专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120133032A1 PACKAGE HAVING ESD AND EMI PREVENTING FUNCTIONS AND FABRICATION METHOD THEREOF 有权
标题翻译：具有ESD和EMI防护功能的封装及其制造方法
公开(公告)号：US20120133032A1
公开(公告)日：2012-05-31
申请号：US12987613
申请日：2011-01-10
申请人： Tsung-Hsien Tsai , Chih-Hsien Chiu , Hsin-Lung Chung , Chien-Cheng Lin
发明人： Tsung-Hsien Tsai , Chih-Hsien Chiu , Hsin-Lung Chung , Chien-Cheng Lin
IPC分类号： H01L23/552 , H01L21/78
CPC分类号： H01L21/4853 , H01L21/561 , H01L21/563 , H01L21/78 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01029 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/81 , H01L2224/19 , H01L2224/82 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.
摘要翻译：具有ESD（静电放电）和EMI（电磁干扰）防止功能的封装包括：具有接地结构和设置在其中的I / O结构的衬底单元; 至少一个半导体部件，设置在所述基板单元的表面上并电连接到所述接地结构和所述I / O结构; 覆盖所述基板单元和所述半导体部件的表面的密封剂; 以及金属层，其设置在基板单元的密封剂和侧表面的暴露表面上并与基底结构电绝缘，从而保护半导体部件免受ESD和EMI，从而提高产品产量并降低短路的风险。

2. 发明授权

US09111945B2 Package having ESD and EMI preventing functions and fabrication method thereof 有权
标题翻译：具有ESD和EMI防止功能的封装及其制造方法
公开(公告)号：US09111945B2
公开(公告)日：2015-08-18
申请号：US12987613
申请日：2011-01-10
申请人： Tsung-Hsien Tsai , Chih-Hsien Chiu , Hsin-Lung Chung , Chien-Cheng Lin
发明人： Tsung-Hsien Tsai , Chih-Hsien Chiu , Hsin-Lung Chung , Chien-Cheng Lin
IPC分类号： H01L23/552 , H01L23/00
CPC分类号： H01L21/4853 , H01L21/561 , H01L21/563 , H01L21/78 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01029 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/81 , H01L2224/19 , H01L2224/82 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.
摘要翻译：具有ESD（静电放电）和EMI（电磁干扰）防止功能的封装包括：具有接地结构和设置在其中的I / O结构的衬底单元; 至少一个半导体部件，设置在所述基板单元的表面上并电连接到所述接地结构和所述I / O结构; 覆盖所述基板单元和所述半导体部件的表面的密封剂; 以及金属层，其设置在基板单元的密封剂和侧表面的暴露表面上并与基底结构电绝缘，从而保护半导体部件免受ESD和EMI，从而提高产品产量并降低短路的风险。

3. 发明申请

US20120170162A1 SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20120170162A1
公开(公告)日：2012-07-05
申请号：US13053559
申请日：2011-03-22
申请人： Hao-Ju Fang , Hsin-Lung Chung , Kuang-Neng Chung , Chien-Cheng Lin , Heng-Cheng Chu
发明人： Hao-Ju Fang , Hsin-Lung Chung , Kuang-Neng Chung , Chien-Cheng Lin , Heng-Cheng Chu
IPC分类号： H02H9/04 , H01L21/56
CPC分类号： H01L23/60 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/48 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/48227 , H01L2924/00014 , H01L2924/3025 , H01L2924/3841 , H05K1/0259 , H05K3/3436 , Y02P70/613 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package is provided, which includes a substrate unit having conductive pads and ESD protection pads formed on a bottom surface thereof; an encapsulant covering a top surface of the substrate unit; and a metal layer disposed on a top surface of the encapsulant and having connecting extensions formed on side surfaces of the substrate unit and the encapsulant for electrically connecting the ESD protection pads, wherein portions of the side surfaces of the substrate unit corresponding in position to the conductive pads are exposed from the metal layer so as to ensure that solder bumps subsequently formed to connect the conductive pads of the semiconductor package to a circuit board are not in contact with the metal layer, thereby effectively avoiding the risk of short circuits.
摘要翻译：提供一种半导体封装，其包括具有形成在其底表面上的导电焊盘和ESD保护焊盘的衬底单元; 覆盖基板单元的顶表面的密封剂; 以及金属层，其设置在所述密封剂的顶表面上并且具有形成在所述基板单元和所述密封剂的侧表面上的连接延伸部，用于电连接所述ESD保护焊盘，其中所述基板单元的侧表面的部分对应于导电焊盘从金属层露出，以确保随后形成的将半导体封装的导电焊盘连接到电路板的焊料凸块不与金属层接触，从而有效地避免了短路的危险。

