会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Device for measuring the shearing in the core of a sandwich structure
    • 用于测量夹层结构的芯中的剪切的装置
    • US06334362B1
    • 2002-01-01
    • US09171860
    • 1998-10-26
    • Anders Lönnö
    • Anders Lönnö
    • G01N324
    • G01B7/16G01B5/30G01B7/30G01N2203/0025
    • The invention relates to a device for measuring the shearing action in the core of a sandwich structure, for instance a hull. The device comprises a sensing means, e.g. a cylindrical rod, and a measuring instrument. The rod is adapted to be inserted into a cylindrical hole which is bored in the hull preferably perpendicular to the surface thereof so as to extend a distance into the core and which has a diameter corresponding to that of the rod. By means of the measuring instrument, an angle between the rod and a reference plane is measured, which is determined by three points on the surface of the hull or the change of this angle when the hull is subjected to a change in load. This angle can be converted into a measure of the current shearing load.
    • 本发明涉及一种用于测量夹层结构(例如船体)的芯中的剪切作用的装置。 该装置包括感测装置,例如。 圆柱形杆和测量仪器。 杆适于插入到圆柱形孔中,该圆柱孔在船体中钻孔,优选地垂直于其表面,以便将距离延伸到芯中,并且具有与杆的直径相对应的直径。 通过测量仪器,测量杆和参考平面之间的角度,该角度由船体表面上的三个点确定,或者当船体经受负载变化时,该角度的变化。 该角度可以转换为当前剪切载荷的量度。
    • 2. 发明授权
    • Method and apparatus for inspecting solder balls on ball grid array package
    • 用于检查球栅阵列封装上的焊球的方法和装置
    • US06564648B2
    • 2003-05-20
    • US09800359
    • 2001-03-05
    • Lan-Song LeeHsing-An Hsu
    • Lan-Song LeeHsing-An Hsu
    • G01N324
    • G01N19/04G01N3/24G01N2203/0296H01L21/67271H01L21/67288H01L2224/48227H01L2924/15311
    • A method and art apparatus are proposed for inspecting solder balls on a BGA (Ball Grid Array) package, which are capable of rejecting defectively-bonded solder balls while allowing properly-bonded ones to pass therethrough. The proposed method and apparatus are characterized by the use of a rotatable disk having a plurality of flaps arranged at equal angular intervals along the perimeter thereof, and which is capable of being rotated in steps if a force greater than a preset threshold torque is being applied tangentially to any one of the flaps. The threshold torque is set to be equal to or less than the shear-resistant strength of a properly-bonded solder ball but greater than the shear-resistant strength of a defectively-bonded one. During an inspection procedure, the BGA package is moved toward the rotatable disk to allow each solder ball to push against one of the flaps on the rotatable disk. If a solder ball is a properly-bonded one, it would be capable of pushing open the flap and therefore passing through the inspection procedure; otherwise, for a defectively-bonded solder ball, it would be rejected and broken apart from the BGA package by the flap. Therefore, as the entire BGA package has undergone the inspection procedure trough the rotatable disk, all properly-bonded solder balls would remain in position over the BGA package, while all defectively-bonded ones would be removed.
