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1. 发明授权

US09718941B2 Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board 有权
公开(公告)号：US09718941B2
公开(公告)日：2017-08-01
申请号：US14115306
申请日：2012-04-27
申请人： Takashi Matsuda , Mitsuyoshi Nishino , Kiyotaka Komori
发明人： Takashi Matsuda , Mitsuyoshi Nishino , Kiyotaka Komori
IPC分类号： C08K3/00 , H05K1/03 , B32B15/092 , C08L63/00 , C08J5/24 , C08K3/22 , C08K3/26
CPC分类号： C08K3/013 , B32B15/092 , B32B2264/102 , B32B2311/12 , B32B2363/00 , B32B2457/08 , C08J5/24 , C08J2363/00 , C08K3/22 , C08K3/26 , C08K2003/222 , C08K2003/2224 , C08K2003/2227 , C08K2003/265 , C08K2201/003 , C08K2201/005 , C08K2201/014 , C08L63/00 , H05K1/0366 , H05K1/0373 , H05K2201/0209 , H05K2201/0266 , Y10T442/20 , Y10T442/3431 , Y10T442/3472
摘要： Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D50) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D50) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.

2. 发明授权

US09730320B2 Prepreg, laminate, metal foil-clad laminate, circuit board and LED module 有权
公开(公告)号：US09730320B2
公开(公告)日：2017-08-08
申请号：US13882126
申请日：2011-10-27
申请人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
发明人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
IPC分类号： H05K1/03 , C08J5/24 , C08K3/00 , C08K3/22
CPC分类号： H05K1/038 , C08J5/24 , C08K3/013 , C08K3/22 , C08K2003/2217 , C08K2003/2227 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , Y10T442/20 , Y10T442/3415 , Y10T442/3472 , Y10T442/656 , Y10T442/659
摘要： A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

3. 发明授权

US08603624B2 Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting 有权
标题翻译：预浸料，层压板，金属复合层压板，电路板和LED安装电路板
公开(公告)号：US08603624B2
公开(公告)日：2013-12-10
申请号：US13510770
申请日：2010-10-29
申请人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
发明人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
IPC分类号： B32B15/00
CPC分类号： H05K1/0373 , B32B5/28 , B32B15/14 , C08G59/38 , C08G59/4021 , C08G59/621 , C08J5/24 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , H05K2201/0266 , Y10T428/24917 , Y10T428/24994 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/257 , Y10T442/20 , Y10T442/3455
摘要： Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.
摘要翻译：公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子，平均粒径（D50）为2〜15μm，并且含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自一组的无机成分（B）的配合比（体积比）勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

4. 发明申请

US20120228010A1 PREPREG, LAMINATE, METAL-FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR LED MOUNTING 有权
标题翻译： PREPREG，层压板，金属箔层压板，电路板和LED电路板电路板
公开(公告)号：US20120228010A1
公开(公告)日：2012-09-13
申请号：US13510770
申请日：2010-10-29
申请人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
发明人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
IPC分类号： H05K1/03 , B32B15/08 , B32B5/28
CPC分类号： H05K1/0373 , B32B5/28 , B32B15/14 , C08G59/38 , C08G59/4021 , C08G59/621 , C08J5/24 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , H05K2201/0266 , Y10T428/24917 , Y10T428/24994 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/257 , Y10T442/20 , Y10T442/3455
摘要： Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.
摘要翻译：公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子，具有2〜15μm的平均粒径（D50），含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自基团的无机成分（B）的配合比（体积比）勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

5. 发明申请

US20130215628A1 PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD AND LED MODULE 有权
标题翻译： PREPREG，层压板，金属箔层压板，电路板和LED模组
公开(公告)号：US20130215628A1
公开(公告)日：2013-08-22
申请号：US13882126
申请日：2011-10-27
申请人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
发明人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
IPC分类号： H05K1/03
CPC分类号： H05K1/038 , C08J5/24 , C08K3/013 , C08K3/22 , C08K2003/2217 , C08K2003/2227 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , Y10T442/20 , Y10T442/3415 , Y10T442/3472 , Y10T442/656 , Y10T442/659
摘要： A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.
摘要翻译：提供了具有优良的导热性，耐热性，钻孔加工性和阻燃性的层压材料。在通过用热固性树脂组合物浸渍织造或非织造布基材而获得的预浸料中，热固性树脂组合物每100体积份的热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）平均粒径（D50）为2〜15μm的三水铝矿型氢氧化铝粒子和（B）平均粒径（D50）为0.5〜15μm的氧化镁和三水铝矿型配合比（体积比）氢氧化铝粒子（A）与氧化镁（B）的摩尔比为1:0.3〜3。

