okano
IPC分类号： H01L21/3205 , H01L21/285 , H01L21/768 , H01L23/52 , H01L23/522 , H01L23/528 , H01L23/532 , H01L21/44
CPC分类号： H01L23/53223 , H01L21/28512 , H01L21/76882 , H01L23/5222 , H01L23/528 , H01L23/53214 , H01L23/53233 , H01L23/53238 , H01L2924/0002
摘要： The method of producing a semiconductor device includes the steps of forming a groove having a predetermined pattern shape on the surface of a substrate; forming a metal film on the substrate while reaction with the surface of the substrate is suppressed; and agglomerating the metal film by in-situ annealing, wherein agglomeration of the metal film is started before the metal film reacts with the surface of the substrate due to annealing, while formation of a native oxide on the metal film is suppressed, and whereby the metal film is filled into the groove by annealing at a predetermined temperature for a predetermined period of time. The structure of the semiconductor device includes an insulator in which there is formed a groove portion having a predetermined pattern shape and an electrode interconnection made of a single-crystal metal which is filled in the groove portion.
摘要翻译：制造半导体器件的方法包括以下步骤：在衬底的表面上形成具有预定图案形状的沟槽; 在与基板的表面反应的同时，在基板上形成金属膜; 并且通过原位退火使金属膜凝聚，其中金属膜在金属膜由于退火而与基板的表面反应之前开始凝聚，同时在金属膜上形成天然氧化物被抑制，通过在预定温度下退火预定时间将金属膜填充到槽中。半导体器件的结构包括绝缘体，其中形成有预定图案形状的沟槽部分和由填充在沟槽部分中的单晶金属制成的电极互连。

94. 发明授权

US07921401B2 Stress analysis method, wiring structure design method, program, and semiconductor device production method 有权
标题翻译：应力分析方法，接线结构设计方法，程序和半导体器件的制造方法
公开(公告)号：US07921401B2
公开(公告)日：2011-04-05
申请号：US11703218
申请日：2007-02-07
申请人： Sachiyo Ito , Masahiko Hasunuma , Hisashi Kaneko
发明人： Sachiyo Ito , Masahiko Hasunuma , Hisashi Kaneko
IPC分类号： G06F17/50 , G06F11/22
CPC分类号： G06F17/5018 , G06F17/5068 , G06F2217/80 , H01L2924/0002 , H01L2924/00
摘要： A stress analysis method is provided: including dividing, by using a division unit, an inside of a chip into a plurality of analysis areas, deriving, by using a composite property derivation unit, a composite property into which physical property values of a plurality of materials included in an analysis area are compounded, about each of the plurality of analysis areas on the basis of wiring structure data for each of the plurality of analysis areas, and creating, by using a stress analysis unit, a three-dimensional model of a finite element method which uses each analysis area as an element, to apply the composite property to each element, and to perform a stress analysis.
摘要翻译：提供一种应力分析方法，包括：通过使用分割单元将芯片的内部划分为多个分析区域，通过使用复合特性导出单元导出多个分析区域的物理属性值的复合特性基于多个分析区域中的每一个的布线结构数据，分析包括在分析区域中的材料，并且基于多个分析区域中的每一个，分别对每个分析区域进行复合，并且通过使用应力分析单元来创建三维模型使用每个分析区域作为元素的有限元法，将复合属性应用于每个元素，并进行应力分析。

95. 发明授权

US07495866B2 Recording disk drive capable of suppressing vibration of flexible printed circuit board 有权
标题翻译：能够抑制柔性印刷电路板振动的记录磁盘驱动器
公开(公告)号：US07495866B2
公开(公告)日：2009-02-24
申请号：US10893301
申请日：2004-07-19
申请人： Mitsuhiro Izumi , Mitsuaki Yoshida , Hisashi Kaneko , Tsuneyori Ino , Yukihiro Komura , Shinji Fujimoto , Kei Funabashi
发明人： Mitsuhiro Izumi , Mitsuaki Yoshida , Hisashi Kaneko , Tsuneyori Ino , Yukihiro Komura , Shinji Fujimoto , Kei Funabashi
IPC分类号： G11B5/55 , G11B21/08
CPC分类号： G11B33/121 , G11B5/4846 , G11B33/08 , G11B33/122 , H05K1/0269 , H05K1/0393 , H05K3/0058 , H05K3/281 , H05K3/363 , H05K2201/0133 , H05K2201/058 , H05K2201/09063 , H05K2201/0989 , H05K2201/099 , H05K2201/09918 , H05K2201/10386 , H05K2201/10409 , H05K2201/10598 , H05K2201/2045 , H05K2203/0191 , H05K2203/166 , H05K2203/167
摘要： A fixing member is spaced from a head actuator by a predetermined distance. A flexible printed circuit board extends at least from the head actuator to the fixing member. The flexible printed circuit board is superposed on the surface of the fixing member. A viscoelastic layer and a protecting layer are overlaid on the surface of the flexible printed circuit board. A clip clips all the fixing member, the flexible printed circuit board, the viscoelastic layer and the protecting layer together. When a head slider is positioned, the head actuator changes its attitude relative to a recording disk. The inertial force based on the rotation causes the first flexible printed circuit board to vibrate when the actuator block stops rotating. The viscoelastic layer serves to absorb this residual vibration of the first flexible printed circuit board. Vibration of the flexible printed circuit board can be suppressed.
摘要翻译：固定构件与头致动器间隔预定距离。柔性印刷电路板至少从头致动器延伸到固定构件。柔性印刷电路板叠置在固定部件的表面上。粘弹性层和保护层覆盖在柔性印刷电路板的表面上。 A夹将所有固定构件，柔性印刷电路板，粘弹性层和保护层夹在一起。当头部滑块定位时，头部致动器相对于记录盘改变其姿态。当致动器块停止转动时，基于旋转的惯性力使第一柔性印刷电路板振动。粘弹性层用于吸收第一柔性印刷电路板的残余振动。可以抑制柔性印刷电路板的振动。