    • 提出了一种用于检查BGA(球栅阵列)封装上的焊球的方法和技术装置,其能够拒绝有缺陷粘合的焊球,同时允许适当粘合的焊球通过。 所提出的方法和装置的特征在于使用具有沿着其周边以相等的角度间隔布置的多个翼片的可旋转盘,并且如果正在施加大于预设的阈值扭矩的力,则能够以步进旋转 与任何一个襟翼切向。 阈值扭矩设定为等于或小于适当焊接的焊球的抗剪切强度,但大于缺陷接合的焊球的抗剪切强度。 在检查过程中,将BGA封装移向可旋转盘,以允许每个焊球推压在可旋转盘上的一个襟翼上。 如果焊球是合适的焊球,则能够打开挡板并因此通过检查程序; 否则,对于缺陷焊接的球,它将被挡板从BGA封装中排除和分离。 因此,由于整个BGA封装经过可旋转盘的检查程序,所有适当粘合的焊球将保持在BGA封装上的位置,而所有有缺陷接合的焊球都将被去除。
    • 3. 发明授权
    • Testing shear bond strength
    • 测试剪切粘合强度
    • US06324916B1
    • 2001-12-04
    • US09467665
    • 1999-12-15
    • Neil T. Jessop
    • Neil T. Jessop
    • G01N324
    • G01N3/24G01N19/04
    • The present invention provides an apparatus and a method to apply a load to an adherend, which is bonded to a substrate, to allow an accurate measurement of the bond between an adherend and substrate. The strength of the bond is tested by shearing the adherend from the substrate and measuring the force per unit area required to fail the bond. This is accomplished by positioning a crosshead at the base of the adherend and applying a load, which is parallel to the surface of the substrate against the base of the adherend. The strength of the bond is the force per unit area required to shear the adherend from the substrate. The accuracy of the measurement is enhanced by minimizing the surface area of the crosshead that is in contact with the substrate and by ensuring that the adherend is not fractured during testing. Fracturing and deformation of the adherend is limited by using a notch to test with rather than a straight chisel. The present invention is configured to load the adherend such that the strength of the bond may be measured accurately.
    • 本发明提供了一种对粘合到基底上的被粘物施加载荷以允许精确测量被粘物与基底之间的粘结的装置和方法。 通过从基材剪切被粘物并测量不合格所需的每单位面积的力来测试粘合强度。 这通过将十字头定位在被粘物的基部并且施加与基底相对于被粘物的基部平行的负载来实现。 键的强度是从衬底剪切被粘物所需的每单位面积的力。 通过使与基板接触的十字头的表面积最小化,并且通过确保被测体在测试期间不断裂,可以提高测量精度。 通过使用切口而不是直的凿子来限制被粘物的压裂和变形。 本发明被配置为加载被粘物,使得可以精确地测量粘合强度。
    • 6. 发明授权
    • Method of measuring shear friction factor through backward extrusion process
    • 通过反向挤压工艺测量剪切摩擦系数的方法
    • US06418795B2
    • 2002-07-16
    • US09783542
    • 2001-02-15
    • Yong Taek ImJae Seung CheonSoo Young KimGeun An LeeSeong Hoon Kang
    • Yong Taek ImJae Seung CheonSoo Young KimGeun An LeeSeong Hoon Kang
    • G01N324
    • G01N3/24
    • A method of measuring shear friction factor between a workpiece material and a forming tool through a backward extrusion process. The method includes steps of: positioning the workpiece material at a groove previously manufactured on the forming die by turning; pressurizing the workpiece material to form an extruded product by pressure of a downwardly moving punch; forming tip on the extruded end of the extruded product; measuring an external diameter of the extruded product and a diameter of the tip, and obtaining a perpendicular distance by subtracting the diameter of the tip from the external diameter and dividing the subtracting result by two; and acquiring shear friction factor by calculating predetermined coefficients and a normalized perpendicular distance non-dimensionalized by thickness value of the extruded product. The thickness is defined as an interval between the external diameter of the extruded product and an external diameter of the punch.