6. 发明申请

US20140158406A1 PRINTED WIRING BOARD 有权
标题翻译：印刷线路板
公开(公告)号：US20140158406A1
公开(公告)日：2014-06-12
申请号：US14232595
申请日：2012-07-19
申请人： Hiroaki Kato , Kiyotaka Komori
发明人： Hiroaki Kato , Kiyotaka Komori
IPC分类号： H05K1/03
CPC分类号： H05K1/03 , H01P3/026 , H01P3/082 , H01P3/085 , H05K1/024 , H05K1/036 , H05K2201/029
摘要： An object of the present invention is to provide a printed wiring board which does not require arranging signal lines oblique to the warp or weft threads constituting a substrate and is capable of reducing a difference in transmission rates between the signal lines. The present invention relates to a printed wiring board including: an insulating layer; and a signal layer including a set of at least two signal lines and disposed on one side of the insulating layer. A substrate is embedded inside the insulating layer in such a manner to be further from the signal layer than a center of the insulating layer in a thickness direction of the insulating layer is. The insulating layer has a laminated structure of a thick layer, the substrate, and a thin layer. A ratio of a thickness of the thick layer to a thickness of the thin layer is greater than five.
摘要翻译：本发明的目的是提供一种印刷线路板，其不需要将信号线布置成构成基板的经线或纬线倾斜，并且能够减小信号线之间的传输速率的差异。印刷电路板技术领域本发明涉及一种印刷电路板，包括：绝缘层; 以及包括一组至少两条信号线并设置在绝缘层的一侧上的信号层。在绝缘层的内部，绝缘层的厚度方向的绝缘层的绝缘层的中心以外的信号层被埋设在绝缘层的内部。绝缘层具有厚层，基板和薄层的叠层结构。厚层的厚度与薄层的厚度之比大于5。

7. 发明授权

US06589656B2 Epoxy resin composition, prepreg and metal-clad laminate 有权
公开(公告)号：US06589656B2
公开(公告)日：2003-07-08
申请号：US09911545
申请日：2001-07-25
申请人： Tetsuya Maekawa , Takao Hayashi , Takeshi Yoshimura , Eiichiro Saito , Kiyotaka Komori
发明人： Tetsuya Maekawa , Takao Hayashi , Takeshi Yoshimura , Eiichiro Saito , Kiyotaka Komori
IPC分类号： B32B1508
CPC分类号： C08L71/126 , C08G65/48 , C08L63/00 , H05K1/0326 , Y10T428/31529 , C08L71/00
摘要： An epoxy resin composition of the invention comprises: an epoxy resin; a hardening agent; and a phenol-modified polyphenylene oxide having a number average molecular weight of 1000 to 4000, which is prepared by carried out a redistribution reaction between a polyphenylene oxide and a phenol compound in the presence of a reaction initiator which can be decomposed to generate an alcohol, a prepreg and a metal-clad laminate of the invention contain the epoxy resin composition.

8. 发明授权

US06403690B1 Flame retardant resin composition 失效
标题翻译：阻燃树脂组合物
公开(公告)号：US06403690B1
公开(公告)日：2002-06-11
申请号：US09450659
申请日：1999-11-30
申请人： Kiyotaka Komori , Keiko Kashihara , Kenji Ogasawara , Akiyoshi Nozue , Shigehiro Okada
发明人： Kiyotaka Komori , Keiko Kashihara , Kenji Ogasawara , Akiyoshi Nozue , Shigehiro Okada
IPC分类号： C08K310
CPC分类号： C08K5/5313 , C08K5/0066 , C08L61/00 , C08L63/00 , C08L39/04
摘要： A halogen-free flame retardant resin composition comprising a radically polymerizable resin which is modified with a phosphorus-containing compound of the formula (1): in which R is a hydrogen atom or a group of the formula: —(CH2)n—R1 in that R1 is a group derived from a compound having at least two phenolic hydroxyl groups or epoxy groups, and n is an integer of 0 to 3.
摘要翻译：一种无卤阻燃树脂组合物，其包含用式（1）的含磷化合物改性的自由基聚合性树脂：其中R是氢原子或下式的基团： - （CH 2）n -R 1 其中R1是衍生自具有至少两个酚羟基或环氧基的化合物，n是0至3的整数。

