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    • 96. 发明授权
    • Integrated circuit having multiple memory types and method of formation
    • 具有多种存储器类型和形成方法的集成电路
    • US06831310B1
    • 2004-12-14
    • US10705504
    • 2003-11-10
    • Leo MathewRamachandran Muralidhar
    • Leo MathewRamachandran Muralidhar
    • H01L2980
    • H01L27/108B82Y10/00H01L27/115H01L27/11521H01L27/11568H01L29/42332H01L29/785H01L29/7881
    • A transistor (10) is formed having three separately controllable gates (44, 42, 18). The three gate regions may be electrically biased differently and the gate regions may have different conductivity properties. The dielectrics on the channel sidewall may be different than the dielectrics on the top of the channel. Electrical contacts to source, drain and the three gates is selectively made. By including charge storage layers, such as nanoclusters, adjacent the transistor channel and controlling the charge storage layers via the three gate regions, both volatile and non-volatile memory cells are realized using the same process to create a universal memory process. When implemented as a volatile cell, the height of the transistor and the characteristics of channel sidewall dielectrics control the memory retention characteristics. When implemented as a nonvolatile cell, the width of the transistor and the characteristics of the overlying channel dielectrics control the memory retention characteristics.
    • 晶体管(10)形成有三个可分别控制的栅极(44,42,18)。 三个栅极区域可以被不同地电偏置,并且栅极区域可以具有不同的导电性质。 通道侧壁上的电介质可以不同于通道顶部的电介质。 选择性地制造到源极,漏极和三个栅极的电接触。 通过包括与晶体管沟道相邻的电荷存储层,例如纳米团簇,并通过三个栅极区域控制电荷存储层,使用相同的过程实现易失性和非易失性存储单元,从而创建通用存储器处理。 当实现为易失性单元时,晶体管的高度和通道侧壁电介质的特性控制存储器保持特性。 当被实现为非易失性单元时,晶体管的宽度和上覆通道电介质的特性控制存储器保持特性。
    • 98. 发明授权
    • Memory device and method for using prefabricated isolated storage elements
    • 使用预制隔离存储元件的存储器件和方法
    • US06413819B1
    • 2002-07-02
    • US09595821
    • 2000-06-16
    • Sufi ZafarRamachandran MuralidharBich-Yen NguyenSucharita MadhukarDaniel T. PhamMichael A. SaddChitra K. Subramanian
    • Sufi ZafarRamachandran MuralidharBich-Yen NguyenSucharita MadhukarDaniel T. PhamMichael A. SaddChitra K. Subramanian
    • H01L21336
    • B82Y10/00H01L21/28273H01L29/7883H01L29/7888
    • A semiconductor device that includes a floating gate made up of a plurality of pre-formed isolated storage elements (18) and a method for making such a device is presented. The device is formed by first providing a semiconductor layer (12) upon which a first gate insulator (14) is formed. A plurality of pre-fabricated isolated storage elements (18) is then deposited on the first gate insulator (14). This deposition step may be accomplished by immersion in a colloidal solution (16) that includes a solvent and pre-fabricated isolated storage elements (18). Once deposited, the solvent of the solution (16) can be removed, leaving the pre-fabricated isolated storage elements (18) deposited on the first gate insulator (14). After depositing the pre-fabricated isolated storage elements (18), a second gate insulator (20) is formed over the pre-fabricated isolated storage elements (18). A gate electrode (24) is then formed over the second gate insulator (20), and portions the first and second gate insulators and the plurality of pre-fabricated isolated storage elements that do not underlie the gate electrode are selectively removed. A source region (32) and a drain region (34) are then formed in the semiconductor layer (12) such that a channel region is formed between underlying the gate electrode (24).
    • 提供了一种半导体器件,其包括由多个预先形成的隔离存储元件(18)构成的浮动栅极和用于制造这种器件的方法。 该器件通过首先提供形成第一栅极绝缘体(14)的半导体层(12)形成。 然后,多个预制隔离存储元件(18)沉积在第一栅极绝缘体(14)上。 该沉积步骤可以通过浸入包括溶剂和预制隔离存储元件(18)的胶体溶液(16)中来实现。 一旦沉积,可以除去溶液(16)的溶剂,留下沉积在第一栅极绝缘体(14)上的预制隔离存储元件(18)。 在沉积预制隔离存储元件(18)之后,在预制隔离存储元件(18)上形成第二栅极绝缘体(20)。 然后,在第二栅极绝缘体(20)之上形成栅电极(24),并且选择性地去除不在栅电极下面的第一和第二栅极绝缘体和多个预制隔离存储元件的部分。 然后在半导体层(12)中形成源极区(32)和漏极区(34),使得在栅电极(24)下方形成沟道区。