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    • 2. 发明授权
    • Termination circuits for reduced swing signal lines and methods for
operating same
    • 用于减少摆动信号线的终端电路及其操作方法
    • US5729152A
    • 1998-03-17
    • US549610
    • 1995-10-27
    • Wingyu LeungWinston LeeFu-Chieh Hsu
    • Wingyu LeungWinston LeeFu-Chieh Hsu
    • G11C11/41G06F3/00G06F12/16G06F13/16G06F13/40G11C7/00G11C11/401G11C11/407G11C11/417G11C29/00G11C29/04H04L25/02H03K17/16
    • H04L25/028G06F13/40G06F13/4072G06F13/4077H04L25/026H04L25/0292Y02B60/1228Y02B60/1235
    • A memory device which utilizes a plurality of memory modules coupled in parallel to a master I/O module through a single directional asymmetrical signal swing (DASS) bus. This structure provides an I/O scheme having symmetrical swing around half the supply voltage, high through-put, high data bandwidth, short access time, low latency and high noise immunity. The memory device utilizes improved column access circuitry including an improved address sequencing circuit and a data amplifier within each memory module. The memory device includes a resynchronization circuit which allows the device to operate either synchronously and asynchronously using the same pins. Each memory module has independent address and command decoders to enable independent operation. Thus, each memory module is activated by commands on the DASS bus only when a memory access operation is performed within the particular memory module. The memory device includes redundant memory modules to replace defective memory modules. Replacement can be carried out through commands on the DASS bus. The memory device can be configured to simultaneously write a single input data stream to multiple memory modules or to perform high-speed interleaved read and write operations. In one embodiment, multiple memory devices are coupled to a common, high-speed I/O bus without requiring large bus drivers and complex bus receivers in the memory modules.
    • 一种存储器件,其利用通过单向非对称信号摆幅(DASS)总线并联到主I / O模块的多个存储器模块。 这种结构提供了一个在电源电压的一半左右,高输入,高数据带宽,短访问时间,低延迟和高抗噪声的对称摆动的I / O方案。 存储器件利用改进的列存取电路,包括改进的地址排序电路和每个存储器模块内的数据放大器。 存储器件包括再同步电路,其允许器件使用相同的引脚同步和异步地操作。 每个存储器模块具有独立的地址和命令解码器,以实现独立操作。 因此,只有当在特定存储器模块内执行存储器访问操作时,每个存储器模块才被DASS总线上的命令激活。 存储器件包括用于替换有缺陷的存储器模块的冗余存储器模块。 可以通过DASS总线上的命令进行更换。 存储器件可被配置为将单个输入数据流同时写入多个存储器模块或执行高速交错读写操作。 在一个实施例中,多个存储器件耦合到公共的高速I / O总线,而不需要存储器模块中的大的总线驱动器和复杂的总线接收器。
    • 4. 发明授权
    • Data processing system with master and slave devices and asymmetric signal swing bus
    • 数据处理系统具有主从设备和不对称信号摆幅总线
    • US06272577B1
    • 2001-08-07
    • US08960951
    • 1997-10-30
    • Wingyu LeungWinston LeeFu-Chieh Hsu
    • Wingyu LeungWinston LeeFu-Chieh Hsu
    • G06F1300
    • H04L25/028G06F13/40G06F13/4072G06F13/4077H04L25/026H04L25/0292Y02D10/14Y02D10/151
    • A memory device which utilizes a plurality of memory modules coupled in parallel to a master I/O module through a single directional asymmetrical signal swing (DASS) bus. This structure provides an I/O scheme having symmetrical swing around half the supply voltage, high through-put, high data bandwidth, short access time, low latency and high noise immunity. The device utilizes improved column access circuitry including an improved address sequencing circuit and a data amplifier within each memory module. A resynchronization circuit allows the device to operate either synchronously and asynchronously using the same pins. Each memory module has independent address and command decoders to enable independent operation so that each memory module is activated by commands on the DASS bus only when a memory access operation is performed within the particular memory module. Redundant memory modules are included to replace defective memory modules, and replacement can be carried out through commands on the DASS bus. The memory device can be configured to simultaneously write a single input data stream to multiple memory modules or to perform high-speed interleaved read and write operations. In one embodiment, multiple memory devices are coupled to a common, high-speed I/O bus without requiring large bus drivers and complex bus receivers in the memory modules.