    • 通过反向挤压工艺测量工件材料与成形工具之间的剪切摩擦系数的方法。 该方法包括以下步骤:通过转动将工件材料定位在预先制造在成型模具上的凹槽处; 通过向下移动的冲头的压力对工件材料加压以形成挤出产品; 在挤出产品的挤出端上形成尖端; 测量挤出产品的外径和尖端的直径,并且通过从外径减去尖端的直径并将减法结果除以2获得垂直距离; 并通过计算预定系数和通过挤出产品的厚度值无量纲化的归一化垂直距离来获得剪切摩擦系数。 厚度定义为挤出产品的外径和冲头的外径之间的间隔。
    • 7. 发明授权
    • Method for improving the archiving of dynamic parameters
    • 改进动态参数归档的方法
    • US06341531B1
    • 2002-01-29
    • US09428493
    • 1999-10-28
    • Antonio BrunacciMarco Nahmias NanniAntonio Serra
    • Antonio BrunacciMarco Nahmias NanniAntonio Serra
    • G01N324
    • G06F17/17G01N33/445
    • A method for improving the archiving of a curve plotted from at least N (N≧5) measured experimental values of a dynamic parameter P of a viscoelastic material where this parameter is a function of the deformation q at a given temperature, characterized in that it comprises the following stages: a) the acquisition of N experimental measurements of the said dynamic parameter P of the said viscoelastic material where this parameter is a function of the deformation q at a predetermined temperature; b) the determination, by successive approximations, of the values P0, P1, q1, P2, q2, which, when inserted in the relation P ⁡ ( q ) = P 0 + P 1 ⁢ ⅇ - q q 1 + P 2 ⁢ ⅇ - q q 2 ( A )  generate the curve which best approximates the experimental curve passing through all the points which represent the N values determined experimentally during the preceding stage a); c) the archiving of the values P0, P1, q1, P2, q2 found in this way.
    • 一种用于改善从至少N(N> = 5)测量的粘弹性材料的动态参数P的实验值绘制曲线的归档的方法,其中该参数是在给定温度下的变形q的函数,其特征在于 它包括以下阶段:a)获取所述粘弹性材料的所述动态参数P的N个实验测量值,其中该参数是在预定温度下的变形q的函数; b)通过逐次逼近来确定 在该关系中插入的值P0,P1,q1,P2,q2产生最佳近似于通过在前一阶段a)中实验确定的表示N值的所有点的实验曲线的曲线; c) 归档以这种方式找到的值P0,P1,q1,P2,q2。
    • 8. 发明授权
    • Adhesion strength testing using a depth-sensing indentation technique
    • 使用深度感测压痕技术的粘附强度测试
    • US06339958B1
    • 2002-01-22
    • US09208843
    • 1998-12-10
    • Ting Y. TsuiYoung-Chang Joo
    • Ting Y. TsuiYoung-Chang Joo
    • G01N324
    • G01N19/04G01N3/42G01N2203/0091G01N2203/0234G01N2203/0278G01Q60/366
    • A nanoindentation apparatus is used to measure adhesion strength of a hard, thin film to a soft substrate. A variably increasing load is applied to the indenter tip. The indenter tip penetrates into the thin film at a first penetration rate and causes the thin film to sink into the substrate thus causing a tensile stress at the film substrate interface. At a critical value of the applied load, the stress at the interface exceeds the delamination value, and the thin film partially delaminates from the substrate. This causes the indenter tip to sink into the softer substrate at a sudden second, higher penetration rate. A sensor detects the applied load and the indenter tip penetration depth at this point. A computer flags the critical value of the applied load that corresponds to the increased penetration depth rate at the point of delamination of the film. The computer then calculates the critical stress required for delamination and the adhesion strength between the film and the substrate from the critical value of the applied load. The depth sensing indentation technique measurement may be carried out on a thin film integrated test element so as not to damage the rest of the thin film. The method allows non-destructive in-situ adhesion strength measurements for thin films and microelectronic devices.
    • 使用纳米压痕装置测量硬质薄膜与柔性基材的粘合强度。 可变增加的负载施加到压头。 压头尖以第一穿透速率渗入薄膜中,并使薄膜沉入基片中,从而在薄膜基底界面处产生拉伸应力。 在施加负载的临界值时,界面处的应力超过分层值,薄膜与基板部分分层。 这使得压头尖端以突然的第二次较高的穿透速率下沉到较软的基底中。 此时传感器检测施加的载荷和压头尖端的穿透深度。 计算机标记所施加的载荷的临界值,其对应于胶片分层点处的增加的穿透深度速率。 然后,计算机从所施加的负载的临界值计算分层所需的临界应力和膜与基板之间的粘附强度。 深度感测压痕技术测量可以在薄膜集成测试元件上进行,以免损坏薄膜的其余部分。 该方法允许薄膜和微电子器件的非破坏性原位粘附强度测量。