96. 发明授权

US07453046B2 Recording disk drive capable of suppressing vibration of flexible printed circuit board 失效
标题翻译：能够抑制柔性印刷电路板振动的记录磁盘驱动器
公开(公告)号：US07453046B2
公开(公告)日：2008-11-18
申请号：US11698034
申请日：2007-01-26
申请人： Mitsuhiro Izumi , Mitsuaki Yoshida , Hisashi Kaneko , Tsuneyori Ino , Yukihiro Komura , Shinji Fujimoto , Kei Funabashi
发明人： Mitsuhiro Izumi , Mitsuaki Yoshida , Hisashi Kaneko , Tsuneyori Ino , Yukihiro Komura , Shinji Fujimoto , Kei Funabashi
IPC分类号： H05K1/00
CPC分类号： G11B33/121 , G11B5/4846 , G11B33/08 , G11B33/122 , H05K1/0269 , H05K1/0393 , H05K3/0058 , H05K3/281 , H05K3/363 , H05K2201/0133 , H05K2201/058 , H05K2201/09063 , H05K2201/0989 , H05K2201/099 , H05K2201/09918 , H05K2201/10386 , H05K2201/10409 , H05K2201/10598 , H05K2201/2045 , H05K2203/0191 , H05K2203/166 , H05K2203/167
摘要： A fixing member is spaced from a head actuator by a predetermined distance. A flexible printed circuit board extends at least from the head actuator to the fixing member. The flexible printed circuit board is superposed on the surface of the fixing member. A viscoelastic layer and a protecting layer are overlaid on the surface of the flexible printed circuit board. A clip clips all the fixing member, the flexible printed circuit board, the viscoelastic layer and the protecting layer together. When a head slider is positioned, the head actuator changes its attitude relative to a recording disk. The inertial force based on the rotation causes the first flexible printed circuit board to vibrate when the actuator block stops rotating. The viscoelastic layer serves to absorb this residual vibration of the first flexible printed circuit board. Vibration of the flexible printed circuit board can be suppressed.
摘要翻译：固定构件与头致动器间隔预定距离。柔性印刷电路板至少从头致动器延伸到固定构件。柔性印刷电路板叠置在固定部件的表面上。粘弹性层和保护层覆盖在柔性印刷电路板的表面上。 A夹将所有固定构件，柔性印刷电路板，粘弹性层和保护层夹在一起。当头部滑块定位时，头部致动器相对于记录盘改变其姿态。当致动器块停止转动时，基于旋转的惯性力使第一柔性印刷电路板振动。粘弹性层用于吸收第一柔性印刷电路板的残余振动。可以抑制柔性印刷电路板的振动。

97. 发明申请

US20080037176A1 Disk apparatus 审中-公开
标题翻译：磁盘设备
公开(公告)号：US20080037176A1
公开(公告)日：2008-02-14
申请号：US11650678
申请日：2007-01-05
申请人： Yoshiharu Matsuda , Hisashi Kaneko , Masaya Suwa , Toru Watanabe , Takuma Kido , Yasuo Suzuki
发明人： Yoshiharu Matsuda , Hisashi Kaneko , Masaya Suwa , Toru Watanabe , Takuma Kido , Yasuo Suzuki
IPC分类号： G11B5/54
CPC分类号： G11B5/54 , G11B21/22
摘要： A disk apparatus includes a ramp which holds a tip end of an arm at a position away from a disk, and a slit shroud having an airflow control plate. A side surface of the airflow control plate is opposed to a side surface of the disk, the airflow control plate spreads to a position where the airflow control plate is superposed on the tip end of the arm held by the ramp. The airflow control plate has the same thickness as that of the disk, and is flush with the disk 12.
摘要翻译：盘装置包括将臂的前端保持在远离盘的位置的斜坡和具有气流控制板的狭缝罩。气流控制板的侧表面与盘的侧表面相对，气流控制板扩展到气流控制板重叠在由斜坡保持的臂的末端上的位置。气流控制板具有与盘相同的厚度，并且与盘12齐平。

