会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 96. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPH0945827A
    • 1997-02-14
    • JP19725895
    • 1995-08-02
    • HITACHI LTD
    • YOSHIDA SATOSHIFUJITA YUJIKANEKO KENJI
    • H05K7/20H01L23/36H01L23/373
    • PROBLEM TO BE SOLVED: To reduce the temperature difference between the temperatures of electronic components and to make uniform the output signal levels of devices by a method wherein at least one of heat conductors, which are respectively mounted to a plurality of the electronic components and transfer heat, which is generated in the components, to cooling components, has a heat conductivity different from those of the other heat conductors. SOLUTION: A plurality of electronic components 13, 14 and 15 are mounted on the upper surface of a wiring board 11, which consists of a ceramic board made of an alumina or a mullite, through solder balls as connection means. Here, the components 13 are CPUs and the components 14 and 15 are memory elements. Here, heat conductors 31, 32 and 33 are respectively connected with the upper parts of the components 13, 14 and 15 and the heat conductors 31, 32 and 33 are respectively connected thermally with the recess parts in the centers of cooling components 6. Moreover here, materials having heat conductivities different from each other are respectively used for conductors 31, 32 and 33. In concrete terms, Cu, Si and Mo are respectively used for the conductor 31, the conductor 32 and the conductor 33.