专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明专利

JPH0338738B2 失效
公开(公告)号：JPH0338738B2
公开(公告)日：1991-06-11
申请号：JP14113982
申请日：1982-08-16
申请人： HITACHI LTD
发明人： OOTSUKA KENICHI , KITAMURA WAHEI , MIKINO HIROSHI , SATO HAJIME
IPC分类号： H01L21/603 , H01L21/60

92. 发明专利

JPH0373562A ELECTRONIC PARTS AND LEAD FRAME THEREFOR 失效
公开(公告)号：JPH0373562A
公开(公告)日：1991-03-28
申请号：JP21028489
申请日：1989-08-14
申请人： HITACHI LTD
发明人： SATO HAJIME , KITAMURA WAHEI
IPC分类号： H05K3/34 , H01L23/50 , H05K1/18
摘要： PURPOSE:To improve the yield of package, even for a lead having fine pitch, by providing a clad layer for making uniform the amount of solder at the tip of the lead in a gull wing type semiconductor device. CONSTITUTION:A semiconductor device 1 comprises an insulating resin package 2 and a plurality of leads 3 of metallic body projecting in parallel from four sides of the package 2. The lead 3 is provided with a solder clad layer 8 in the mounting region on the rear surface at the outer mounting end 4. The semiconductor device 1 is mounted on a wiring substrate 15 such that the mounting end 4 of each lead 3 is lapped over a footprint 17 arranged on the surface of the wiring substrate 15. Each mounting end 4 section is then subjected to partial heating through irradiation of infrared beam and the like. Consequently, the clad layer 8 is melted and spread over the footprint 17 on the wiring substrate 15. Solder 19 is set upon stoppage of heating and the mounting end 4 is secured to the footprint 17. By such arrangement, appropriate amount of solder can be provided and leakage of solder or formation of solderbridge can be prevented.

93. 发明专利

JPH01134958A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01134958A
公开(公告)日：1989-05-26
申请号：JP29201087
申请日：1987-11-20
申请人： HITACHI LTD
发明人： SATO HAJIME , NISHI KUNIHIKO , KITAMURA WAHEI
IPC分类号： H01L23/50 , H01L21/60
摘要： PURPOSE:To render a semiconductor device thinner by a method wherein a lead and a suspension lead are built of a metal foil, a prescribed spot on the lead is covered by a non-conductive film, the leads are formed thinner, and the need of bonding wires is eliminated. CONSTITUTION:A semiconductor device of this design is constituted of a semiconductor pellet 1 sealed in a package, a lead 5a with one end connected to the pellet 1 and the other end extending out from the package, and a suspension lead 5b installed on the upper surface of the pellet 1. The lead 5a and the suspension lead 5b are constituted of a metal foil. A specified spot on the lead 5a is covered by a non-conductive film 7. In such a design, the lead 5a and the suspension lead 5b may be thinner and bonding wires are not needed, both contributing to a further reduction in thickness of the semiconductor device.

94. 发明专利

JPS6458670A MOISTUREPROOF PACKAGING BAG OF ELECTRONIC PART 失效
公开(公告)号：JPS6458670A
公开(公告)日：1989-03-06
申请号：JP20629087
申请日：1987-08-21
申请人： HITACHI LTD
发明人： KITAMURA WAHEI , MURAKAMI HAJIME , NISHI KUNIHIKO
IPC分类号： B65D25/54 , B65D33/04 , B65D81/26 , B65D85/38 , B65D85/86 , G09F3/02
摘要： PURPOSE:To easily confirm the hygroscopic state of the interior of a transparent moistureproof packaging bag from outside, by providing a humidity indicator detecting the internal humidity of the transparent moistureproof packaging bag for packaging an electronic part in a moistureproof state at a position visible from outside. CONSTITUTION:A receiving container 3 having plurality of electronic parts 2 such as surface mounting semiconductor devices received therein is received in an inner box 4 which is, in turn, inserted in a bag like moistureproof member 1 and both end parts 1A, 1B of said member 1 are sealed to perform moistureproof packaging. In performing the moistureproof packaging, a humidity indicator 5 detecting the humidity in a moistureproof packaging bag 100 is provided on the inner side surface of the transparent bag like moistureproof member 1 at a position visible from the outside. For example, a humidity detecting label 5 is bonded to the inside of the transparent bag like moistureproof member 1 by an adhesive member 6 having vent holes 6A so as to be capable of being confirmed from outside. For example, as the humidity detecting label, a material prepared by impregnating paper made of pulp with a substance discoloring by humidity such as cobalt chloride is used.

95. 发明专利

JPS62272551A CARRIER TAPE FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62272551A
公开(公告)日：1987-11-26
申请号：JP11458086
申请日：1986-05-21
申请人： HITACHI LTD
发明人： KITAMURA WAHEI , MASUDA MASACHIKA
IPC分类号： H01L21/673 , B65D85/38 , B65D85/86 , H01L21/67 , H01L21/68
摘要： PURPOSE:To effectively a product, such as a transportation and a storage of a semiconductor device by forming a window for observing a mark attached to the device in the bottom of a cavity for containing the device. CONSTITUTION:A window 16 for observing a mark attached to a semiconductor device 12 is provided in the bottom 13A of the cavity 13 of a carrier tape 11 for the device having the cavity 13 for containing the device 12. For example, a carrier tape body 11 is formed of a material, such as a polyvinyl chloride or a hard polystyrene having 0.2mm or larger of thickness to be kneaded with conductive powder, such as carbon in the material to prevent it from being electrostatically charged. A plurality of cavities 13 are formed on one rom at an equal interval for charging the devices 12 on the body 11, a circular window 15 for observing is formed in the bottom 13A of the cavity 13 to observe the marks, such as the name and code number of the device 12.