4. 发明授权

US09529709B2 Apparatuses for managing and accessing flash memory module 有权
标题翻译：用于管理和访问闪存模块的设备
公开(公告)号：US09529709B2
公开(公告)日：2016-12-27
申请号：US13113376
申请日：2011-05-23
申请人： Chi-Lung Wang , Chia-Hsin Chen , Chien-Cheng Lin
发明人： Chi-Lung Wang , Chia-Hsin Chen , Chien-Cheng Lin
IPC分类号： G06F12/00 , G06F12/02 , G06F12/10
CPC分类号： G06F12/0246 , G06F12/10 , G06F2212/7201
摘要： A method for maintaining address mapping for a flash memory module is disclosed including: recording a first set of addresses corresponding to a first set of sequential logical addresses in a first section of a first addressing block; recording a second set of addresses corresponding to a second set of sequential logical addresses in a second section of the first addressing block; recording a third set of addresses corresponding to a third set of sequential logical addresses in a first section of a second addressing block; and recording a fourth set of addresses corresponding to a fourth set of sequential logical addresses in a second section of the second addressing block; wherein the second set of logical addresses is successive to the first set of logical addresses, and the third set of logical addresses is successive to the second set of logical addresses.
摘要翻译：公开了一种用于维护闪存模块的地址映射的方法，包括：在第一寻址块的第一部分中记录对应于第一组顺序逻辑地址的第一组地址; 在第一寻址块的第二部分中记录对应于第二组顺序逻辑地址的第二组地址; 在第二寻址块的第一部分中记录对应于第三组顺序逻辑地址的第三组地址; 以及在所述第二寻址块的第二部分中记录与第四组顺序逻辑地址对应的第四组地址; 其中所述第二组逻辑地址连续到所述第一组逻辑地址，并且所述第三组逻辑地址连续到所述第二组逻辑地址。

5. 发明授权

US08275928B2 Memory module and method for performing wear-leveling of memory module using remapping, link, and spare area tables 有权
标题翻译：使用重新映射，链接和备用区表进行内存模块的磨损均衡的内存模块和方法
公开(公告)号：US08275928B2
公开(公告)日：2012-09-25
申请号：US12121108
申请日：2008-05-15
申请人： Chien-Cheng Lin
发明人： Chien-Cheng Lin
IPC分类号： G06F12/00
CPC分类号： G06F12/0246
摘要： The invention comprises a memory module capable of wear-leveling. In one embodiment, the memory module comprises a flash memory and a controller. The flash memory comprises a plurality of management units, wherein each of the management units comprises a plurality of blocks. The controller receives new data with a logical address managed by a first management unit selected from the management units, pops a first spare block from a spare area of the first management unit, determines whether an erase count of the first spare block is greater than a first threshold value, searches a second management unit selected from the management units for a replacing block with an erase count lower than a second threshold value when the erase count of the first spare block is greater than the first threshold value, and directs the first management unit and the second management unit to exchange the first spare block with the replacing block.
摘要翻译：本发明包括能够磨损平整的存储器模块。在一个实施例中，存储器模块包括闪速存储器和控制器。闪存包括多个管理单元，其中每个管理单元包括多个块。控制器接收具有由从管理单元选择的第一管理单元管理的逻辑地址的新数据，从第一管理单元的备用区弹出第一备用块，确定第一备用块的擦除次数是否大于第一阈值，当第一备用块的擦除次数大于第一阈值时，搜索从管理单元中选择的用于具有低于第二阈值的擦除次数的替换块的第二管理单元，并且指示第一管理单元和第二管理单元与替换块交换第一备用块。

