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91. 发明授权

US08107465B1 Slim bandwidth reservation protocol over an IP network 有权
标题翻译：通过IP网络实现超薄带宽预留协议
公开(公告)号：US08107465B1
公开(公告)日：2012-01-31
申请号：US12475186
申请日：2009-05-29
申请人： Eric Peterson , Flavio Fernandes
发明人： Eric Peterson , Flavio Fernandes
IPC分类号： H04L12/66
CPC分类号： H04L65/104 , H04L65/103 , H04L65/1069
摘要： A media gateway is coupled to an Internet Protocol (IP) network through a router. The router and the media gateway communicate through a slim protocol that allows the media gateway to reserve connections over the IP network that have certain minimum bandwidth and latency attributes. The router handles the obtaining of the requested IP circuit for the client. The media gateways only need to execute a relatively simple client application and do not have to be independently capable of obtaining IP-QoS information from the IP network.
摘要翻译：媒体网关通过路由器耦合到互联网协议（IP）网络。路由器和媒体网关通过薄型协议进行通信，允许媒体网关通过IP网络预留具有特定最小带宽和延迟属性的连接。路由器处理为客户端获取所请求的IP电路。媒体网关只需要执行相对简单的客户端应用程序，而不必独立地从IP网络获取IP-QoS信息。

92. 发明申请

US20110007470A1 CELL BOARD INTERCONNECTION ARCHITECTURE 有权
标题翻译：电路板互连架构
公开(公告)号：US20110007470A1
公开(公告)日：2011-01-13
申请号：US12886362
申请日：2010-09-20
申请人： Christian L. Belady , Eric Peterson
发明人： Christian L. Belady , Eric Peterson
IPC分类号： G06F1/16
CPC分类号： H05K7/20718 , H05K1/14 , H05K7/1445 , H05K7/1492 , H05K2201/044 , H05K2201/064
摘要： According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.
摘要翻译：根据至少一个实施例，单元板互连架构包括用于互连多个单元板的互连结构，所述互连结构被配置为允许空气沿单元板与其耦合的方向通过。

93. 发明授权

US07858756B2 Monoclonal antibodies that selectively recognize methamphetamine and methamphetamine like compounds 有权
标题翻译：选择性识别甲基苯丙胺和甲基苯丙胺类化合物的单克隆抗体
公开(公告)号：US07858756B2
公开(公告)日：2010-12-28
申请号：US11763948
申请日：2007-06-15
申请人： S. Michael Owens , Melinda Gunnell , Yingni Chi , F. Ivy Carroll , Ralph Henry , Eric Peterson
发明人： S. Michael Owens , Melinda Gunnell , Yingni Chi , F. Ivy Carroll , Ralph Henry , Eric Peterson
IPC分类号： C07K16/00 , A61K39/395 , G01N33/53
CPC分类号： C07K16/44 , C07K2317/56 , C07K2317/92
摘要： The invention generally relates to monoclonal antibodies that recognize at least one compound from the group consisting of (+) methamphetamine, (+) amphetamine, and (+) 3,4-methylenedioxymethamphetamine ((+) MDMA). Generally speaking, the monoclonal antibodies do not recognize (−) methamphetamine, (−) amphetamine, or (−) MDMA.
摘要翻译：本发明一般涉及识别至少一种由（+）甲基苯丙胺，（+）安非他明和（+）3,4-亚甲二氧基甲基安非他明（（+）MDMA）组成的组的单克隆抗体。一般而言，单克隆抗体不识别（ - ）甲基苯丙胺，（ - ）安非他明或（ - ）MDMA。