96. 发明专利

JPS62220472A MAGAZINE FOR HOUSING ELECTRONIC PART 失效
公开(公告)号：JPS62220472A
公开(公告)日：1987-09-28
申请号：JP6051386
申请日：1986-03-20
申请人： HITACHI LTD
发明人： KITAMURA WAHEI
IPC分类号： B65D85/86 , B65D85/30 , B65D85/38 , H05K13/02

97. 发明专利

JPS62580B2 失效
公开(公告)号：JPS62580B2
公开(公告)日：1987-01-08
申请号：JP5449878
申请日：1978-05-10
申请人： HITACHI LTD
发明人： TSUNENO HIROSHI , OKIKAWA SUSUMU , HORIUCHI KATSUTADA , KITAMURA WAHEI , YAMAMOTO EIJI
IPC分类号： H01L23/02 , H01L21/8247 , H01L27/14 , H01L29/788 , H01L29/792 , H01L31/0203 , H04N5/335 , H04N5/372

98. 发明专利

JPS60245237A CAPILLARY STRUCTURE OF WIRE BONDER 失效
公开(公告)号：JPS60245237A
公开(公告)日：1985-12-05
申请号：JP10047184
申请日：1984-05-21
申请人： HITACHI LTD
发明人： OKIKAWA SUSUMU , KITAMURA WAHEI , SUZUKI HIROMICHI , MIKINO HIROSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To execute the bonding work even in a very small area without contact with adjacent wire and external wall of package by forming narrow only the end part through provision of the stepped portion at the end part of capillary. CONSTITUTION:A capillary 1 is composed of a cylindrical part 2, a tapered part 3 which is formed narrower at the end part in the side of end part of such cylindrical part 2 and a small diameter part 5 which is formed in further smaller size by providing a stepped portion 4 in the course of such tapered part 3. The axial length of this small diameter part 5 is formed longer at least than the height of external wall 8 of the package. With such structure, even in the semiconductor device where the bonding post is located near to the wall surface of external wall 8, the bonding work can be executed without contact of the end part of capillary or the surface 9 in the tapered side surface 9 with the upper surface or side surface of external wall 8 of package 7.

99. 发明专利

JPS60223149A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS60223149A
公开(公告)日：1985-11-07
申请号：JP7911384
申请日：1984-04-19
申请人： HITACHI LTD
发明人： OKIKAWA SUSUMU , MIKINO HIROSHI , SUZUKI HIROMICHI , KITAMURA WAHEI
IPC分类号： H01L21/60 , H01L21/607 , H01L23/49
摘要： PURPOSE:To prevent breakage of the passivation film and the like of a pellet as well as to obtain a semiconductor device having an excellent corrosion-resisting property at low cost by a method wherein a copper wire having specific ball hardness of bonding wire is used. CONSTITUTION:A pellet 3 consisting of silicon (Si) is attached to the tab 2 of a lead frame 1 using silver (Ag) paste 4, and the bonding pad of said pellet 3 and an inner lead part 5 are electrically connected using a wire 6. This wire 6 is refined to the high purity of 99.999wt% or above by performing a zone refining method and a reelectrolyzing method, and the wire 6 consists of a copper wire having the micro-Vickers hardness of the ball part controlled at MHv=35-60 (in 5g/f). When the micro-Vickers hardness of the ball part of the wire 6 exceeds 65, the passivation film of the bonding part of the pellet 3 is broken when a bonding work is performed, and also when the micro-Vickers hardness at the ball part is smaller than 35, bonding strength is small, and troubles such as unsatisfactory bonding strength and the like occur.

100. 发明专利

JPS60177667A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS60177667A
公开(公告)日：1985-09-11
申请号：JP3243584
申请日：1984-02-24
申请人： HITACHI LTD , HITACHI METALS LTD
发明人： OKIKAWA SUSUMU , KITAMURA WAHEI , SUZUKI HIROMICHI , MIKINO HIROSHI , SAKAMOTO DAIJI
IPC分类号： H01L21/60 , C22C21/00 , H01L23/49
摘要： PURPOSE:To improve mechanical strength and corrosion resistance and to inapprox.= crease reliability of a resin-sealed device, by including Fe and Pd, or Ni, Mg, Mn and Si and Pd of respective predetermined amounts in a wire mainly composed of Al. CONSTITUTION:Adding Fe, Pd or Ni into a wire mainly composed of Al increses corrosion resistance and moreover, adding Mg, Mn and Si increases mechanical strength. In this case, Pd of 0.05-3% for Fe of 0.05-3%, each being represented in wt%, is added to increase corrosion resistance of an alloy wire 4, or Ni, Pd and Fe of each 0.05-3% and Mg, Mn and Si of each 0.5-3% are added to increase mechanical strength as well as corrosion resistance to provide a high-reliable resin-sealed device.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式