6. 发明授权

US08179683B2 Display device 有权
标题翻译：显示设备
公开(公告)号：US08179683B2
公开(公告)日：2012-05-15
申请号：US12389381
申请日：2009-02-20
申请人： Huang-Pin Lin , Chien-Cheng Lin , Jian-Lin Chen , Kuan-Yu Chen , Yi-An Chien , Hung-Tsai Weng
发明人： Huang-Pin Lin , Chien-Cheng Lin , Jian-Lin Chen , Kuan-Yu Chen , Yi-An Chien , Hung-Tsai Weng
IPC分类号： G09G3/32
CPC分类号： G02F1/13452 , G02F1/133382 , G02F2001/133314
摘要： A display device includes a display panel, a flexible printed circuit and a back light module. The flexible printed circuit is suitable for supporting the driving element and is electrically connected to the display panel. The back light module includes at least one light source, a first frame and a second frame. The second frame surrounds the light source, the first frame surrounds the second frame, and the display panel and the flexible printed circuit are disposed at one side of the first frame, wherein the first frame has at least an opening, the second frame has a element contacting surface, the driving element is disposed on the flexible printed circuit, and the element contacting surface protrudes from the opening for being connected to the driving element.
摘要翻译：显示装置包括显示面板，柔性印刷电路和背光模块。柔性印刷电路适用于支撑驱动元件并与显示面板电连接。背光模块包括至少一个光源，第一框架和第二框架。第二框架围绕光源，第一框架围绕第二框架，并且显示面板和柔性印刷电路设置在第一框架的一侧，其中第一框架具有至少一个开口，第二框架具有元件接触表面，驱动元件设置在柔性印刷电路上，并且元件接触表面从开口突出以连接到驱动元件。

7. 发明申请

US20100214514A1 Optical diffusion device 有权
标题翻译：光扩散装置
公开(公告)号：US20100214514A1
公开(公告)日：2010-08-26
申请号：US11896932
申请日：2007-09-06
申请人： Chien-Cheng Lin , Jyh-Horng Wang , Chao-Ying Lin
发明人： Chien-Cheng Lin , Jyh-Horng Wang , Chao-Ying Lin
IPC分类号： G02F1/1335 , F21V11/00
CPC分类号： G02F1/133606 , G02F1/133604
摘要： An optical diffusion device applied in a backlight module includes a plate, multiple light sources being disposed on one side of the plate; multiple optical microstructure provided with a longer axis and a shorter axis being disposed on the plate; a direction of the longer axis of each optical microstructure being approximately arranged in parallel with a direction extending from the light source, or a direction of the shorter axis being arranged approximately crossing a direction extending from the light source; better diffusion effect being provided to each light source through the shorter axis of the optical microstructure to increase optical quantum among light sources thus to eliminate the dim and dark regions among light sources for increasing general luminance of the backlight module.
摘要翻译：应用在背光模块中的光扩散装置包括板，多个光源设置在板的一侧; 多个光学微结构具有较长的轴线和较短的轴线设置在该板上; 每个光学微结构的长轴的方向大致平行于从光源延伸的方向，或者短轴的方向大致与从光源延伸的方向相交; 通过光学微结构的较短轴向每个光源提供更好的扩散效果，以增加光源之间的光学量子，从而消除光源之间的暗暗区域以增加背光模块的一般亮度。

8. 外观设计

USD576646S1 Linear module 有权
标题翻译：线性模块
公开(公告)号：USD576646S1
公开(公告)日：2008-09-09
申请号：US29286636
申请日：2007-05-14
申请人： Li-Fen Liao , Chien-Cheng Lin
设计人： Li-Fen Liao , Chien-Cheng Lin