94. 发明申请

US20080179960A1 Systems and Methods for Separation of a Front End Rectifier Power System 有权
标题翻译：前端整流器电力系统分离系统与方法
公开(公告)号：US20080179960A1
公开(公告)日：2008-07-31
申请号：US11627618
申请日：2007-01-26
申请人： Steve Belson , Eric Peterson , Robert Guenther
发明人： Steve Belson , Eric Peterson , Robert Guenther
IPC分类号： H02J5/00 , H02J1/10
CPC分类号： H02J1/10 , H02J1/08 , H02M2001/007 , Y10T307/707
摘要： Systems and methods of converting alternating current (AC) power into direct current (DC) power at an intermediate DC voltage are disclosed. Briefly described, one system embodiment comprises a separated front end rectifier system that provides intermediate voltage, direct current (DC) power to a plurality of loads, comprising a modular alternating current to direct current (AC/DC) rectifier coupled to an AC power system that converts received AC power to DC power at a rectified DC voltage, a rectified DC voltage bus coupled to the AC/DC rectifier and at least one modular direct current to direct current (DC/DC) conversion unit coupled to the rectified DC voltage bus and to an intermediate DC voltage bus.
摘要翻译：公开了在中间DC电压下将交流（AC）功率转换为直流（DC）功率的系统和方法。简要描述，一个系统实施例包括分离的前端整流器系统，其向多个负载提供中压，直流（DC）功率，其包括模块化交流电流，其耦合到AC电力系统其将接收到的交流电力转换为直流电压为直流电压，整流的直流电压总线耦合到AC / DC整流器，以及至少一个模块化直流电流转换为与整流的直流电压总线耦合的直流（DC / DC）转换单元和中间直流电压总线。

95. 发明申请

US20080101025A1 Multi-chip Module with Power System 有权
标题翻译：带电源系统的多芯片模块
公开(公告)号：US20080101025A1
公开(公告)日：2008-05-01
申请号：US11968520
申请日：2008-01-02
申请人： Shaun Harris , Steven Belson , Eric Peterson , Gary Williams , Christian Belady
发明人： Shaun Harris , Steven Belson , Eric Peterson , Gary Williams , Christian Belady
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译：实施例包括具有电力系统的多芯片模块的装置，方法和系统。示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。电力系统耦合到并垂直放置在PCB上方。散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。

96. 发明申请

US20070288813A1 Cell board interconnection architecture with serviceable switch board 审中-公开
标题翻译：电池板互连架构与可维修的开关板
公开(公告)号：US20070288813A1
公开(公告)日：2007-12-13
申请号：US11414852
申请日：2006-05-01
申请人： Christian Belady , Eric Peterson
发明人： Christian Belady , Eric Peterson
IPC分类号： G01R31/28
CPC分类号： G06F1/20
摘要： In certain embodiments, there is provided a computer system and a method for providing a computer system. Specifically, there is provided a computer system that may include a porous main board that is configured to couple to a plurality of switch boards. The porous main board may be configured to conduct air flowing from the front to the back of the computer system and to permit the switch boards to be serviced from the front or back of the computer system. Moreover, in certain embodiments, the switch boards may be hot-swappable.
摘要翻译：在某些实施例中，提供了一种用于提供计算机系统的计算机系统和方法。具体地，提供了一种计算机系统，其可以包括被配置为耦合到多个开关板的多孔主板。多孔主板可以被配置为传导从计算机系统的前部到后部流动的空气，并允许从计算机系统的前部或后部对开关板进行维修。此外，在某些实施例中，开关板可以是热插拔的。

97. 发明授权

US07197806B2 Fastener for variable mounting 失效
标题翻译：用于可变安装的紧固件
公开(公告)号：US07197806B2
公开(公告)日：2007-04-03
申请号：US11041550
申请日：2005-01-24
申请人： Brent Boudreaux , Eric Peterson , Brandon Rubenstein
发明人： Brent Boudreaux , Eric Peterson , Brandon Rubenstein
IPC分类号： B23P11/00 , F16D1/00
CPC分类号： F16B5/0225 , F16B5/02 , F16B13/0891 , F16B43/00 , Y10T29/4984 , Y10T29/49947 , Y10T29/49963 , Y10T403/7064 , Y10T403/7067 , Y10T403/7069 , Y10T403/75 , Y10T403/76
摘要： A fastener assembly comprising a first wedge portion having an angled end, a second wedge portion having an angled end, and a fastener extending through the first wedge portion and the second wedge portion, wherein a portion of the fastener protrudes from one of the first and second wedge portions for interfacing with a component to be mounted, wherein the angled end of the first wedge portion and the angled end of the second wedge portion are interfaced when the fastener is extended through the first wedge portion and the second wedge portion.
摘要翻译：一种紧固件组件，包括具有成角度的端部的第一楔形部分，具有成角度的端部的第二楔形部分和延伸穿过第一楔形部分和第二楔形部分的紧固件，其中紧固件的一部分从第一和第用于与要安装的部件对接的第二楔形部分，其中当紧固件延伸穿过第一楔形部分和第二楔形部分时，第一楔形部分的倾斜端部和第二楔形部分的倾斜端部接合。

