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    • 93. 发明授权
    • Integrated electro-optical package and method of fabrication
    • 集成电光封装及其制造方法
    • US6022760A
    • 2000-02-08
    • US118879
    • 1998-07-20
    • Michael S. LebbyWenbin JiangKaren E. Jachimowicz
    • Michael S. LebbyWenbin JiangKaren E. Jachimowicz
    • H01S5/022H01S5/42H01L21/44H01L21/48H01L21/50
    • H01S5/423H01S5/02248
    • An integrated electro-optical package including a dual sided opto-electronic device, composed of a substrate with an array of light emitting devices (LEDs) formed on a first major surface thereof, and at least one vertical cavity surface emitting laser formed on an opposed second major surface of the substrate. A mounting structure formed so as to allow for the mounting of the dual sided opto-electronic device on the interior major surfaces, and further having electrical conductors for cooperating with the LEDs and VCSEL of the opto-electronic device. A driver substrate having electrical connections for interfacing with the mounting structure and the dual sided opto-electronic device. A plurality of driver circuits connected to the mounting structure and dual sided opto-electronic device through connection pads formed on the driver substrate.
    • 一种包括双面光电装置的集成电光学封装,由在其第一主表面上形成的发光器件阵列(LED)的衬底和形成在相对的第一主表面上的至少一个垂直腔表面发射激光器 第二主要表面的基材。 安装结构形成为允许将双面光电装置安装在内部主表面上,并且还具有用于与光电装置的LED和VCSEL配合的电导体。 具有用于与安装结构和双面光电装置对接的电连接的驱动器基板。 通过形成在驱动器基板上的连接焊盘连接到安装结构和双面光电器件的多个驱动电路。
    • 94. 发明授权
    • Vertical cavity surface emitting laser for high power single mode
operation and method of fabrication
    • 垂直腔表面发射激光器,用于高功率单模操作和制造方法
    • US6021147A
    • 2000-02-01
    • US963623
    • 1997-11-04
    • Wenbin JiangRong-Ting HuangMichael S. Lebby
    • Wenbin JiangRong-Ting HuangMichael S. Lebby
    • H01S5/183H01S5/20H01S3/085
    • H01S5/183H01S2301/166H01S2301/176H01S5/0425H01S5/205
    • A VCSEL for high power single mode operation and method of fabrication including a substrate element, a first stack of distributed Bragg reflectors disposed on a surface of the substrate element, an active region lattice matched to a surface of the first stack of distributed Bragg reflectors, and a second stack of distributed Bragg reflectors lattice matched to a surface of the active region. The VCSEL structure includes an isolation layer formed on the second stack of distributed Bragg reflectors. The isolation layer is formed of a dielectric material or insulating semiconductor material having an index of refraction greater than the first and second stacks of distributed Bragg reflectors and thereby defining an anti-guiding VCSEL structure. An electrical contact is coupled to a surface of the second stack of distributed Bragg reflectors and an electrical contact is positioned a surface of the substrate element.
    • 一种用于大功率单模操作的VCSEL及其制造方法,包括:衬底元件,布置在衬底元件表面上的分布式布拉格反射器的第一叠层;与分布布拉格反射器的第一叠层表面匹配的有源区域晶格, 以及与激活区域的表面晶格匹配的分布式布拉格反射器的第二堆叠。 VCSEL结构包括形成在分布式布拉格反射器的第二堆叠上的隔离层。 隔离层由介电材料或绝缘半导体材料形成,其折射率大于分布式布拉格反射器的第一和第二堆叠,从而限定反向引导VCSEL结构。 电触点耦合到分布布拉格反射器的第二堆叠的表面,并且电触点定位在衬底元件的表面上。