9. 发明授权

US09277646B2 Printed wiring board 有权
公开(公告)号：US09277646B2
公开(公告)日：2016-03-01
申请号：US14232595
申请日：2012-07-19
申请人： Hiroaki Kato , Kiyotaka Komori
发明人： Hiroaki Kato , Kiyotaka Komori
IPC分类号： H05K1/03 , H05K1/02
摘要： An object of the present invention is to provide a printed wiring board which does not require arranging signal lines oblique to the warp or weft threads constituting a substrate and is capable of reducing a difference in transmission rates between the signal lines. The present invention relates to a printed wiring board including: an insulating layer; and a signal layer including a set of at least two signal lines and disposed on one side of the insulating layer. A substrate is embedded inside the insulating layer in such a manner to be further from the signal layer than a center of the insulating layer in a thickness direction of the insulating layer is. The insulating layer has a laminated structure of a thick layer, the substrate, and a thin layer. A ratio of a thickness of the thick layer to a thickness of the thin layer is greater than five.

10. 发明授权

US5407872A Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material 失效
标题翻译：玻璃纤维形成组合物，由组合物获得的玻璃纤维和用于电路板的基板，包括玻璃纤维作为增强材料
公开(公告)号：US5407872A
公开(公告)日：1995-04-18
申请号：US148539
申请日：1993-11-08
申请人： Kiyotaka Komori , Seishiro Yamakawa , Shigeru Yamamoto , Jun Naka , Tadashi Kokubo
发明人： Kiyotaka Komori , Seishiro Yamakawa , Shigeru Yamamoto , Jun Naka , Tadashi Kokubo
IPC分类号： C03C13/00 , H05K1/03 , G03C13/02
CPC分类号： C03C3/097 , C03C13/00 , C03C3/091 , C03C3/102 , H05K1/0326 , H05K1/0366 , H05K1/0373 , H05K2201/0116 , H05K2201/0209
摘要： A glass fiber forming composition exhibits a remarkably high dielectric constant .epsilon..sub..GAMMA. as well as superior chemical resistance, yet it is readily spun into glass fibers. The composition is characterized to show a devitrification temperature which is lower than a spinning temperature at which the glass composition exhibits a viscosity of 10.sup.2.5 poise, so as to be readily spun into corresponding glass fibers. The composition consists essentially of 40 to 65 mol % of SiO.sub.2 ; 20 to 45 mol % of at least one component selected from the group consisting of MgO, CaO, SrO and BaO; 5 to 25 mol % of at least one component selected from the group consisting of TiO.sub.2 and ZrO.sub.2 ; and 0.5 to 15 mol % of NbO.sub.5/2 as calculated from an incorporated amount of Nb.sub.2 O.sub.5. Alternately, the composition consist essentially of 40 to 65 mol % of SiO.sub.2 ; 20 to 45 mol % of at least one component selected from the group consisting of CaO, SrO and BaO; 5 to 25 mol % of at least one component selected from the group consisting of TiO.sub.2 and ZrO.sub.2 ; 0.5 to 15 mol % of NbO.sub.5/2 as calculated from an incorporated amount of Nb.sub.2 O.sub.5 ; and 0.5 to 15 mol % of AlO.sub.3/2 as calculated from an incorporated amount of Al.sub.2 O.sub.3. The composition is also characterized to incorporate at least 85 mol % of a total amount of the oxides and have a dielectric constant [.epsilon..sub..GAMMA. ] of 9 or more at 1 MHz and 25.degree. C.
摘要翻译：玻璃纤维形成组合物显示出非常高的介电常数εGAMMA以及优异的耐化学性，但易于纺成玻璃纤维。该组合物的特征在于显示出低于玻璃组合物的粘度为102.5泊的纺丝温度的失透温度，以便容易地纺丝成相应的玻璃纤维。该组合物基本上由40至65mol％的SiO 2组成; 20〜45摩尔％的选自MgO，CaO，SrO和BaO的至少一种成分; 5〜25摩尔％的选自TiO 2和ZrO 2的至少一种成分; 和0.5〜15mol％的NbO 5/2，由Nb 2 O 5的掺入量计算。或者，组合物基本上由40至65mol％的SiO 2组成; 20〜45摩尔％的选自CaO，SrO和BaO的至少一种成分; 5〜25摩尔％的选自TiO 2和ZrO 2的至少一种成分; 由Nb 2 O 5的掺入量计算的NbO 5/2为0.5〜15摩尔％和由Al 2 O 3的掺入量计算的0.5〜15摩尔％的AlO 3/2。该组合物的特征还在于，在1MHz和25℃下，所含的氧化物总量至少为85mol％，其介电常数εε为9或更大。

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