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    • 91. 发明申请
    • Methods of Forming Semiconductor Devices Having Recessed Channels
    • 形成具有嵌入通道的半导体器件的方法
    • US20100285644A1
    • 2010-11-11
    • US12770942
    • 2010-04-30
    • Joo-Young LeeDong-Gun Park
    • Joo-Young LeeDong-Gun Park
    • H01L21/336H01L21/8242
    • H01L27/10823H01L27/10814H01L27/10852H01L27/10876
    • A semiconductor device includes a substrate, a gate insulation layer, a gate structure, a gate spacer, and first and second impurity regions. The substrate has an active region defined by an isolation layer. The active region has a gate trench thereon. The gate insulation layer is formed on an inner wall of the gate trench. The gate structure is formed on the gate insulation layer to fill the gate trench. The gate structure has a width smaller than that of the gate trench, and has a recess at a first portion thereof. The gate spacer is formed on sidewalls of the gate structure. The first and second impurity regions are formed at upper portions of the active region adjacent to the gate structure. The first impurity region is closer to the recess than the second impurity region. Related methods are also provided.
    • 半导体器件包括衬底,栅极绝缘层,栅极结构,栅极间隔物以及第一和第二杂质区域。 衬底具有由隔离层限定的有源区。 有源区在其上具有栅极沟槽。 栅极绝缘层形成在栅极沟槽的内壁上。 栅极结构形成在栅极绝缘层上以填充栅极沟槽。 栅极结构的宽度小于栅极沟槽的宽度,并且在其第一部分处具有凹部。 栅极间隔件形成在栅极结构的侧壁上。 第一和第二杂质区域形成在与栅极结构相邻的有源区的上部。 第一杂质区比第二杂质区更靠近凹部。 还提供了相关方法。
    • 98. 发明授权
    • Fin field effect transistor device and method of fabricating the same
    • Fin场效应晶体管器件及其制造方法
    • US07323375B2
    • 2008-01-29
    • US11091457
    • 2005-03-28
    • Jae-Man YoonDong-Gun ParkChoong-Ho LeeChul Lee
    • Jae-Man YoonDong-Gun ParkChoong-Ho LeeChul Lee
    • H01L21/00
    • H01L29/7851H01L21/84H01L29/66795
    • Methods of forming field effect transistors (FETs) having fin-shaped active regions include patterning a semiconductor substrate to define a fin-shaped semiconductor active region therein, which is surrounded by a trench. At least an upper portion of the fin-shaped semiconductor active region is covered with a sacrificial layer. This sacrificial layer is selectively etched-back to define sacrificial spacers on sidewalls of the fin-shaped semiconductor active region. The electrically insulating region is formed on the sacrificial spacers. The sacrificial spacers are then removed by selectively etching the sacrificial spacers using the electrically insulating region as an etching mask. An insulated gate electrode is then formed on the sidewalls of the fin-shaped semiconductor active region.
    • 形成具有鳍状有源区的场效应晶体管(FET)的方法包括图案化半导体衬底以在其中限定由沟槽包围的鳍状半导体有源区。 鳍形半导体有源区域的至少上部被牺牲层覆盖。 该牺牲层被有选择地回蚀刻以在鳍状半导体有源区域的侧壁上限定牺牲隔离物。 电绝缘区域形成在牺牲间隔物上。 然后通过使用电绝缘区域作为蚀刻掩模选择性地蚀刻牺牲隔离物来去除牺牲间隔物。 然后在鳍状半导体有源区的侧壁上形成绝缘栅电极。