    • 一种存储器件,其利用通过单向非对称信号摆幅(DASS)总线并联到主I / O模块的多个存储器模块。 这种结构提供了一个在电源电压的一半左右,高输入,高数据带宽,短访问时间,低延迟和高抗噪声的对称摆动的I / O方案。 该器件利用改进的列存取电路,包括改进的地址排序电路和每个存储器模块内的数据放大器。 同步电路允许器件使用相同的引脚进行同步和异步操作。 每个存储器模块具有独立的地址和命令解码器,以实现独立操作,使得仅当在特定存储器模块内执行存储器访问操作时,每个存储器模块才被DASS总线上的命令激活。 包括冗余内存模块以替换有缺陷的内存模块,并可通过DASS总线上的命令进行更换。 存储器件可被配置为将单个输入数据流同时写入多个存储器模块或执行高速交错读写操作。 在一个实施例中,多个存储器件耦合到公共的高速I / O总线,而不需要存储器模块中的大的总线驱动器和复杂的总线接收器。
    • 5. 发明授权
    • Resynchronization circuit for a memory system and method of operating
same
    • 用于存储器系统的再同步电路及其操作方法
    • US5655113A
    • 1997-08-05
    • US270856
    • 1994-07-05
    • Wingyu LeungWinston LeeFu-Chieh Hsu
    • Wingyu LeungWinston LeeFu-Chieh Hsu
    • G11C11/41G06F3/00G06F12/16G06F13/16G06F13/40G11C7/00G11C11/401G11C11/407G11C11/417G11C29/00G11C29/04H04L25/02G06F13/00
    • H04L25/028G06F13/40G06F13/4072G06F13/4077H04L25/026H04L25/0292Y02B60/1228Y02B60/1235
    • A resynchronization circuit for processing a stream of data values read from a memory system, and a method of operating the same. The resynchronization circuit includes a first in, first out (FIFO) memory device, a phase locked loop circuit and a latency control circuit. The FIFO memory device receives a stream of data values and a first clock signal from the memory system. The data values are sequentially read into the FIFO memory device in response to the first clock signal. The phase locked loop circuit receives a second clock signal, and in response generates an output clock signal which leads in phase the second clock signal. The output clock signal is provided to the FIFO memory device to cause the data values to be sequentially read from the FIFO memory device. As a result, a stream of data values is generated which is synchronized with the second clock signal. The latency control circuit, which is coupled to the FIFO memory device, enables the data values to be read from the FIFO memory device after a selectable delay period which follows the initiation of the read operation from the memory system.
    • 一种用于处理从存储器系统读取的数据流流的再同步电路及其操作方法。 再同步电路包括先入先出(FIFO)存储器件,锁相环电路和等待时间控制电路。 FIFO存储器件从存储器系统接收数据流流和第一时钟信号。 响应于第一时钟信号,将数据值依次读入FIFO存储器件。 锁相环电路接收第二时钟信号,并且响应于产生一个使第二时钟信号同相引出的输出时钟信号。 将输出时钟信号提供给FIFO存储器件,以使数据值从FIFO存储器件顺序读取。 结果,产生与第二时钟信号同步的数据流流。 耦合到FIFO存储器件的等待时间控制电路使得能够在从存储器系统开始读取操作之后的可选延迟周期之后从FIFO存储器件读取数据值。
    • 6. 发明授权
    • Dynamic address mapping and redundancy in a modular memory device
    • 模块化存储设备中的动态地址映射和冗余
    • US06393504B1
    • 2002-05-21
    • US09493781
    • 2000-01-28
    • Wingyu LeungWinston LeeFu-Chieh Hsu
    • Wingyu LeungWinston LeeFu-Chieh Hsu
    • G06F1300
    • H04L25/028G06F13/40G06F13/4072G06F13/4077H04L25/026H04L25/0292Y02D10/14Y02D10/151
    • A memory device which utilizes a plurality of memory modules coupled in parallel to a master I/O module through a bus. Each memory module has independent address and command decoders to enable independent operation. Thus each memory module is activated by commands on the bus only when a memory access operation is performed within the particular memory module. Each memory module has a programmable identification register which stores a communication address of the module. The communication address for each module can be changed during operation of the memory device by a command from the bus. The memory device includes redundant memory modules to replace defective memory modules. Replacement can be carried out through commands on the bus.
    • 一种利用通过总线并联到主I / O模块的多个存储器模块的存储器件。 每个存储器模块具有独立的地址和命令解码器,以实现独立操作。 因此,只有当在特定存储器模块内执行存储器访问操作时,每个存储器模块才被总线上的命令激活。 每个存储器模块具有存储模块的通信地址的可编程标识寄存器。 通过总线的命令可以在存储器件的操作期间改变每个模块的通信地址。 存储器件包括用于替换有缺陷的存储器模块的冗余存储器模块。 可以通过总线上的命令进行更换。
    • 8. 发明授权
    • Transparent error correcting memory
    • 透明错误纠正内存
    • US07353438B2
    • 2008-04-01
    • US10645861
    • 2003-08-20
    • Wingyu LeungKit Sang TamMikolaj TworekFu-Chieh Hsu
    • Wingyu LeungKit Sang TamMikolaj TworekFu-Chieh Hsu
    • G11C29/00
    • G06F11/1048
    • A memory system with transparent error correction circuitry provides full stuck-at fault coverage for both test data patterns and the corresponding error correction code (ECC) values. The memory system includes a semiconductor memory having a memory array, a memory interface and an error detection/correction unit. The memory array is configured to store test data patterns and corresponding error correction code (ECC) values. The memory interface is configured such that the ECC values are not directly accessible. The error detection/correction unit is configured to correct single-bit errors in the test data patterns and corresponding ECC values. A set of test data patterns associated with the semiconductor memory is selected such that any multiple-bit error in a test data pattern and the corresponding ECC value causes the error detection/correction unit to provide an output data pattern having an error, thereby rendering multiple-bit faults 100% detectable.