9. 发明授权

US08269912B2 Display device for preventing electromagnetic interference 有权
标题翻译：用于防止电磁干扰的显示装置
公开(公告)号：US08269912B2
公开(公告)日：2012-09-18
申请号：US12389382
申请日：2009-02-20
申请人： Huang-Pin Lin , Chien-Cheng Lin , Jian-Lin Chen , Kuan-Yu Chen , Yi-An Chien , Hung-Tsai Weng
发明人： Huang-Pin Lin , Chien-Cheng Lin , Jian-Lin Chen , Kuan-Yu Chen , Yi-An Chien , Hung-Tsai Weng
IPC分类号： G09G3/32
CPC分类号： G02F1/133382 , G02B6/0083 , G02B6/0088 , G02F1/13452 , G02F2001/133314
摘要： A display device includes a display panel, a back light module, a printed circuit board and a ground slice. The back light module includes a first frame, a second frame and a light source disposed between the first frame and the second frame. The first frame has a first side plate having an opening, and the second frame has a second side plate opposite to the first side plate. The printed circuit board includes a control circuit electrically connected to the display panel. The printed circuit board is disposed at a side of the back light module, and the control circuit is disposed at the outer side of the first side plate and the second side plate, such that the control circuit is opposite to the second side plate through the opening. The ground slice is connected between the control circuit and the second side plate through the opening.
摘要翻译：显示装置包括显示面板，背光模块，印刷电路板和接地片。背光模块包括设置在第一框架和第二框架之间的第一框架，第二框架和光源。第一框架具有具有开口的第一侧板，并且第二框架具有与第一侧板相对的第二侧板。印刷电路板包括电连接到显示面板的控制电路。印刷电路板设置在背光模块的一侧，并且控制电路设置在第一侧板和第二侧板的外侧，使得控制电路通过第二侧板与第二侧板相对开放接地片通过开口连接在控制电路和第二侧板之间。

10. 发明授权

US08145154B2 Approximation method for signal-to-noise ratio soft information for a communications system 有权
标题翻译：用于通信系统的信噪比软信息的近似方法
公开(公告)号：US08145154B2
公开(公告)日：2012-03-27
申请号：US12479838
申请日：2009-06-07
申请人： Yung-Szu Tu , Jiunn-Tsair Chen , Chun-Hsien Wen , Cheng-Hsuan Wu , Chien-Cheng Lin
发明人： Yung-Szu Tu , Jiunn-Tsair Chen , Chun-Hsien Wen , Cheng-Hsuan Wu , Chien-Cheng Lin
IPC分类号： H03C1/62 , H04B17/00
CPC分类号： H04B17/336 , H04L1/0003
摘要： An approximation method for SNR soft information for a transmitter of a communications system includes obtaining a conditional probability density function (PDF) corresponding to a response message of a transmitted packet, obtaining a PDF of a probability distribution model, and a mean and a variance of the PDF, by approximating the conditional PDF corresponding to the response message with the probability distribution model, and calculating a second mean and a second variance of a second PDF approximated to a conditional PDF of SNR corresponding to the transmitted packet according to the mean and the variance of the PDF, and a first mean and a first variance of a first PDF approximated to a conditional PDF of SNR corresponding to another transmitted packet immediately preceding the transmitted packet.
摘要翻译：用于通信系统的发射机的SNR软信息的近似方法包括获得与发送分组的响应消息相对应的条件概率密度函数（PDF），获得概率分布模型的PDF，以及平均和方差 PDF，通过近似具有概率分布模型的响应消息对应的条件PDF，并且根据平均值和平均值计算近似于与所发送的分组相对应的SNR的条件PDF的第二PDF的第二平均值和第二方差 PDF的方差，以及近似于紧邻发送的分组之前的另一发送分组的对应于条件的条件PDF的第一PDF的第一均值和第一方差。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式