98. 发明申请

US20070019390A1 Flexible cell configuration for multi-processor systems 失效
标题翻译：多处理器系统的灵活单元配置
公开(公告)号：US20070019390A1
公开(公告)日：2007-01-25
申请号：US11187302
申请日：2005-07-22
申请人： Eric Peterson
发明人： Eric Peterson
IPC分类号： H05K7/00
CPC分类号： G06F1/18 , G06F1/184 , G06F1/185 , G06F1/186
摘要： A cell configuration for a multi-processor system comprises: a first circuit board comprising: a single processor; a single processor agent coupled electrically to the single processor; and a plurality of memory modules coupled electrically to the single processor agent; a second circuit board comprising: a single processor; a single processor agent coupled electrically to the single processor; and a plurality of memory modules coupled electrically to the single processor agent; and wherein the first and second circuit boards are inter-connected in such a manner to form an electrical connection between the single processor of the first circuit board and the single processor agent of the second circuit board and an electrical connection between the single processor of the second circuit board and the single processor agent of the first circuit board.
摘要翻译：一种用于多处理器系统的单元配置包括：第一电路板，包括：单个处理器; 与单个处理器电耦合的单个处理器; 以及多个存储器模块，其电耦合到所述单个处理器代理; 第二电路板，包括：单个处理器; 与单个处理器电耦合的单个处理器; 以及多个存储器模块，其电耦合到所述单个处理器代理; 并且其中所述第一和第二电路板以这样的方式相互连接，以在所述第一电路板的单个处理器和所述第二电路板的所述单个处理器代理之间形成电连接，以及所述第一电路板的所述单个处理器之间的电连接第二电路板和第一电路板的单处理器。

99. 发明申请

US20060133041A1 Processor module for system board 有权
标题翻译：系统板处理器模块
公开(公告)号：US20060133041A1
公开(公告)日：2006-06-22
申请号：US11021504
申请日：2004-12-21
申请人： Christian Belady , Gary Williams , Shaun Harris , Steven Belson , Eric Peterson
发明人： Christian Belady , Gary Williams , Shaun Harris , Steven Belson , Eric Peterson
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
摘要翻译：实施例包括用于系统板的处理器模块的装置，方法和系统。在一个实施例中，具有第一和第二部分的电子模块可拆卸地连接到系统板。第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。散热装置通过热交换从处理器散热。第二部分设置在第一部分和系统板之间产生的空间中。第二部分具有用于向处理器提供电力的电力系统板。电源系统板相邻并平行于PCB的第二侧延伸。

100. 发明申请

US20060133040A1 Multi-chip module with power system and pass-thru holes 有权
标题翻译：带电源系统和通孔的多芯片模块
公开(公告)号：US20060133040A1
公开(公告)日：2006-06-22
申请号：US11021500
申请日：2004-12-21
申请人： Christian Belady , Gary Williams , Shaun Harris , Steven Belson , Eric Peterson , Stuart Haden
发明人： Christian Belady , Gary Williams , Shaun Harris , Steven Belson , Eric Peterson , Stuart Haden
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K1/0204 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.
摘要翻译：实施例包括具有电源系统和通孔的多芯片模块的装置，方法和系统。示例性电子模块包括具有带存储器的第一印刷电路板（PCB）和多个处理器的第一部分。第二部分具有动力系统和散热装置。散热装置具有多个延伸部，电力系统具有多个通过孔。当多个延伸部延伸穿过电力系统的多个通孔并且通过布置在第一和第二部分之间的第二PCB的多个通过孔时，第一部分电耦合到第二部分以形成电子模块。

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