    • 具有透明误差校正电路的存储器系统为测试数据模式和相应的纠错码(ECC)值提供完全卡住的故障覆盖。 存储器系统包括具有存储器阵列,存储器接口和错误检测/校正单元的半导体存储器。 存储器阵列被配置为存储测试数据模式和相应的纠错码(ECC)值。 存储器接口被配置为使得ECC值不能直接访问。 错误检测/校正单元被配置为校正测试数据模式中的单位错误和对应的ECC值。 选择与半导体存储器相关联的一组测试数据模式,使得测试数据模式中的任何多位错误和相应的ECC值导致错误检测/校正单元提供具有错误的输出数据模式,从而渲染多个 位错误100%可检测。
    • 9. 发明授权
    • High speed memory system
    • 高速存储系统
    • US07206913B2
    • 2007-04-17
    • US10927157
    • 2004-08-25
    • Fu-Chieh HsuWingyu Leung
    • Fu-Chieh HsuWingyu Leung
    • G06F12/00
    • G06F12/0893G06F12/0855G06F12/0879G06F12/0897G06F12/10G11C7/10G11C7/1018G11C7/1051G11C7/1069G11C7/1078G11C7/1096G11C11/406G11C11/4076G11C11/4096
    • A method and structure for implementing a DRAM memory array as a second level cache memory in a computer system. The computer system includes a central processing unit (CPU), a first level SRAM cache memory, a CPU bus coupled to the CPU, and second level cache memory which includes a DRAM array coupled to the CPU bus. When accessing the DRAM array, row access and column decoding operations are performed in a self-timed asynchronous manner. Predetermined sequences of column select operations are then performed in a synchronous manner with respect to a clock signal. A widened data path is provided to the DRAM array, effectively increasing the data rate of the DRAM array. By operating the DRAM array at a higher data rate than the CPU bus, additional time is provided for precharging the DRAM array. As a result, precharging of the DRAM array is transparent to the CPU bus.
    • 一种用于在计算机系统中实现DRAM存储器阵列作为第二级高速缓冲存储器的方法和结构。 计算机系统包括中央处理单元(CPU),第一级SRAM缓存存储器,耦合到CPU的CPU总线以及包括与CPU总线耦合的DRAM阵列的第二级高速缓冲存储器。 当访问DRAM阵列时,以自定时的异步方式执行行访问和列解码操作。 然后以相对于时钟信号的同步方式执行列选择操作的预定序列。 向DRAM阵列提供加宽的数据路径,有效地增加DRAM阵列的数据速率。 通过以比CPU总线更高的数据速率操作DRAM阵列,为DRAM阵列预充电提供了额外的时间。 因此,DRAM阵列的预充电对于CPU总线是透明的。
    • 10. 发明申请
    • High speed memory system
    • 高速存储系统
    • US20050027929A1
    • 2005-02-03
    • US10927157
    • 2004-08-25
    • Fu-Chieh HsuWingyu Leung
    • Fu-Chieh HsuWingyu Leung
    • G06F12/00G06F12/06G06F12/08
    • G06F12/0893G06F12/0855G06F12/0879G06F12/0897G06F12/10G11C7/10G11C7/1018G11C7/1051G11C7/1069G11C7/1078G11C7/1096G11C11/406G11C11/4076G11C11/4096
    • A method and structure for implementing a DRAM memory array as a second level cache memory in a computer system. The computer system includes a central processing unit (CPU), a first level SRAM cache memory, a CPU bus coupled to the CPU, and second level cache memory which includes a DRAM array coupled to the CPU bus. When accessing the DRAM array, row access and column decoding operations are performed in a self-timed asynchronous manner. Predetermined sequences of column select operations are then performed in a synchronous manner with respect to a clock signal. A widened data path is provided to the DRAM array, effectively increasing the data rate of the DRAM array. By operating the DRAM array at a higher data rate than the CPU bus, additional time is provided for precharging the DRAM array. As a result, precharging of the DRAM array is transparent to the CPU bus.
    • 一种用于在计算机系统中实现DRAM存储器阵列作为第二级高速缓冲存储器的方法和结构。 计算机系统包括中央处理单元(CPU),第一级SRAM缓存存储器,耦合到CPU的CPU总线以及包括与CPU总线耦合的DRAM阵列的第二级高速缓冲存储器。 当访问DRAM阵列时,以自定时的异步方式执行行访问和列解码操作。 然后以相对于时钟信号的同步方式执行列选择操作的预定序列。 向DRAM阵列提供加宽的数据路径,有效地增加了DRAM阵列的数据速率。 通过以比CPU总线更高的数据速率操作DRAM阵列,为DRAM阵列预充电提供了额外的时间。 因此,DRAM阵列的预充电对于CPU总线是透明的。