98. 发明申请

US20070153426A1 Recording disk drive capable of suppressing vibration of flexible printed circuit board 失效
标题翻译：能够抑制柔性印刷电路板振动的记录磁盘驱动器
公开(公告)号：US20070153426A1
公开(公告)日：2007-07-05
申请号：US11698034
申请日：2007-01-26
申请人： Mitsuhiro Izumi , Mitsuaki Yoshida , Hisashi Kaneko , Tsuneyori Ino , Yukihiro Komura , Shinji Fujimoto , Kei Funabashi
发明人： Mitsuhiro Izumi , Mitsuaki Yoshida , Hisashi Kaneko , Tsuneyori Ino , Yukihiro Komura , Shinji Fujimoto , Kei Funabashi
IPC分类号： G11B5/55
CPC分类号： G11B33/121 , G11B5/4846 , G11B33/08 , G11B33/122 , H05K1/0269 , H05K1/0393 , H05K3/0058 , H05K3/281 , H05K3/363 , H05K2201/0133 , H05K2201/058 , H05K2201/09063 , H05K2201/0989 , H05K2201/099 , H05K2201/09918 , H05K2201/10386 , H05K2201/10409 , H05K2201/10598 , H05K2201/2045 , H05K2203/0191 , H05K2203/166 , H05K2203/167
摘要： A fixing member is spaced from a head actuator by a predetermined distance. A flexible printed circuit board extends at least from the head actuator to the fixing member. The flexible printed circuit board is superposed on the surface of the fixing member. A viscoelastic layer and a protecting layer are over laid on the surface of the flexible printed circuit board. A clip clips all the fixing member, the flexible printed circuit board, the viscoelastic layer and the protecting layer together. When a head slider is positioned, the head actuator changes its attitude relative to a recording disk. The inertial force based on the rotation causes the first flexible printed circuit board to vibrate when the actuator block stops rotating. The viscoelastic layer serves to absorb this residual vibration of the first flexible printed circuit board. Vibration of the flexible printed circuit board can be suppressed.
摘要翻译：固定构件与头致动器间隔预定距离。柔性印刷电路板至少从头致动器延伸到固定构件。柔性印刷电路板叠置在固定部件的表面上。在柔性印刷电路板的表面上覆盖粘弹性层和保护层。 A夹将所有固定构件，柔性印刷电路板，粘弹性层和保护层夹在一起。当头部滑块定位时，头部致动器相对于记录盘改变其姿态。当致动器块停止转动时，基于旋转的惯性力使第一柔性印刷电路板振动。粘弹性层用于吸收第一柔性印刷电路板的残余振动。可以抑制柔性印刷电路板的振动。

99. 发明授权

US07214305B2 Method of manufacturing electronic device 失效
标题翻译：制造电子装置的方法
公开(公告)号：US07214305B2
公开(公告)日：2007-05-08
申请号：US10636614
申请日：2003-08-08
申请人： Tetsuo Matsuda , Hisashi Kaneko
发明人： Tetsuo Matsuda , Hisashi Kaneko
IPC分类号： C25D5/02 , C23C28/00
CPC分类号： H01L21/76879 , C25D5/02 , C25D5/022 , C25D5/34 , C25D7/123 , H01L21/2885 , H01L21/76873 , H05K3/107 , H05K3/423 , H05K2203/0392
摘要： Disclosed is a method of manufacturing an electronic device, comprising forming a concave portion on the surface of a base member, forming an electrically conductive seed layer on that surface of the base member on which a plated film is to be formed, and applying an electrolytic plating treatment with the seed layer used as a common electrode under the condition that a substance for accelerating the electrolytic plating is allowed to be present in the concave portion of the base member in an amount larger than that on the surface of the base member to form a plated film.
摘要翻译：公开了一种电子设备的制造方法，其特征在于，在基材的表面形成凹部，在要形成镀膜的基材的表面上形成导电种子层，使用作为公共电极的种子层进行电镀处理，条件是允许电解电镀用的物质以比基材的表面上的量大的量存在于基材的凹部中以形成镀膜。

100. 发明授权

US07202168B2 Method of producing semiconductor device 失效
标题翻译：半导体器件的制造方法
公开(公告)号：US07202168B2
公开(公告)日：2007-04-10
申请号：US11136494
申请日：2005-05-25
申请人： Hiroshi Ikenoue , Hisashi Kaneko , Masaaki Hatano , Soichi Yamashita , Takashi Yoda , Makoto Sekine
发明人： Hiroshi Ikenoue , Hisashi Kaneko , Masaaki Hatano , Soichi Yamashita , Takashi Yoda , Makoto Sekine
IPC分类号： H01L21/44
CPC分类号： H01L21/76862 , H01L21/76807 , H01L21/76831 , H01L21/76846 , H01L21/76873
摘要： A method of producing a semiconductor device according to an aspect of the present invention comprises forming a seed film of Cu on a substrate; polycrystallizing the seed film formed on the substrate; and forming a plated film of Cu on the polycrystallized seed film by electrolytic plating.
摘要翻译：根据本发明的一个方面的制造半导体器件的方法包括在衬底上形成Cu的种子膜; 使形成在基板上的种子膜多晶化; 并通过电解电镀在多晶种子膜上形成Cu的镀膜。

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